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Specifications
Voltage Rating:
50V
Capacitance:
68pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G680J500NT
Model Number:
0603C0G680J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- Certifications: RoHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |
| Testing Conditions | Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A |
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (pF) Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) Rated Voltage (DC) (V) Terminal Composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag packing) | |
| Dimension Codes & Sizes | Inch System: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 Metric System (mm): 0603, 1005, 1608, 2012, 3216, 3225, 4520, 4532, 4563, 5750, 5763 | |
| Dimensions (mm) | 0201 (0603): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 0402 (1005): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 0603 (1608): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10, (T 0.600.10) 0805 (2012): L 2.000.20, W 1.250.20, T 0.800.20, WB 0.500.20, (T 1.000.20, WB 0.800.20) 1206 (3216): L 3.200.30, W 1.600.30, T 1.000.20, WB 0.600.30, (T 1.250.20, WB 1.600.30) 1210 (3225): L 3.200.30, W 2.500.30, T 2.70, WB 0.800.30, (T 1.250.20, WB 1.600.30) 1808 (4520): L 4.500.40, W 2.000.20, T 2.70, WB 0.800.30 1812 (4532): L 4.500.40, W 3.200.30, T 3.50, WB 0.800.30 1825 (4563): L 4.500.40, W 6.300.50, T 3.50, WB 0.800.30 2220 (5750): L 5.700.50, W 5.000.50, T 3.50, WB 1.000.40 2225 (5763): L 5.700.50, W 6.300.50, T 6.20, WB 1.000.40 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%), X7T, X7P, Y5V, X7S, X6S | N/A |
| Temperature Range | -55~+125 | N/A |
| Static Capacity Tolerance | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A |
| Dissipation Factor (DF) | Refer to Note 1 for specific values based on rated voltage, capacitance, and size. | Refer to Item 4 in Specification and Testing Method. |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF) X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90%, No Damage | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Refer to Item 9 in Specification and Testing Method. |
| Flexural Strength | No damage. Electrostatic capacity change rate: C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | 5 cycles of thermal shock. Test after 242 hours at normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours at normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect. | Soldering the MLCC on the PCB, then pressing. Dimensions A, B, C provided for various sizes (0805 to 2220). |
| Packing (Taping) | Embossed Plastic Taping: For 0805(2012) to 1812(4532) types. Detailed tape dimensions (A, B, C, D, E, F, G, H, J) provided. Paper Tape Reel Packing: For 1005(0402) to 1206(3216) types. Detailed tape dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) provided for different sizes. Reel Dimensions: 7' REEL (1782.0), 13' REEL (3302.0). | Refer to Page 8, 9, 10 for detailed specifications. |
| Packing Quantity | Paper T/R (Pcs): 4000 (0603, 0805), 3000 (1206) Plastic T/R (Pcs): 3000 (0805, 1206), 2000 (1210, 1808, 1812), 1000 (1812+), 800, 500. | N/A |
Precautions for Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in short or open circuit modes under severe electrical or mechanical stress exceeding specified ratings. This can lead to burnout, flaming, or glowing. Adhere to the following precautions and application notes:
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron, tip selection, and temperature contact.
- Optimum Solder Amount for Reflow Soldering & Recommended Soldering amounts: Refer to the provided graphs and recommendations.
- Recommended Soldering Method: RReflow Soldering, WWave Soldering. Specific recommendations based on size, characteristics, rated voltage, and capacitance are provided.
- Soldering Temperature Profile: Maintain temperature difference (T150) between soldering temperature and surface temperature of chips during preheating.
2509251626_AIDE-CAPACITOR-0603C0G680J500NT_C49326338.pdf
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