Product Overview
These Multi-Layer Ceramic Capacitors (MLCC) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are ideal for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and dielectric characteristics (C0G, X7R, X5R), these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: ROHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Temperature Characteristic | C0G | 0 30 PPM/ | |
| X7R / X5R | 15% | ||
| 2. Operating Temperature Range | -55 ~ +125 | ||
| 3. Static Capacity | NPO Characteristic | Frequency 1MHz 10%, Voltage 1.0 0.2Vrms (for 1000pF) Frequency 1KHz 10%, Voltage 1.0 0.2Vrms (for > 1000pF) | |
| X7R/X7T/X7P Characteristic | Frequency 1KHz 10%, Voltage 1.0 0.2Vrms (for 10uF) Frequency 120Hz 24, Voltage 0.5 0.1Vrms (for > 10uF) | ||
| 4. Dissipation Factor (DF) | NPO Characteristic | DF 0.56 (Cr < 5 pF) DF 1.5[(150/Cr)+7]10 (5pF Cr < 50pF) DF 0.15% (50pF Cr) | Frequency 1MHz 10%, Voltage 1V 0.2rms (Cr 1000pF) Frequency 1KHz 10%, Voltage 1V 0.2rms (Cr > 1000pF) |
| X7R/X7T/X7P Characteristic | See Note 1 | Frequency 1KHz 10%, Voltage 1V 0.1rms (Cr 10uF) Frequency 120Hz 24, Voltage 0.5V 0.1rms (Cr > 10uF) | |
| 5. Insulation Resistance (IR) | NPO Characteristic | IR 50000M (C 10nF) IR*Cr 500S (C > 10nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| X7R/X7T/X7P Characteristic | IR 10000M (C 25nF) IR*Cr 100S (C > 25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| 6. Hi-pot (DC) | Ur=100V,... 2.5 x rated voltage Ur=200V/250V,... 2.0 x rated voltage Ur=450/500/630V,... 1.5 x rated voltage 1KV Ur 2KV,... 1.2 x rated voltage 2KV < Ur,... 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time2S | |
| 7. Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| 8. Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| 9. Flexural Strength | No damage. Electro static capacity change rate C/C 10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |
| 10. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| 11. Thermal Shock | NPO Characteristic: C/C 2.5% or 0.25pF X7R/X7P Characteristic: C/C 0.5% X7T Characteristic: C/C 10% | Run 5 cycles. Test after place 242 hours normal temp & humidity. | |
| 12. Temperature Moisture Exposure | NPO Characteristic: C/C 2% or 1pF X7R/X7T/X7P Characteristic: C/C 10% DF 2 times initial standard IR NPO: IR 2500M or IR*Cr 25S IR X7R/X7T/X7P: IR 1000M or IR*Cr 25S | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |
| 13. High Temperature Exposure | NPO: C/C 2% or 1pF X7R/X7T/X7P: C/C 20% DF 2 X initial standard IR NPO: IR 4000M or IR*Cr 40S IR X7R/X7T/X7P: IR 2000M or IR*Cr 50S | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | |
| 14. PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. |
Dimensions and Packaging
Dimensions (mm)
| Part Number Dimension Code | British System | Metric System | L | W | T | WB |
|---|---|---|---|---|---|---|
| 0201 | 0603 | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 | 1005 | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 | 1608 | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 | 2012 | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 | 3216 | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 | 3225 | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 | 4520 | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 | 4532 | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 | 4563 | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 | 5750 | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 | 5763 | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
Embossed Plastic Taping Dimensions (unit: mm)
| Code | Tape size | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0805 | T | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | T | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | T | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | T | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | T | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
Paper Tape Reel Packing Dimensions (unit: mm)
| Code | Paper size | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
Reel Dimensions (unit: mm)
| Type | A | B | C | D | E | F | G |
|---|---|---|---|---|---|---|---|
| 7REEL 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |
| 13REEL 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
Packing Quantity (Pcs)
| Dimension | Paper T/R | Plastic T/R |
|---|---|---|
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T>1.35mm) |
| 1210 | - | 2000 (T1.60mm) |
| 1808 | - | 3000 (T>1.60mm) |
| 1812 | - | 2000 |
| 1812 | - | 1000 (T1.85mm) |
| 1000 (T>1.85mm) | ||
| 800 | ||
| 500 |
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes such as burnout, flaming, or glowing, adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks caused by sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is carefully selected and used, avoiding direct contact with the ceramic body.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T 150.
2509251626_AIDE-CAPACITOR-0603X5R475M250NT_C49326382.pdf
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