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Specifications
Voltage Rating:
1kV
Capacitance:
330pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R331K102NT
Model Number:
1206X7R331K102NT
Package:
1206
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. They are suitable for medium and high voltage MLCC applications.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power supplies, energy saving lamps. (Medium and High voltage MLCC) | ||
Testing Conditions
| |||
| Part Number Description | Item 1: Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | L*W (inch/mm) |
| Item 2: Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |
| Item 3: Nominal Electrostatic Capacity | 8R0 (8.0pF), 100 (10pF), 101 (100pF) | pF | |
| Item 4: Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | N/A | |
| Item 5: Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | V | |
| Item 6: Terminal Composition | Au/Ag-Ni-Sn | N/A | |
| Item 7: Packing | T (Tape/Reel), P (Bag packing) | N/A | |
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | N/A |
| Dimension (mm) | See table in source document for detailed dimensions per part number (e.g., 0201, 0402, etc.) | ||
| Specification and Testing Method | Temperature Range | -55~+125 | N/A |
| Visual/Dimension | No Damage, Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |
| Static Capacity | Meet standard specification and tolerance | See table in source document for NPO and X7R/X7T/X7P characteristics, frequency, and voltage. NPO: 1000pF (1MHz10%, 1.00.2Vrms); >1000pF (1KHz10%, 1.00.2Vrms) X7R/X7T/X7P: 10uF (1KHz10%, 1.00.2Vrms); >10uF (120Hz24, 0.50.1Vrms) | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 in source document. | See table in source document for frequency and voltage. NPO: 1000pF (1MHz10%, 1V0.2rms); >1000pF (1KHz10%, 1V0.2rms) X7R/X7T/X7P: 10uF (1KHz10%, 1V0.1rms); >10uF (120Hz24, 0.5V0.1rms) | |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Refer to NO#3 for initial capacitance testing. | |
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate: C/C10%. Flexural depth: 452. | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |
| Temperature Moisture Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |
| High Temperature Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on the photo in source document. See table for dimensions (A, B, C) per size (0805 to 2220). | |
| Taping and Reel Dimensions | Embossed Plastic Taping | Dimensions for 0805 to 1812 types (Tape size, A, B, C, D, E, F, G, H, J, T) | See table in source document. |
| Paper Tape Reel Packing | Dimensions for 1005, 0201, 0402, 0603, 0805, 1206 types (Paper size, W1, L1, D, C, B, P1, P2, P0, d, t, A, B, C, D, E, F, G, H, J, T) | See table in source document. | |
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0) | See table in source document for dimensions (A, B, C, D, E, F, G). | |
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N | Paper Taping Reel type, Embossed Taping Standard. | |
| Packing Quantity | See table in source document for quantities per size and tape type (Paper T/R, Plastic T/R). | N/A | |
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering | See table in source document for recommendations based on size, temperature characteristics, rated voltage, and capacitance. | |
Precautions For Use
MLCCs may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions, potentially resulting in burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering or factory for handling questions.
- Soldering Profile: Follow the temperature profile in the adjacent graph to avoid cracks from sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron tip and temperature.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
- Soldering Temperature Profile: During preheating, keep the temperature difference between soldering temperature and chip surface temperature T150.
2509251626_AIDE-CAPACITOR-1206X7R331K102NT_C48579706.pdf
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