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Specifications
Voltage Rating:
50V
Capacitance:
27pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G270J500NT
Model Number:
0603C0G270J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving critical roles in coupling, wave filtering, and resonance within power supplies and communication interfaces. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, ensuring reliable performance across a range of demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, such as switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Testing Conditions: Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 2. Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature characteristic Nominal electrostatic capacity Tolerance of electrostatic capacity Rated voltage(DC) Terminal composition Packing | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3. Dimension Codes | Inch System: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 Metric System (mm): 0502, 1005, 1608, 2012, 3216, 3225, 4520, 4532, 4563, 5750, 5763 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 4. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 6. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7. Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 8. Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickle layer, 5 Tin layer | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 9. Dimensions (mm) |
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| 10. Temperature Range | -55~+125 | Naked eye (Visual inspection), Digital calliper | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 11. Static Capacity | Meet standard specification and tolerance |
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| 12. Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms; Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms. X7R/X7T/X7P characteristic: Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms; Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms. (See Note 1 for exceptions) | See Note 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 13. Insulation Resistance (IR) | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 14. Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies based on rated voltage (Ur): 100V: 2.5x Ur; 200V/250V: 2.0x Ur; 450/500/630V: 1.5x Ur; 1KVUr2KV: 1.2x Ur; 2KVUr: 1.1x Ur. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 15. Solderability | Soldering area90%. No damage. | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 16. Resistance to the heat of soldering | No visual damage, soldering area90%. | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 17. Electrostatic Capacity Change Rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 18. Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electrostatic capacity change rate: C/C10%. Flexural depth: 452 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 19. Terminal Bonding Strength | No visual damage. | Applied Force: 5N, Duration: 101S | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 20. Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P characteristic: C/C0.5% X7T characteristic: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 21. Temperature Moisture Exposure | Visual: No visual damage. Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 22. High Temperature Exposure | Visual: No visual damage. Capacitance Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Charging and discharging current 50mA Max. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 23. PCB Flexural Strength | No crack and other defect. | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24. Embossed Plastic Taping | Details of tape dimensions (A, B, C, D, E, F, G, H, J, T) provided for sizes 0805 to 1812. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25. Paper Tape Reel Packing | Details of tape dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) provided for sizes 1005, 0201, 0402, 0603, 0805, 1206. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 26. Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 27. Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | (a) Paper Taping, (b) Embossed Taping | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 28. Packing Quantity | Quantities vary by size and tape type (Paper T/R, Plastic T/R). Examples: 0603 Paper T/R (4000 Pcs), 0805 Plastic T/R (3000 Pcs). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 29. Soldering Method | RReflow Soldering, WWave Soldering. Recommended methods provided for various sizes and capacitance values. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 30. Soldering Profile | To avoid crack problems by sudden temperature change, follow the temperature profile in the adjacent graph. Keep temperature difference between soldering temperature and surface temperature of chips as T150. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Note 1: X7R/X5R/X6S/X7S Y5V Rated vol. DF Exception of D.F. details provided in the original document.
Note: NO3, 11, 12, 13 initial capacitance testing: Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature.
Precautions for Use: MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. Follow safety precautions and application notes. Contact engineering for handling questions.
2509251626_AIDE-CAPACITOR-0603C0G270J500NT_C49326314.pdf
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