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quality High voltage multi layer ceramic capacitor AIDE CAPACITOR 1808X7R101K502NT for power supply circuits factory
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quality High voltage multi layer ceramic capacitor AIDE CAPACITOR 1808X7R101K502NT for power supply circuits factory
>
Specifications
Voltage Rating:
5kV
Capacitance:
100pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1808X7R101K502NT
Model Number:
1808X7R101K502NT
Package:
1808
Key Attributes
Product Description

Product Overview

This product is a high-voltage Multi-Layer Ceramic Capacitor (MLCC) designed for applications such as coupling, wave filtering, and resonance in high-voltage circuits. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • RoHS/REACH Compliance: Meets standards

Technical Specifications

Item Description/Specification Testing Method
Application Field
Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC).
Testing Conditions
Normal Condition Temperature: 15~35
Humidity: 45~75%RH
Normal atmosphere: 86~106kPa
Relative Condition Temperature: 252
Humidity: 60~70%RH
Atmosphere: 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code 0201 (0.02*0.01 inch / 0.50*0.25 mm)
0402 (0.04*0.02 inch / 1.00*0.50 mm)
0603 (0.06*0.03 inch / 1.60*0.80 mm)
0805 (0.08*0.05 inch / 2.00*1.25 mm)
1206 (0.12*0.06 inch / 3.20*1.60 mm)
1210 (0.12*0.10 inch / 3.20*2.50 mm)
1808 (0.18*0.08 inch / 4.50*2.00 mm)
1812 (0.18*0.12 inch / 4.50*3.20 mm)
1825 (0.18*0.25 inch / 4.50*6.30 mm)
2211 (0.22*0.11 inch / 5.70*2.8 mm)
2225 (0.22*0.25 inch / 5.70*6.30 mm)
2. Temperature Characteristic C0G (030 PPM/)
X7R (15%)
X5R (15%)
3. Nominal Electrostatic Capacity 8R0 = 8.0 pF
100 = 10 pF
101 = 100 pF
4. Tolerance of Electrostatic Capacity B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20%
5. Rated Voltage (DC) 250 = 25V
251 = 250V
252 = 2500V
6. Terminal Composition Au/Ag-Ni-Sn (From the inside out)
7. Packing T: Tape/Reel
P: Bag packing (PE)
Construction and Dimension
Construction 1. Ceramic dielectric
2. Inner electrode
3. Outer electrode
4. Nickel layer
5. Tin layer
Dimension (mm) Part number | L | W | T | WB
0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05
0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10
0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10
0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20
1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30
1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 0.800.30
1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 0.800.30
1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 0.800.30
1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 0.800.30
2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 1.000.40
2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 1.000.40
Specification and Testing Method
Temperature -55~+125
Visual/Dimension 1. No Damage
2. Dimension meet Spec
Naked eye (Visual inspection)
Digital calliper
Static Capacity Meet standard specification and tolerance NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF)
X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF)
Dissipation Factor (DF) NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr)
X7R/X7T/X7P: See Note 1
NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF)
X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF)
IR Insulation Resistance NPO: IR50000M (C10nF); IR*Cr500S (C10nF)
X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C25nF)
Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) No dielectric breakdown or damage Ur=100V,...2.5 x rated voltage; Ur=200V/250V,...2.0 x rated voltage; Ur=450/500/630V,...1.5 x rated voltage; 1KVUr2KV,...1.2 x rated voltage; 2KVUr,...1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area 90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
Resistance to the heat of soldering No damage, soldering area 90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic Capacity Change Rate NPO: C/C0.5% or 0.5pF (larger reading)
X7R: C/C15%
X7T: -33% C/C22%
X7P: C/C10%
Flexural Strength No damage Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock NPO: C/C2.5% or 0.25pF (larger reading)
X7R/X7P: C/C0.5%
X7T: C/C10%
Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
Temperature Moisture Exposure Visual: No visual damage.
Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%.
DF: 2 times initial standard.
IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading).
Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after place 242 hours normal temp & humidity.
High Temperature Exposure Visual: No visual damage.
Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%.
DF: 2 X initial standard.
IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading).
Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage); 250VV1KV (1.5x rated voltage); 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature.
PCB Flexural Strength No crack and other defect Soldering the MLCC on the PCB, then pressing direction based on the photo. IR measurement.
Embossed Plastic Taping Dimensions (mm)
Code Tape size A, B, C, D, E, F, G, H, J, T
0805 1.550.20, 2.350.20, 8.000.20, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10, 1.50 Max
1206 1.950.20, 3.600.20, 8.000.20, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.1, 1.50 -0/+0.10, 1.85 Max
1210 2.700.10, 3.420.10, 8.000.10, 3.500.05, 1.750.10, 4.000.10, 2.000.05, 4.000.10, 1.55 -0/+0.10, 3.2 Max
1808 2.200.10, 4.950.10, 12.000.10, 5.500.05, 1.750.10, 4.000.10, 2.000.05, 4.000.10, 1.50 -0/+0.10, 3.0 Max
1812 3.660.10, 4.950.10, 12.000.10, 5.500.05, 1.750.10, 8.000.10, 2.000.05, 4.000.10, 1.55 -0/+0.10, 4.0 Max
Paper Tape Reel Packing Dimensions (mm)
Code Paper size W1, L1, D, C, B, P1, P2, P0, d, t
1005 0.240.02, 0.450.02, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10, 0.30 Below
0201 0.370.10, 0.670.10, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10, 0.80 Below
0402 0.650.10, 1.150.10, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10, 0.80 Below
0603 1.100.10, 1.900.10, 8.000.10, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10, 1.10 Max
0805 1.450.15, 2.300.15, 8.00.15, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10, 1.10 Max
1206 1.800.20, 3.400.20, 8.000.20, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10, 1.10 Max
Reel Dimensions (mm)
Unit 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
Taping Specification
Top tape peeling strength 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. (a) Paper Taping
(b) Embossed Taping
Packing Quantity
Dimension Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000
0805 4000 3000 (T1.35mm)
1206 3000 (T>1.35mm)
1210 2000 (T1.60mm)
1808 3000 (T>1.60mm)
1812 2000
1812 above 1000 (T1.85mm)
1000 (T>1.85mm)
800
500
Recommended Soldering Method
Size Temperature Characteristics Capacitance Soldering Method
1005 NPO / X7R/X5R/X7S/X6S / R
0201 NPO / X7R/X5R/X7S/X6S / Y5V / R
0402 NPO / X7R/X5R/X7S/X6S / Y5V / R
0603 NPO / X7R/X5R/X7S/X6S / Y5V / C1uf R / C1uf R/W R/W
0805 NPO / X7R/X5R/X7S/X6S / Y5V / C4.7uf R / C4.7uf R/W (X7R/X5R/X7S/X6S)
/ C1uf R / C1uf R/W (Y5V)
R/W
1206 NPO / X7R/X5R/X7S/X6S / Y5V / C10uf R / C10uf R/W R/W
1210 NPO / X7R/X5R/X7S/X6S / Y5V / R

Note: RReflow Soldering, WWave Soldering

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent issues like burn out, flaming, or glowing, adhere to the following precautions and application notes. For handling questions, contact the engineering section or factory.

  • Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
  • Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is handled carefully, and pay attention to tip selection and temperature.
  • Optimum Solder Amount for Reflow Soldering
  • Recommended Soldering amounts

Soldering Temperature Profile: Keep the temperature difference between soldering temperature and chip surface temperature T 150 during preheating.


2509251626_AIDE-CAPACITOR-1808X7R101K502NT_C48579735.pdf

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