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quality High voltage ceramic capacitor AIDE CAPACITOR 0603X7R103K160NT for power supply circuits networking and LCD backlight units factory
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quality High voltage ceramic capacitor AIDE CAPACITOR 0603X7R103K160NT for power supply circuits networking and LCD backlight units factory
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Specifications
Voltage Rating:
16V
Capacitance:
10nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R103K160NT
Model Number:
0603X7R103K160NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in a range of dimensions and temperature characteristics, offering reliable performance under specified conditions.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Certifications: ROHS/REACH compliance

Technical Specifications

Item Description/Specification Testing Method
Application Field
Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC).
Testing Conditions
Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC) 250 25, 251 250, 252 2500 (V)
6. Terminal Composition Au/Ag-Ni-Sn
7. Packing T Tape/Reel, P Bag packing (PE)
Construction
Item Description
1 Ceramic dielectric
2 Inner electrode
3 Outer electrode
4 Nickle layer
5 Tin layer
Dimension (mm)
Part number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method
Item Specification/Requirement Testing method
1. Temperature -55~+125
2. Visual/Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
3. Static Capacity Meet standard specification and tolerance
  • NPO characteristic: Capacity Frequency Voltage 1000pF 1MHz10% 1.0 0.2Vrms; 1000 pF 1KHz10%
  • X7R/X7T/X7P characteristic: Capacity Frequency Voltage 10uF 1KHz10% 1.0 0.2Vrms; 10uF 120Hz24 0.5 0.1Vrms
4. Dissipation Factor (DF)
  • NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
  • X7R/X7T/X7P characteristic: see Note 1
  • Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms
  • Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms.
  • Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms.
  • Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms.
5. IR Insulation Resistance
  • NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF
  • X7R/X7T/X7P Characteristic: IR10000M,C25nF; IR*Cr100S,C25nF
Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
6. Hi-pot (DC)
  • Ur=100V,...............2.5 x rated voltage
  • Ur=200V/250V,.... 2.0 x rated voltage
  • Ur=450/500/630V,1.5 x rated voltage
  • 1KVUr2KV,.......1.2 x rated voltage
  • 2KVUr,...............1.1 x rated voltage
Voltage Raising time: 110S, Voltage maintaining time2S
7. Solderability Soldering area 90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s
8. Resistance to the heat of soldering Visual-No damage, soldering area 90% Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time : 242 hours.
9. Flexural strength No damage. Electro static capacity change rate C/C10% Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status.
10. Terminal bonding strength No visual damage Applied Force: 5N, Duration: 101S
11. Thermal shock
  • NPO Characteristic: C/C2.5% or 0.25pF (larger reading)
  • X7R/X7P characteristic: C/C0.5%
  • X7T characteristic: C/C10%
Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.
12. Temperature moisture exposure
  • Visual: No visual damage
  • Electrost atic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%
  • DF: 2 times initial standard
  • IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)
Temperature 402, Humidity 90~95%RH, time 500+24 hours. Test it after place 242 hours normal temp & humidity.
13. High temperature exposure
  • Visual: No visual damage
  • Electrost atic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%
  • DF: 2 X initial standard
  • IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)
Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48hours under normal pressure & temperature. Charging and discharging current 50mA Max.
14. PCB flexural strength No crack and other defect Soldering the MLCC on the PCB, Then pressing direction base on the photo. IR
Embossed Plastic Taping Dimensions (mm)
Code Tapesize A B C D E F G H J
0805 T 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10
1206 T 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10
1210 T 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10
1808 T 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10
1812 T 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10
Paper Tape Reel Packing Dimensions (mm)
Code Papersize W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
Reel Dimensions (mm)
Type A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
Taping Specification
Top tape peeling strength 0.1N < peeling strength < 0.7N Standard: No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity (Pcs)
Size Paper T/R Plastic T/R
0603 4000 -
0805 4000 3000 (T1.35mm), 2000 (T>1.35mm)
1206 - 3000 (T1.60mm), 1000 (T>1.60mm)
1210 - 800
1812 - 500
Precautions For Use
Soldering Profile Refer to the graph in the enclosure page. To avoid the crack problem by sudden temperature change.
Manual Soldering Pay much attention to the selection of the soldering iron tip and temperature contact of the tip.
Recommended Soldering Method
  • Size: 1005, 0201, 0402, 0603, 0805, 1206, 1210
  • Temperature Characteristics: NPO, X7R/X5R/X7S/X6S, Y5V
  • Capacitance: C1uf, C1uf, C4.7uf, C4.7uf, C10uf, C10uf
  • Soldering Method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile Keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-0603X7R103K160NT_C49326602.pdf

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