Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and energy-saving lamp circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Category | Specification | Details | |||
|---|---|---|---|---|---|
| Application Field | Coupling | High voltage circuits | |||
| Wave Filtering | High voltage circuits | ||||
| Resonant | High voltage circuits | ||||
| Switch Power Supplier | Medium and High voltage MLCC | ||||
| AC-DC Power Charger | Medium and High voltage MLCC | ||||
| DC-DC Power Charger | Medium and High voltage MLCC | ||||
| Networking/Communication Interface | Medium and High voltage MLCC | ||||
| LCD Backlight Unit Power Supplier | Medium and High voltage MLCC | ||||
| Amperite of Energy Saving Lamps | Medium and High voltage MLCC | ||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T (Dimension Code, Temperature Characteristic, Nominal Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing) | ||||
| Dimensions (mm) | Code | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specifications and Testing Methods | Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V (V) | ||||
| Temperature Range | -55~+125 | ||||
| Dissipation Factor (DF) | Refer to Note 1 for X7R/X5R/X6S/X7S/Y5V characteristics. NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) | ||||
| Insulation Resistance (IR) | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||
| Hi-pot (DC) | Ur=100V,.......2.5 x rated voltage; Ur=200V/250V,.... 2.0 x rated voltage; Ur=450/500/630V,1.5 x rated voltage; 1KVUr2KV,.......1.2 x rated voltage; 2KVUr,...............1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||
| Solderability | Soldering area90%. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | ||||
| Flexural Strength | Electro static capacity change rate: C/C10%. Flexural depth: 452 mm. | ||||
| Terminal Bonding Strength | Applied Force: 5N, Duration: 101S. | ||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10%. Run 5 cycles. | ||||
| Temperature Moisture Exposure | Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. Test under 402, 90~95%RH for 50024 hours. | ||||
| High Temperature Exposure | Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. Test under 1253 for 100048 hours. | ||||
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering. | ||||
| Packing Options | Embossed Plastic Taping | Available for 0805(2012) to 1812(4532) types. Refer to detailed dimensions for each size. | |||
| Paper Tape Reel Packing | Available for 1005(0402) to 1206(3216) types. Refer to detailed dimensions for each size. | ||||
| Reel Dimensions | 7REEL: 1782.0, 13REEL: 3302.0. | ||||
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. | ||||
| Packing Quantity | Refer to table for Paper T/R and Plastic T/R quantities by size. |
Precautions for Use
To avoid failure modes such as short circuit, open circuit, burn out, flaming, or glowing, especially under severe electrical or mechanical stress beyond specified ratings and conditions, adhere to the following precautions:
- Soldering Profile: Follow the recommended temperature profile to prevent cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to avoid thermal cracks. Ensure the soldering iron tip is selected appropriately and contact is managed carefully to prevent direct contact with the ceramic body.
- Optimum Solder Amount & Recommended Soldering Methods: Refer to the provided guidelines for reflow and wave soldering.
Recommended Soldering Methods
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| / | C1uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| / | C4.7uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| / | C10uf | R/W | ||
| Y5V | / | C10uf | R | |
| / | C10uf | R/W | ||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering Method Key: RReflow Soldering, WWave Soldering
2509251626_AIDE-CAPACITOR-0603X5R106K6R3NT_C49326364.pdf
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