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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 1210X7R222K202NT Ideal for AC DC and DC DC Power Chargers factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 1210X7R222K202NT Ideal for AC DC and DC DC Power Chargers factory
>
Specifications
Voltage Rating:
2kV
Capacitance:
2.2nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1210X7R222K202NT
Model Number:
1210X7R222K202NT
Package:
1210
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCC) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Certifications: RoHS compliant, REACH compliant

Technical Specifications

Item Description Specification
Dimension Code 0201 (0.02"x0.01" / 0.50x0.25 mm)
0402 (0.04"x0.02" / 1.00x0.50 mm)
0603 (0.06"x0.03" / 1.60x0.80 mm)
0805 (0.08"x0.05" / 2.00x1.25 mm)
1206 (0.12"x0.06" / 3.20x1.60 mm)
1210 (0.12"x0.10" / 3.20x2.50 mm)
1808 (0.18"x0.08" / 4.50x2.00 mm)
1812 (0.18"x0.12" / 4.50x3.20 mm)
1825 (0.18"x0.25" / 4.50x6.30 mm)
2211 (0.22"x0.11" / 5.70x2.8 mm)
2225 (0.22"x0.25" / 5.70x6.30 mm)
Temperature Characteristic C0G (030 PPM/)
X7R (15%)
X5R (15%)
Nominal Electrostatic Capacity 8R0 8.0 pF
100 10 pF
101 100 pF
Tolerance of Electrostatic Capacity B 0.1pF
C 0.25pF
D 0.5pF
F 1%
G 2%
J 5%
K 10%
M 20%
Z +80%/-20%
Rated Voltage (DC) 250 25V
251 250V
252 2500V
450/500/630V 1.5 x rated voltage
1KV Ur 2KV 1.2 x rated voltage
2KV < Ur 1.1 x rated voltage
Packing T Tape/Reel
P Bag packing (PE)
Dimensions (mm) Part Number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Temperature Range -55 ~ +125
Testing Condition: Normal Temperature 15~35
Humidity 45~75%RH
Atmosphere 86~106kPa
Testing Condition: Relative Temperature 252
Humidity 60~70%RH
Atmosphere 86~106kPa

Testing Specifications

No. Item Specification/Requirement Testing Method
1 Temperature -55~+125
2 Visual/Dimension 1. No Damage 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
3 Static Capacity Meet standard specification and tolerance
NPO characteristic: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms
X7R/X7T/X7P characteristic: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms
4 Dissipation Factor (DF) NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms.
X7R/X7T/X7P characteristic: Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. (See Note 1)
5 IR Insulation Resistance NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF
6 Hi-pot (DC) No dielectric breakdown or damage Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S
7 Solderability Soldering area 90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
8 Resistance to the heat of soldering No visual damage, soldering area 90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9 Electrostatic Capacity Change Rate NPO Characteristic: C/C0.5% or 0.5pF (larger reading) Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature.
X7R: C/C15%
X7T: -33% C/C22%
X7P: C/C10%
10 Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
11 Thermal Shock NPO Characteristic: C/C2.5% or 0.25pF (larger reading) Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
X7R/X7P characteristic: C/C0.5%
X7T characteristic: C/C10%
12 Temperature Moisture Exposure Visual: No visual damage Test after place 242 hours normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 50024 hours.
Electrostatic Capacitance Change Rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%
IR: NPO characteristic: IR2500M or IR*Cr25S (lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (lower reading)
13 High Temperature Exposure Visual: No visual damage Test after place 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage).
Electrostatic Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%
IR: NPO: IR4000M or IR*Cr40S (lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (lower reading)
14 PCB Flexural Strength No crack and other defect IR Soldering the MLCC on the PCB, then pressing direction based on the photo. Electro static capacity change rate C/C10%

Packing Specifications

Type Code Tape Size (mm) A B C D E F G H J T
Embossed Plastic Taping 0805 T 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 T 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 T 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 T 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 T 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max
Paper Tape Reel Packing 1005, 0201, 0402 W1: 0.240.02 / 0.370.10 / 0.650.10 L1: 0.450.02 / 0.670.10 / 1.150.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.30 Below / 0.80 Below / 0.80 Below
0603, 0805, 1206 A: 1.100.10 / 1.450.15 / 1.800.20 B: 1.900.10 / 2.300.15 / 3.400.20 8.000.10 / 8.00.15 / 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max / 1.10 Max / 1.10 Max
Reel Dimensions A: 1782.0 / 3302.0 B: 3.0 C: 130.5 D: 210.5 E: 21 or Bigger F: 1010.5 G: 12max
Packing Quantity 0603 Paper T/R (Pcs) 4000
0805 Paper T/R (Pcs) 4000 Plastic T/R (Pcs) 3000
1206 Paper T/R (Pcs) 4000 Plastic T/R (Pcs) T1.35mm: 3000 / T1.35mm: 2000
1210 Plastic T/R (Pcs) T1.60mm: 3000 / T1.60mm: 2000
1808 Plastic T/R (Pcs) 1000
1812 Plastic T/R (Pcs) T1.85mm: 1000 / T1.85mm: 800
1812 Plastic T/R (Pcs) 500

Precautions for Use

Multi-Layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burn out, flaming, or glowing in the worst case. Please consider the following precautions for safety and application notes. Contact the engineering section or factory for handling precautions.

  • Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
  • Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron, tip selection, and temperature contact.
  • Optimum Solder Amount for Reflow Soldering
  • Recommended Soldering Amounts

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf: R; C1uf: R/W
Y5V / C1uf: R; C1uf: R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf: R; C4.7uf: R/W
Y5V / C1uf: R; C1uf: R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf: R; C10uf: R/W
Y5V / C10uf: R; C10uf: R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering Method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile

During preheating, maintain the temperature difference between soldering temperature and surface temperature of chips as T 150.


2509251626_AIDE-CAPACITOR-1210X7R222K202NT_C48579731.pdf

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