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Specifications
Voltage Rating:
50V
Capacitance:
1uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
0603X5R105K500NT
Model Number:
0603X5R105K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are ideal for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These components are suitable for medium and high voltage applications.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: ROHS/REACH compliant
Technical Specifications
| Item | Description | Specification | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||||||||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |||||||||||
| (Medium and High voltage MLCC) | |||||||||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||
| Part Number Description | 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm) to 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||||
| 3. Nominal Electrostatic Capacity | 8R0 (8.0 pF) to 101 (100 pF) | ||||||||||
| 4. Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | ||||||||||
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | ||||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||||||||
| 7. Packing | T (Tape/Reel), P (Bag packing) | ||||||||||
| Construction | Item | Description | |||||||||
| 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer | N/A | ||||||||||
| Dimensions (mm) | Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||||
| Specification and Testing Method | Item | Specification/Requirement | Testing method | ||||||||
| Temperature | -55~+125 | N/A | |||||||||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||||||||
| Static Capacity | Meet standard specification and tolerance | See detailed specification in source document | |||||||||
| Dissipation Factor (DF) | See detailed specification in source document | See detailed specification in source document | |||||||||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||||||||
| Hi-pot (DC) | No dielectric breakdown or damage | See detailed voltage specification in source document | |||||||||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | |||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | N/A | |||||||||
| Flexural strength | No damage | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10% | |||||||||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||||
| Thermal shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity | |||||||||
| Temperature moisture exposure | Visual: No visual damage Electro static capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity | |||||||||
| High temperature exposure | Visual: No visual damage Electro static capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature. | |||||||||
| PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, Then pressing direction base on the photo. | |||||||||
| Embossed Plastic Taping | Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| Paper Tape Reel Packing | Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| Reel Dimensions (unit: mm) | Unit:mm | A | B | C | D | E | F | G | N/A | N/A | N/A |
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | N/A | N/A | N/A | |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | N/A | N/A | N/A | |
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| 0603 | 4000 | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | ||
| 0805 | 4000 | 3000 (T1.35mm) | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | |
| 1206 | 3000 (T>1.35mm) | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | ||
| 1210 | 2000 (T1.60mm) | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | ||
| 1812 | 1000 (T1.85mm) | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | ||
| Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | ||||||
| 1005 | NPO / X7R/X5R/X7S/X6S | / | / | R | |||||||
| 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | / | / | R | |||||||
| 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | / | / | R | |||||||
| 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | / | C1uf / C1uf | R/W / R/W | |||||||
| 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | / | C4.7uf / C4.7uf (X7R) C1uf / C1uf (Y5V) | R / R/W | |||||||
| 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | / | C10uf / C10uf (X7R) C10uf / C10uf (Y5V) | R / R/W | |||||||
| 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | / | / | R | |||||||
| Soldering Method Key | RReflow Soldering, WWave Soldering | ||||||||||
Precautions For Use
MLCCs may fail in short or open circuit modes when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent burnout, flaming, or glowing, follow safety precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Avoid cracks due to sudden temperature changes by following the recommended temperature profile.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron tip and select appropriate temperature and tip.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Soldering Temperature Profile: During preheating, keep the temperature difference between soldering temperature and chip surface temperature T 150.
2509251626_AIDE-CAPACITOR-0603X5R105K500NT_C49326360.pdf
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