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Specifications
Voltage Rating:
50V
Capacitance:
1.2nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R122K500NT
Model Number:
0603X7R122K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various standard sizes and temperature characteristics, ensuring reliable performance across a range of operating conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC) | |
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| Packing | T (Tape/Reel), P (Bag packing) | |
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | |
| Temperature Range | -55~+125 | Naked eye (Visual inspection), Digital calliper |
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF); IR*Cr500S (C>10nF) X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C>25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux; Soldering temperature 2455, Solder time 20.5s |
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading); X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | |
| Flexural Strength | Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB; PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm; Flexural depth: 1mm; Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading); X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. |
| High Temperature Exposure | Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. |
| Embossed Plastic Taping Dimensions | See Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) for 0805 to 1812 types. | |
| Paper Tape Reel Packing Dimensions | See Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for 1005, 0201, 0402 types. | |
| Paper Tape Reel Packing Dimensions | See Page 9 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) for 0603, 0805, 1206 types. | |
| Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Top Tape Peeling Strength (Embossed Taping) | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| Packing Quantity | Paper T/R (Pcs): 4000 (0603, 0805), 2000 (1206) Plastic T/R (Pcs): 3000 (T1.35mm, 1210), 2000 (T1.60mm, 1812), 1000 (T1.85mm, 1812+), 800 (1812+), 500 (1812+) |
Precautions For Use
MLCCs may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent burnout, flaming, or glowing, follow safety precautions and application notes. Contact the engineering section or factory for handling precautions.
- Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Handle soldering irons carefully to prevent thermal cracks. Pay attention to tip selection and temperature.
- Optimum Solder Amount for Reflow Soldering: Refer to recommendations.
- Recommended Soldering Method: See Page 13 for size, temperature characteristics, rated voltage, capacitance, and recommended soldering methods (RReflow Soldering, WWave Soldering).
- Soldering Temperature Profile: Keep the temperature difference between soldering temperature and surface temperature of chips T150 during preheating.
2509251626_AIDE-CAPACITOR-0603X7R122K500NT_C49326612.pdf
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