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Specifications
Voltage Rating:
250V
Capacitance:
220nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R224K251NT
Model Number:
1206X7R224K251NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Temperature Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description/Specification | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||||||
| Testing Conditions | ||||||||||
| Normal Condition | Temperature: 15~35 Humidity: 45~75%RH Atmosphere: 86~106kPa | (No special requirements) | ||||||||
| Relative Condition | Temperature: 252 Humidity: 60~70%RH Atmosphere: 86~106kPa | For data not matching testing specification | ||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | L*W (inch/mm) | ||||||||
| 2. Temperature Characteristic | C0G, X7R, X5R | |||||||||
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |||||||||
| 4. Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | |||||||||
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | (V) | ||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn | (From the inside out) | ||||||||
| 7. Packing | T (Tape/Reel), P (Bag packing) | |||||||||
| Construction | ||||||||||
| Item | Description | |||||||||
| 1 | Ceramic dielectric | |||||||||
| 2 | Inner electrode | |||||||||
| 3 | Outer electrode | |||||||||
| 4 | Nickle layer | |||||||||
| 5 | Tin layer | |||||||||
| Dimension (mm) | ||||||||||
| Part Number (British System) | Part Number (Metric System) | L | W | T | WB | |||||
| 0201 | 0603 | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||
| 0402 | 1005 | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||
| 0603 | 1608 | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||
| 0805 | 2012 | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||
| 1206 | 3216 | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||
| 1210 | 3225 | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||
| 1808 | 4520 | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||
| 1812 | 4532 | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||
| 1825 | 4563 | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||
| 2220 | 5750 | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||
| 2225 | 5763 | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||
| Specification and Testing Method | ||||||||||
| Item | Specification/Requirement | Testing method | ||||||||
| 1. Temperature | -55~+125 | |||||||||
| 2. Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||
| 3. Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||||||||
| 4. Dissipation Factor (DF) | NPO: DF0.56 (Cr5 pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr>1000pF) X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr>10uF) | ||||||||
| 5. IR Insulation Resistance | NPO: IR50000M (C10nF); IR*Cr500S (C>10nF) X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C>25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||
| 6. Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||
| 7. Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | ||||||||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||
| 9. Flexural strength | No damage. Electro static capacity change rate: C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | ||||||||
| 10. Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||
| 11. Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | ||||||||
| 12. Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | ||||||||
| 13. High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | ||||||||
| 14. PCB flexural strength | No crack and other defect. | IR Soldering the MLCC on the PCB. Then pressing direction base on the photo. | ||||||||
| Embossed Plastic Taping Dimensions (unit: mm) | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (unit: mm) | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | ||||||||||
| Type | A | B | C | D | E | F | G | |||
| 7' REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13' REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Taping Specification | ||||||||||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | (Paper Taping) | ||||||||
| No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (Embossed Taping) | |||||||||
| Packing Quantity (Pcs) | ||||||||||
| Dimension | Paper T/R | Plastic T/R | ||||||||
| 0603 | 4000 | - | ||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | - | 3000 (T1.60mm) / 2000 (T>1.60mm) | ||||||||
| 1210 | - | 1000 (T1.85mm) / 800 (T>1.85mm) | ||||||||
| 1812 | - | 500 | ||||||||
| Precautions For Use | ||||||||||
| Soldering Profile | Follow the temperature profile in the adjacent graph to avoid crack problems by sudden temperature change. | |||||||||
| Manual Soldering | Handle soldering iron carefully, pay attention to the selection of the soldering iron tip and temperature contact to avoid thermal cracks. | |||||||||
| Optimum Solder Amount for Reflow Soldering | Recommended | |||||||||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering | |||||||||
| Soldering Temperature Profile | Keep the temperature difference between soldering temperature and surface temperature of chips as T150 during preheating. | |||||||||
2509251626_AIDE-CAPACITOR-1206X7R224K251NT_C48579702.pdf
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