Product Overview
This specification sheet details the 0603(X6S) SMD Ceramic Capacitor, designed for high-voltage electronic circuits. It is suitable for coupling, filtering, and resonant applications within devices such as switching power supplies, AC-DC and DC-DC converters, network/communication interfaces, LCD module backlight power supplies, and energy-saving lamp ballasts. These are classified as high-voltage multilayer ceramic capacitors (MLCCs).
Product Attributes
- Temperature Characteristics: X6S (22%)
- Terminal Material: Copper/Silver-Nickel-Tin (from inside to outside)
- Environmental Compliance: RoHS Directive, REACH Regulation (SVHC)
Technical Specifications
| Item | Specification | Test Method |
|---|---|---|
| Application Scope | High-voltage electronic circuits for coupling, filtering, resonance. Applications include switching power supplies, AC-DC converters, DC-DC converters, network/communication interfaces, LCD module backlight power supplies, energy-saving lamp ballasts. | - |
| Standard Conditions | Normal Temperature: 15~35 Normal Humidity: 45~75%RH Normal Pressure: 86~106kPa | - |
| Standard Relative Conditions | Normal Temperature: 252 Normal Humidity: 60~70%RH Normal Pressure: 86~106kPa | - |
| Product Code Structure | Example: 0603 X6S 105 K 160 N T Product Size Code Temperature Characteristic Nominal Capacitance Capacitance Tolerance Rated Voltage (DC) Terminal Material Packaging Method | - |
| Product Size Codes (Inch) | 0201 (0.02*0.01), 0402 (0.04*0.02), 0603 (0.06*0.03), 0805 (0.08*0.05), 1206 (0.12*0.06), 1210 (0.12*0.10), 1808 (0.18*0.08), 1812 (0.18*0.12), 1825 (0.18*0.25), 2211 (0.22*0.11), 2225 (0.22*0.25) | - |
| Product Size Codes (mm) | 0201 (0.50*0.25), 0402 (1.00*0.50), 0603 (1.60*0.80), 0805 (2.00*1.25), 1206 (3.20*1.60), 1210 (3.20*2.50), 1808 (4.50*2.00), 1812 (4.50*3.20), 1825 (4.50*6.30), 2211 (5.70*2.8), 2225 (5.70*6.30) | - |
| Nominal Capacitance (Three-digit method, unit: F) | Example: 105 = 1 (F) | - |
| Capacitance Tolerance | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G:2%, J:5%, K:10%, M:20%, Z:+80%/-20% | - |
| Rated Voltage (DC) (Three-digit method, unit: V) | Example: 160=16V, 101=100V, 102=1000V | - |
| Product Structure | 1. Ceramic Dielectric 2. Inner Electrode 3. Outer Electrode 4. Nickel Layer 5. Tin Layer | - |
| Product Dimensions (0603/1608) | L: 1.600.15 mm W: 0.800.15 mm T: 0.800.15 mm WB: 0.300.10 mm | - |
| Operating Temperature Range | -55~+105 | Visual inspection for appearance. Vernier caliper for dimensions. |
| Appearance and Dimensions | 1. No visible damage to appearance. 2. Dimensions meet specification requirements. | Visual inspection for appearance. Vernier caliper for dimensions. |
| Capacitance | Within specified tolerance. | NPO Characteristics: 1000pF: 1MHz10%, 1.00.2Vrms >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X5R Characteristics: 10uF: 1KHz10%, 1.00.2Vrms >10uF: 120Hz24, 0.50.1Vrms |
| Dissipation Factor (DF Value) | NPO Characteristics: DF0.56%, Cr < 5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr<50pF) DF0.15%, (50pFCr) X7R/X5R/X6S/X7S/Y5V Characteristics: Cr10uF: 1KHz10%, 1V0.1rms Cr>10uF: 12024Hz, 0.5V0.1rms | NPO: Cr1000pF, 110%MHz, 1V0.2rms. Cr>1000pF, 110%KHz, 1V0.2rms. X7R/X5R/X6S/X7S/Y5V: Cr10uF, 110%KHz, 1V0.1rms. Cr>10uF, 12024Hz, 0.5V0.1rms. |
| Insulation Resistance | NPO Characteristics: IR50000M, C10nF IR*Cr500S, C>10nF X7R/X6S/X5R Characteristics: IR10000M, C25nF IR*Cr100S, C>25nF | Test Voltage: 500V (for rated voltage 500V), rated voltage (for rated voltage <500V). Test Time: 605 sec. Humidity: 75%. Temperature: 255. Charge/discharge current: 50mA. |
| Dielectric Withstand Voltage (DC) | 2.5 times rated voltage (Ur=100V) 2.0 times rated voltage (Ur=200V/250V) 1.5 times rated voltage (Ur=450/500/630V) 1.2 times rated voltage (1KVUr2KV) 1.1 times rated voltage (2KVUr) | Ramp time: 1-10S. Holding time: 2S. No dielectric breakdown or damage. |
| Solderability | >90% tinning rate. No visible damage. | Preheat at 80-120 for 10-30 sec. Lead-free solder, flux. Solder temperature: 2455. Soldering time: 20.5 sec. |
| Solder Heat Resistance | No visible damage, >90% tinning rate. | Preheat at 100-200 for 102 sec. Immersion temperature: 2605. Immersion time: 51 sec. Clean with solvent. Store at room temperature for 242 hours. |
| Capacitance Change Rate (Solder Heat Resistance) | NPO: |C/C|0.5% or 0.5pF (whichever is greater) X7R: |C/C|15% X7T: -33% C/C22% X6S: |C/C|22% | - |
| DF Value (Solder Heat Resistance) | See NO4 | - |
| IR (Solder Heat Resistance) | See NO5 | - |
| Bending Strength | No visible damage. |C/C|10%. | Test substrate: Al2O3 or PCB. PCB size: 1.6mm thickness, 100mm length, 40mm width. Bending depth: 1mm. Pressing speed: 0.5mm/sec. Measurements taken under bending. |
| Terminal Joint Strength | No visible damage. | - |
| Temperature Cycling | NPO: |C/C|2.5% or 0.25pF (whichever is greater) X7R/X5R: |C/C|7.5% X6S: |C/C|10% | Pre-conditioning (X7R): 1 hour at upper temp, 241 hours at room temp. 5 temperature cycles. Store at room temp/humidity for 242 hours before testing. Steps: Lower temp (303 min), Room temp (2-3 min), Upper temp (303 min), Room temp (2-3 min). |
| Damp Heat Resistance | No visible damage. NPO: |C/C|2% or 1pF (whichever is greater) X7R/X6S/X5R: |C/C|10% DF Value: 2 times initial standard NPO IR: IR2500M or IR*Cr25S (whichever is smaller) X7R/X6S/X5R IR: IR1000M or IR*Cr25S (whichever is smaller) | Temperature: 402. Humidity: 90~95%RH. Time: 50024 hours. Store at room temp/humidity for 24 hours after test. |
| High Temperature Load Test | No visible damage. NPO: |C/C|2% or 1pF (whichever is greater) X7R/X6S/X5R: |C/C|20% DF Value: 2 times initial standard NPO IR: IR4000M or IR*Cr40S (whichever is smaller) X7R/X6S/X5R IR: IR2000M or IR*Cr50S (whichever is smaller) | Charge/discharge current limited below 50mA. Store at room temp/humidity for 484 hours before testing. Temperature: 853. Time: 100048 hours. Voltage: 2 times rated voltage (100VV250V), 1.5 times rated voltage (250VV1KV), 1.2 times rated voltage (1KVV). |
| Circuit Board Bending Strength | No cracks or other defects. | Capacitors soldered onto fixture (glass epoxy) using mixed solder. Force applied as per diagram. Reflow soldering used to avoid uneven soldering and thermal shock. |
| Packaging (Tape & Reel) | 0805 (2012): 3000 pcs (T1.35mm) 1206 (3216): 3000 pcs (T1.60mm) 1210 (3225): 2000 pcs (T1.85mm) 1808 (4520): 1000 pcs (T1.85mm) 1812 (4532): 800 pcs (T1.85mm) 2220 (5750): 500 pcs (T1.85mm) | See packaging diagrams for dimensions. |
| Packaging (Paper Tape) | 1005 (0402): 4000 pcs 0603: 4000 pcs 0805: 4000 pcs | See packaging diagrams for dimensions. |
2507091655_AIDE-CAPACITOR-0603X6S475K160NT_C49326595.pdf
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