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quality Ceramic Capacitors AIDE CAPACITOR 1206X7R223K631NT for Networking Communication and LCD Backlight Unit Power Supplies factory
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quality Ceramic Capacitors AIDE CAPACITOR 1206X7R223K631NT for Networking Communication and LCD Backlight Unit Power Supplies factory
>
Specifications
Voltage Rating:
630V
Capacitance:
22nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R223K631NT
Model Number:
1206X7R223K631NT
Package:
1206
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-reliability applications in medium and high-voltage circuits. They are ideal for coupling, wave filtering, and resonant functions, finding use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer robust construction with ceramic dielectric, inner and outer electrodes, and a nickel/tin termination layer, ensuring performance across a range of operating conditions.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Certifications: RoHS compliant, REACH compliant

Technical Specifications

Item Description/Specification Testing Method
Application Field
Coupling, wave filtering, resonant in high voltage circuits
Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps
Testing Conditions
Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC) 250 25, 251 250, 252 2500 (V)
6. Terminal Composition Au/Ag-Ni-Sn
7. Packing T Tape/Reel, P Bag packing(PE)
Construction
1 Ceramic dielectric
2 Inner electrode
3 Outer electrode
4 Nickle layer
5 Tin layer
Dimension (mm)
Part Number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method
Temperature -55~+125
Visual/Dimension 1. No Damage 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
Static Capacity Meet standard specification and tolerance See details in document
Dissipation Factor (DF) See details in document See details in document
IR Insulation Resistance See details in document See details in document
Hi-pot (DC) No dielectric breakdown or damage See details in document
Solderability soldering area90% See details in document
Resistance to the heat of soldering No damage, soldering area90% See details in document
Electrostatic capacity change rate NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% See details in document
Flexural strength No damage; Electro static capacity change rate C/C10% See details in document
Terminal bonding strength No visual damage Applied Force: 5N Duration: 101S
Thermal shock NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% See details in document
Temperature moisture exposure Visual No visual damage; Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: See details in document See details in document
High temperature exposure Visual No visual damage; Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: See details in document See details in document
PCB flexural strength No crack and other defect See details in document
Embossed Plastic Taping Dimensions (mm)
Code Tapesize A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max
Paper Tape Reel Packing Dimensions (mm)
Code Papersize W1 L1 D C B P1 P2 P0 d t
1005 0.240.02 0.450.02 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.30 Below
0201 0.370.10 0.670.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below
0402 0.650.10 1.150.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
Reel Dimensions (unit: mm)
Type A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
Taping Specification
Top tape peeling strength 0.1N < peeling strength < 0.7N No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity (Pcs)
Dimension Paper T/R Plastic T/R
0603 4000
0805 4000 3000 (T1.35mm)
1206 3000 (T>1.35mm)
1210 2000 (T1.60mm)
1808 3000 (T>1.60mm)
1812 2000
1812 1000 (T1.85mm)
1000 (T>1.85mm)
800
500
Precautions For Use
Soldering Profile To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph.
Manual Soldering Manual soldering can pose a great risk of creating thermal cracks. Handle soldering iron carefully and pay attention to tip selection and temperature.
Optimum Solder Amount for Reflow Soldering See details in document
Recommended Soldering Method See details in document
Soldering Temperature Profile While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-1206X7R223K631NT_C48579701.pdf

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