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quality Ceramic Capacitors AIDE CAPACITOR 0603X5R475K100NT for AC DC Power Chargers and Networking Interfaces factory
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quality Ceramic Capacitors AIDE CAPACITOR 0603X5R475K100NT for AC DC Power Chargers and Networking Interfaces factory
>
Specifications
Voltage Rating:
10V
Capacitance:
4.7uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
0603X5R475K100NT
Model Number:
0603X5R475K100NT
Package:
0603
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics like C0G, X7R, and X5R, these MLCCs offer reliable performance in demanding electrical environments.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn (from inside out)
  • RoHS/REACH Compliance: Meets standards

Technical Specifications

Item Description/Specification Testing Method
Application Field
Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC).
Testing Conditions
Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC) 250 25V, 251 250V, 252 2500V
6. Terminal Composition Au/Ag-Ni-Sn (From the inside out)
7. Packing T Tape/Reel, P Bag packing (PE)
Construction and Dimension
Construction 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer
Dimension (mm) Part number
0201 (0603)
0402 (1005)
0603 (1608)
0805 (2012)
1206 (3216)
1210 (3225)
1808 (4520)
1812 (4532)
1825 (4563)
2220 (5750)
2225 (5763)
L W T WB
0.600.10 0.300.05 0.300.05 0.100.05
1.000.15 0.500.15 0.500.10 0.200.10
1.600.20 0.800.15 0.800.15 0.300.10
2.000.20 1.250.20 0.800.20 0.500.20
3.200.30 1.600.30 1.000.20 0.600.30
3.200.30 2.500.30 2.70 0.800.30
4.500.40 2.000.20 2.70 0.800.30
4.500.40 3.200.30 3.50 0.800.30
4.500.40 6.300.50 3.50 0.800.30
5.700.50 5.000.50 3.50 1.000.40
5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method
Temperature -55~+125
Visual/Dimension 1. No Damage
2. Dimension meet Spec
Naked eye (Visual inspection), Digital caliper
Static Capacity Meet standard specification and tolerance NPO characteristic: Capacity 1000pF 1MHz10% 1.0 0.2Vrms; 1000 pF 1KHz10% 1.0 0.2Vrms
X7R/X7T/X7P characteristic: Capacity 10uF 1KHz10% 1.0 0.2Vrms; 10uF 120Hz24 0.5 0.1Vrms
Dissipation Factor (DF) NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
X7R/X7T/X7P characteristic: see Note 1
NPO Cr1000pF, 1MHz10%, 1V0.2rms; Cr1000pF, 1KHz10%, 1V0.2rms.
X7R/X7T/X7P Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24Hz, 0.5V0.1rms.
IR Insulation Resistance NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF
X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF
Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) No dielectric breakdown or damage Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s
Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic Capacity Change Rate NPO Characteristic: C/C0.5% or 0.5pF larger reading
X7R: C/C15%
X7T: -33% C/C22%
X7P: C/C10%
Flexural Strength No damage. Electro static capacity change rate C/C10% Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock NPO Characteristic: C/C2.5% or 0.25pF (larger reading)
X7R/X7P- characteristic: C/C0.5%
X7T characteristic: C/C10%
Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.
Temperature Moisture Exposure Visual No visual damage. Electrostatic capacitance change rate NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity.
High Temperature Exposure Visual No visual damage. Electrostatic capacitance change rate NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). Temperature 1253, Time 100048 hours. Voltage 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48hours under normal pressure & temperature.
PCB Flexural Strength No crack and other defect Soldering the MLCC on the PCB, then pressing direction base on the photo.
Embossed Plastic Taping (0805 to 1812 type)
Code Tapesize A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max
Paper Tape Reel Packing
Code Papersize W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
Code Papersize A B C D E F G H J T
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
Reel Dimensions
Unit 7REEL 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
Taping Specification
Top tape peeling strength 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. (a) Paper Taping (b) Embossed Taping
Packing Quantity
Dimension Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000
0805 4000 3000 (T1.35mm)
1206 3000 (T1.35mm)
1210 2000 (T1.60mm)
1808 3000 (T1.60mm)
1812 2000
1812 1000 (T1.85mm)
1000 (T1.85mm)
800
500
Precautions For Use
Soldering Profile To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph.
Manual Soldering Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip.
Optimum Solder Amount for Reflow Soldering
Recommended Soldering amounts
Recommended Soldering Method
Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
/ C1uf R/W
Y5V / C1uf R
/ C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
/ C4.7uf R/W
Y5V / C1uf R
/ C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
/ C10uf R/W
Y5V / C10uf R
/ C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
Soldering Method: RReflow Soldering, WWave Soldering
The temperature profile for soldering
While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-0603X5R475K100NT_C49326376.pdf

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