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quality multi layer ceramic capacitor AIDE CAPACITOR 0603X5R475M250NT suitable for high voltage applications factory
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quality multi layer ceramic capacitor AIDE CAPACITOR 0603X5R475M250NT suitable for high voltage applications factory
>
Specifications
Voltage Rating:
25V
Capacitance:
4.7uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
0603X5R475M250NT
Model Number:
0603X5R475M250NT
Package:
0603
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCC) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are ideal for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and dielectric characteristics (C0G, X7R, X5R), these MLCCs offer reliable performance in demanding electrical environments.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
  • Certifications: ROHS compliant, REACH compliant

Technical Specifications

Item Description Specification/Requirement Testing Method
1. Temperature Characteristic C0G 0 30 PPM/
X7R / X5R 15%
2. Operating Temperature Range -55 ~ +125
3. Static Capacity NPO Characteristic Frequency 1MHz 10%, Voltage 1.0 0.2Vrms (for 1000pF)
Frequency 1KHz 10%, Voltage 1.0 0.2Vrms (for > 1000pF)
X7R/X7T/X7P Characteristic Frequency 1KHz 10%, Voltage 1.0 0.2Vrms (for 10uF)
Frequency 120Hz 24, Voltage 0.5 0.1Vrms (for > 10uF)
4. Dissipation Factor (DF) NPO Characteristic DF 0.56 (Cr < 5 pF)
DF 1.5[(150/Cr)+7]10 (5pF Cr < 50pF)
DF 0.15% (50pF Cr)
Frequency 1MHz 10%, Voltage 1V 0.2rms (Cr 1000pF)
Frequency 1KHz 10%, Voltage 1V 0.2rms (Cr > 1000pF)
X7R/X7T/X7P Characteristic See Note 1 Frequency 1KHz 10%, Voltage 1V 0.1rms (Cr 10uF)
Frequency 120Hz 24, Voltage 0.5V 0.1rms (Cr > 10uF)
5. Insulation Resistance (IR) NPO Characteristic IR 50000M (C 10nF)
IR*Cr 500S (C > 10nF)
Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
X7R/X7T/X7P Characteristic IR 10000M (C 25nF)
IR*Cr 100S (C > 25nF)
Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
6. Hi-pot (DC) Ur=100V,... 2.5 x rated voltage
Ur=200V/250V,... 2.0 x rated voltage
Ur=450/500/630V,... 1.5 x rated voltage
1KV Ur 2KV,... 1.2 x rated voltage
2KV < Ur,... 1.1 x rated voltage
Voltage Raising time: 110S, Voltage maintaining time2S
7. Solderability Soldering area 90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
8. Resistance to the heat of soldering No damage, soldering area 90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9. Flexural Strength No damage. Electro static capacity change rate C/C 10% Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
10. Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
11. Thermal Shock NPO Characteristic: C/C 2.5% or 0.25pF
X7R/X7P Characteristic: C/C 0.5%
X7T Characteristic: C/C 10%
Run 5 cycles. Test after place 242 hours normal temp & humidity.
12. Temperature Moisture Exposure NPO Characteristic: C/C 2% or 1pF
X7R/X7T/X7P Characteristic: C/C 10%
DF 2 times initial standard
IR NPO: IR 2500M or IR*Cr 25S
IR X7R/X7T/X7P: IR 1000M or IR*Cr 25S
Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.
13. High Temperature Exposure NPO: C/C 2% or 1pF
X7R/X7T/X7P: C/C 20%
DF 2 X initial standard
IR NPO: IR 4000M or IR*Cr 40S
IR X7R/X7T/X7P: IR 2000M or IR*Cr 50S
Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature.
14. PCB Flexural Strength No crack and other defect IR Soldering the MLCC on the PCB, then pressing direction based on the photo.

Dimensions and Packaging

Dimensions (mm)

Part Number Dimension Code British System Metric System L W T WB
0201 0603 0.600.10 0.300.05 0.300.05 0.100.05
0402 1005 1.000.15 0.500.15 0.500.10 0.200.10
0603 1608 1.600.20 0.800.15 0.800.15 0.300.10
0805 2012 2.000.20 1.250.20 0.800.20 0.500.20
1206 3216 3.200.30 1.600.30 1.000.20 0.600.30
1210 3225 3.200.30 2.500.30 2.70 0.800.30
1808 4520 4.500.40 2.000.20 2.70 0.800.30
1812 4532 4.500.40 3.200.30 3.50 0.800.30
1825 4563 4.500.40 6.300.50 3.50 0.800.30
2220 5750 5.700.50 5.000.50 3.50 1.000.40
2225 5763 5.700.50 6.300.50 6.20 1.000.40

Embossed Plastic Taping Dimensions (unit: mm)

Code Tape size A B C D E F G H J T
0805 T 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 T 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 T 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 T 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 T 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max

Paper Tape Reel Packing Dimensions (unit: mm)

Code Paper size W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max

Reel Dimensions (unit: mm)

Type A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max

Packing Quantity (Pcs)

Dimension Paper T/R Plastic T/R
0603 4000 -
0805 4000 3000 (T1.35mm)
1206 - 3000 (T>1.35mm)
1210 - 2000 (T1.60mm)
1808 - 3000 (T>1.60mm)
1812 - 2000
1812 - 1000 (T1.85mm)
1000 (T>1.85mm)
800
500

Precautions For Use

MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes such as burnout, flaming, or glowing, adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.

  • Soldering Profile: Follow the recommended temperature profile to avoid cracks caused by sudden temperature changes.
  • Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is carefully selected and used, avoiding direct contact with the ceramic body.
  • Optimum Solder Amount for Reflow Soldering
  • Recommended Soldering amounts

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
C1uf R/W
Y5V / C1uf R
C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
C4.7uf R/W
Y5V / C1uf R
C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
C10uf R/W
Y5V / C10uf R
C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile

While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T 150.


2509251626_AIDE-CAPACITOR-0603X5R475M250NT_C49326382.pdf

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