Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics like C0G, X7R, and X5R, these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- RoHS/REACH Compliance: Meets standards
Technical Specifications
| Item | Description/Specification | Testing Method | ||
|---|---|---|---|---|
| Application Field | ||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||
| Testing Conditions | ||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||
| 5. Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | |||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | |||
| Construction and Dimension | ||||
| Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer | |||
| Dimension (mm) | Part number 0201 (0603) 0402 (1005) 0603 (1608) 0805 (2012) 1206 (3216) 1210 (3225) 1808 (4520) 1812 (4532) 1825 (4563) 2220 (5750) 2225 (5763) | L W T WB 0.600.10 0.300.05 0.300.05 0.100.05 1.000.15 0.500.15 0.500.10 0.200.10 1.600.20 0.800.15 0.800.15 0.300.10 2.000.20 1.250.20 0.800.20 0.500.20 3.200.30 1.600.30 1.000.20 0.600.30 3.200.30 2.500.30 2.70 0.800.30 4.500.40 2.000.20 2.70 0.800.30 4.500.40 3.200.30 3.50 0.800.30 4.500.40 6.300.50 3.50 0.800.30 5.700.50 5.000.50 3.50 1.000.40 5.700.50 6.300.50 6.20 1.000.40 | ||
| Specification and Testing Method | ||||
| Temperature | -55~+125 | |||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | ||
| Static Capacity | Meet standard specification and tolerance | NPO characteristic: Capacity 1000pF 1MHz10% 1.0 0.2Vrms; 1000 pF 1KHz10% 1.0 0.2Vrms X7R/X7T/X7P characteristic: Capacity 10uF 1KHz10% 1.0 0.2Vrms; 10uF 120Hz24 0.5 0.1Vrms | ||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P characteristic: see Note 1 | NPO Cr1000pF, 1MHz10%, 1V0.2rms; Cr1000pF, 1KHz10%, 1V0.2rms. X7R/X7T/X7P Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24Hz, 0.5V0.1rms. | ||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||
| Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | ||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||
| Electrostatic Capacity Change Rate | NPO Characteristic: C/C0.5% or 0.5pF larger reading X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | |||
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | ||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P- characteristic: C/C0.5% X7T characteristic: C/C10% | Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | ||
| Temperature Moisture Exposure | Visual No visual damage. Electrostatic capacitance change rate NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | ||
| High Temperature Exposure | Visual No visual damage. Electrostatic capacitance change rate NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48hours under normal pressure & temperature. | ||
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction base on the photo. | ||
| Embossed Plastic Taping (0805 to 1812 type) | ||||
| Code | Tapesize A B C D E F G H J | T | ||
| 0805 | 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | 1.50 Max | ||
| 1206 | 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 | 1.85 Max | ||
| 1210 | 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 | 3.2 Max | ||
| 1808 | 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 | 3.0 Max | ||
| 1812 | 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 | 4.0 Max | ||
| Paper Tape Reel Packing | ||||
| Code | Papersize W1 L1 D C B P1 P2 P0 d t | |||
| 1005 | 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 | 0.30 Below | ||
| 0201 | 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 | 0.80 Below | ||
| 0402 | 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 | 0.80 Below | ||
| Code | Papersize A B C D E F G H J | T | ||
| 0603 | 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | 1.10 Max | ||
| 0805 | 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | 1.10 Max | ||
| 1206 | 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 | 1.10 Max | ||
| Reel Dimensions | ||||
| Unit | 7REEL 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | 13REEL 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | ||
| Taping Specification | ||||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping (b) Embossed Taping | ||
| Packing Quantity | ||||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||
| 0603 | 4000 | |||
| 0805 | 4000 | 3000 (T1.35mm) | ||
| 1206 | 3000 (T1.35mm) | |||
| 1210 | 2000 (T1.60mm) | |||
| 1808 | 3000 (T1.60mm) | |||
| 1812 | 2000 | |||
| 1812 | 1000 (T1.85mm) | |||
| 1000 (T1.85mm) | ||||
| 800 | ||||
| 500 | ||||
| Precautions For Use | ||||
| Soldering Profile | To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | |||
| Manual Soldering | Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. | |||
| Optimum Solder Amount for Reflow Soldering | ||||
| Recommended Soldering amounts | ||||
| Recommended Soldering Method | ||||
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| / | C1uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| / | C4.7uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| / | C10uf | R/W | ||
| Y5V | / | C10uf | R | |
| / | C10uf | R/W | ||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| Soldering Method: RReflow Soldering, WWave Soldering | ||||
| The temperature profile for soldering | ||||
| While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||||
2509251626_AIDE-CAPACITOR-0603X5R475K100NT_C49326376.pdf
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