Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for a wide range of power supply and networking equipment such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer various temperature characteristics, including C0G, X7R, and X5R, with precise capacity tolerances and rated voltages. They are available in multiple standard package sizes and are compliant with RoHS and REACH standards.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| 1. Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||||||
| 2. Testing Conditions | ||||||||||
| 2.1 Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Normal atmosphere: 86~106kPa | |||||||||
| 2.2 Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||
| 3. Part Number Description | ||||||||||
| Item | Description | |||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||||
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | |||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | |||||||||
| 4. Construction and Dimension | ||||||||||
| Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickle layer, 5 Tin layer | |||||||||
| Dimension (mm) | Part number | L | W | T | WB | |||||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||||||
| 5. Specification and Testing Method | ||||||||||
| Item | Specification/Requirement | Testing method | ||||||||
| 1. Temperature | -55~+125 | |||||||||
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||
| 3. Static Capacity | Meet standard specification and tolerance |
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| 4. Dissipation Factor (DF) |
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| 5. IR Insulation Resistance |
| Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||
| 6. Hi-pot (DC) |
| Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||
| 7. Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | ||||||||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||
| 9. Flexural strength | No damage | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test it under the flexural status. | ||||||||
| 10. Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||
| 11. Thermal shock |
| Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity | ||||||||
| 12. Temperature moisture exposure |
| Temperature 402, Humidity 90~95%RH, time 500+24 hours. Test it after place 242 hours normal temp & humidity | ||||||||
| 13. High temperature exposure |
| Temperature 1253, Time 100048 hours, Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48hours under normal pressure & temperature. | ||||||||
| 14. PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, Then pressing direction base on the photo. | ||||||||
| 6. Embossed Plastic Taping | ||||||||||
| Embossed tape reel packing for 0805(2012)~1812(4532) type | Code | Tape size A | B | C | D | E | F | G | H | J | T | |||||||||
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | ||||||||||
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | ||||||||||
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | ||||||||||
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | ||||||||||
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | ||||||||||
| Paper tape reel packing for 10050402~12063216 | ||||||||||
| 1005 | Papersize W1 | L1 | D | C | B | P1 | P2 | P0 | d | t | |||||||||
| 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | ||||||||||
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |||||||||
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |||||||||
| 0603 | Papersize A | B | C | D | E | F | G | H | J | T | |||||||||
| 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||||||||||
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |||||||||
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |||||||||
| Reel Dimensions (unit: mm) | ||||||||||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Taping specification | ||||||||||
| Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N | (a) Paper Taping, (b) Embossed Taping | ||||||||
| Packing quantity | ||||||||||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | - | ||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | - | 3000 (T>1.35mm) | ||||||||
| 1210 | - | 2000 (T1.60mm) | ||||||||
| 1808 | - | 3000 (T>1.60mm) | ||||||||
| 1812 | - | 2000 | ||||||||
| 1812 | - | 1000 (T1.85mm) | ||||||||
| 800 (T>1.85mm) | ||||||||||
| 500 | ||||||||||
| 8. Precautions For Use | ||||||||||
| Soldering Profile | To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | |||||||||
| Manual Soldering | Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. | |||||||||
| Optimum Solder Amount for Reflow Soldering | ||||||||||
| Recommended Soldering amounts | ||||||||||
| 9. Recommended Soldering Method | ||||||||||
| Size | Temperature Characteristics | Capacitance | Soldering Method | |||||||
| 1005 | NPO | / | R | |||||||
| X7R/X5R/X7S/X6S | / | R | ||||||||
| 0201 | NPO | / | R | |||||||
| X7R/X5R/X7S/X6S | / | R | ||||||||
| Y5V | / | R | ||||||||
| 0402 | NPO | / | R | |||||||
| X7R/X5R/X7S/X6S | / | R | ||||||||
| Y5V | / | R | ||||||||
| 0603 | NPO | / | R/W | |||||||
| X7R/X5R/X7S/X6S | C1uf | R | ||||||||
| C1uf | R/W | |||||||||
| Y5V | C1uf | R | ||||||||
| C1uf | R/W | |||||||||
| 0805 | NPO | / | R/W | |||||||
| X7R/X5R/X7S/X6S | C4.7uf | R | ||||||||
| C4.7uf | R/W | |||||||||
| Y5V | C1uf | R | ||||||||
| C1uf | R/W | |||||||||
| 1206 | NPO | / | R/W | |||||||
| X7R/X5R/X7S/X6S | C10uf | R | ||||||||
| C10uf | R/W | |||||||||
| Y5V | C10uf | R | ||||||||
| C10uf | R/W | |||||||||
| 1210 | NPO | / | R | |||||||
| X7R/X5R/X7S/X6S | / | R | ||||||||
| Y5V | / | R | ||||||||
| Soldering method: RReflow Soldering, WWave Soldering | ||||||||||
| 10. The temperature profile for soldering | ||||||||||
| While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||||||||||
2509251626_AIDE-CAPACITOR-0603C0G681J101NT_C49326339.pdf
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