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Specifications
Voltage Rating:
50V
Capacitance:
39pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G390J500NT
Model Number:
0603C0G390J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Compliance: RoHS/REACH
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |
|---|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, such as switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||
| Testing Conditions: Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| 3. Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing | |||
| Dimension Codes (L*W) | Inch | mm | ||
| 0201 | 0.02*0.01 | 0.50*0.25 | ||
| 0402 | 0.04*0.02 | 1.00*0.50 | ||
| 0603 | 0.06*0.03 | 1.60*0.80 | ||
| 0805 | 0.08*0.05 | 2.00*1.25 | ||
| 1206 | 0.12*0.06 | 3.20*1.60 | ||
| 1210 | 0.12*0.10 | 3.20*2.50 | ||
| 1808 | 0.18*0.08 | 4.50*2.00 | ||
| 1812 | 0.18*0.12 | 4.50*3.20 | ||
| 1825 | 0.18*0.25 | 4.50*6.30 | ||
| 2211 | 0.22*0.11 | 5.70*2.8 | ||
| 2225 | 0.22*0.25 | 5.70*6.30 | ||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||
| Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||
| Packing | T: Tape/Reel, P: Bag packing (PE) | |||
| 4. Construction | 1. Ceramic dielectric | |||
| 2. Inner electrode | ||||
| 3. Outer electrode | ||||
| 4. Nickle layer | ||||
| 5. Tin layer | ||||
| 4. Dimension | Part number | Dimension (mm) | WB | |
| British system | Metric system | |||
| 0201 | 0.600.10 (L) x 0.300.05 (W) x 0.300.05 (T) | 0.100.05 | ||
| 0402 | 1.000.15 (L) x 0.500.15 (W) x 0.500.10 (T) | 0.200.10 | ||
| 0603 | 1.600.20 (L) x 0.800.15 (W) x 0.800.15 (T) | 0.300.10 | ||
| 0805 | 2.000.20 (L) x 1.250.20 (W) x 0.800.20 (T) | 0.500.20 | ||
| 1206 | 3.200.30 (L) x 1.600.30 (W) x 1.000.20 (T) | 0.600.30 | ||
| 1210 | 3.200.30 (L) x 2.500.30 (W) 2.70 (T) | 0.800.30 | ||
| 1808 | 4.500.40 (L) x 2.000.20 (W) 2.70 (T) | 0.800.30 | ||
| 1812 | 4.500.40 (L) x 3.200.30 (W) 3.50 (T) | 0.800.30 | ||
| 1825 | 4.500.40 (L) x 6.300.50 (W) 3.50 (T) | 0.800.30 | ||
| 2220 | 5.700.50 (L) x 5.000.50 (W) 3.50 (T) | 1.000.40 | ||
| 2225 | 5.700.50 (L) x 6.300.50 (W) 6.20 (T) | 1.000.40 | ||
| 5. Specification and Testing Method | Temperature | -55~+125 | ||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||
| Static Capacity | Meet standard specification and tolerance | NPO: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | ||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. | ||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Testing Condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | DF Refer to NO#4, IR Refer to NO#5 | ||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate: C/C10%. Flexural depth: 452 | ||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||
| Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | ||
| Temperature moisture exposure | Visual: No visual damage Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | ||
| High temperature exposure | Visual: No visual damage Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. Test after place 48 hours under normal pressure & temperature. | ||
| PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. | ||
| 6 EMBOSSED PLASTIC TAPING | EMBOSSED TAPING | Embossed tape reel packing for 0805(2012)~1812(4532) type | ||
| Paper tape reel packing for 10050402~12063216 | ||||
| Structure of leader part and end part of the carrier paper | ||||
| Reel Dimensions | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |||
| Taping specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||
| Packing quantity | See table in original document | |||
| 7. ROHS/REACH compliance | RoHS | meet the standard | ||
| REACH | meet the standard | |||
| 8 Precautions For Use | MLCCs may fail in short circuit mode under severe electrical/mechanical stress beyond ratings, potentially causing burnout, flaming, or glowing. Follow safety precautions and application notes. Contact engineering for handling questions. | |||
| Soldering Profile | Avoid cracks from sudden temperature change; follow the temperature profile in the adjacent graph. | |||
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature. | |||
| Optimum Solder Amount for Reflow Soldering | Recommended in the original document. | |||
| Recommended Soldering amounts | See table in original document. | |||
| 9 Recommended Soldering Method | See table in original document, detailing methods (R-Reflow, W-Wave) based on size, characteristics, voltage, and capacitance. | |||
| 10 The temperature profile for soldering | Preheating: Keep temperature difference between soldering temperature and surface temperature of chips as T150. | |||
2509251626_AIDE-CAPACITOR-0603C0G390J500NT_C49326324.pdf
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