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Specifications
Voltage Rating:
50V
Capacitance:
20pF
Temperature Coefficient:
C0G
Tolerance:
±10%
Mfr. Part #:
0603C0G200K500NT
Model Number:
0603C0G200K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in a range of standard sizes and temperature characteristics, ensuring reliable performance across different operating conditions.
Product Attributes
- Temperature Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Compliance: ROHS/REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | Item | Description | Example |
| 1. Dimension Code | Size (inch/mm) | 0201 (0.02*0.01 / 0.50*0.25) to 2225 (0.22*0.25 / 5.70*6.30) | |
| 2. Temperature Characteristic | Dielectric Type | C0G, X7R, X5R | |
| 3. Nominal Electrostatic Capacity | Capacity in pF | 8R0 (8.0pF), 100 (10pF), 101 (100pF) | |
| 4. Tolerance of Electrostatic Capacity | Tolerance | B (0.1pF) to Z (+80%/-20%) | |
| 5. Rated Voltage (DC) | Voltage in V | 250 (25V), 251 (250V), 252 (2500V) | |
| Construction | Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | - | - |
| Dimension (mm): | L, W, T, WB values vary by code (e.g., 0201: 0.600.10 L, 0.300.05 W, 0.300.05 T, 0.100.05 WB) | Digital Caliper | |
| Specifications & Testing Methods | Temperature | -55~+125 | - |
| Visual/Dimension | No Damage, Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |
| Static Capacity | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | Frequency and Voltage dependent (e.g., 1MHz10% @ 1.00.2Vrms for NPO 1000pF) | |
| Dissipation Factor (DF) | Varies by characteristic and capacitance (e.g., NPO: DF0.56 for Cr5pF; X7R/X7T/X7P: see Note 1) | Frequency and Voltage dependent | |
| Insulation Resistance (IR) | NPO: IR50000M or IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M or IR*Cr100S (C25nF) | Rated voltage, 605s, Humidity: 75%, Temperature: 255 | |
| Hi-pot (DC) | 2.5 x rated voltage (Ur=100V), 2.0 x rated voltage (Ur=200V/250V), etc. | Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area 90%, No Damage | Pre-heating: 80-120 (10-30s), Soldering temp: 2455 (20.5s) | |
| Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating: 100-200 (102s), Soldering temp: 2655 (51s) | |
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF; X7R: 15%; X7T: -33% to 22%; X7P: 10% | Pre-heating 150 (1 hour), then 48 hours at normal conditions. | |
| Flexural Strength | No damage, Electrostatic capacity change rate 10% | Base board: Al2O3/PCB, Flexural depth: 1mm, Bend speed: 0.5mm/sec | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: 10% | 5 cycles, tested after 242 hours at normal temp & humidity. | |
| Temperature Moisture Exposure | Visual: No visual damage; Capacity Change: NPO 2%; X7R/X7T/X7P 10% | 402, 90~95%RH, 50024 hours. | |
| High Temperature Exposure | Visual: No visual damage; Capacity Change: NPO 2%; X7R/X7T/X7P 20% | 1253, 100048 hours, Voltage dependent (e.g., 2x Rated voltage for 100VV250V) | |
| PCB Flexural Strength | No crack and other defect | Soldering MLCC on PCB, pressing direction based on provided diagrams. | |
| Taping Specification | Embossed Plastic Taping: Reel packing for 0805(2012) ~ 1812(4532) type. Dimensions A, B, C, etc. provided. | - | - |
| Paper Tape Reel Packing: For 1005(0402) ~ 1206(3216) types. Dimensions W1, L1, D, etc. provided. | - | - | |
| Packing Quantity | Paper T/R (Pcs): 4000 (0603, 0805, 1206); Plastic T/R (Pcs): 3000 (0805, 1206) and varies by thickness. | - | - |
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress exceeding specified ratings. To prevent issues like burnout or flaming, adhere to the following precautions and application notes. Contact engineering for handling questions.
- Soldering Profile: Follow the provided temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering Method: R (Reflow Soldering), W (Wave Soldering)
- Soldering Temperature Profile: Maintain temperature difference T150 between soldering temperature and chip surface temperature during preheating.
2509251626_AIDE-CAPACITOR-0603C0G200K500NT_C49326306.pdf
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