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Specifications
Voltage Rating:
50V
Capacitance:
15nF
Temperature Coefficient:
X7R
Tolerance:
±5%
Mfr. Part #:
0603X7R153J500NT
Model Number:
0603X7R153J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, inner electrode, outer electrode, nickel layer, tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out).
- Compliance: ROHS/REACH compliant.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||
|---|---|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||
| 2. Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code (e.g., 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225) Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (e.g., 8R0, 100, 101) Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) Rated Voltage (DC) (e.g., 250, 251, 252) Terminal Composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag packing) | ||||
| 3. Construction | Ceramic dielectric | - | - | ||
| Inner electrode | - | - | |||
| Outer electrode | - | - | |||
| 4. Dimension (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| 5. Specification and Testing Method | Temperature | -55~+125 | - | ||
| - | Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||
| - | Static Capacity | Meet standard specification and tolerance | See details in source | ||
| - | Dissipation Factor (DF) | See details in source | See details in source | ||
| - | IR Insulation Resistance | NPO: 50000M, C10nF; IR*Cr500S, C>10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||
| - | Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies with rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time: 2S | ||
| - | Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||
| - | Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||
| - | Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF X7R: 15% X7T: -33% C/C22% X7P: 10% | - | ||
| - | Flexural Strength | No damage. Electro static capacity change rate: 10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | ||
| - | Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||
| - | Thermal Shock | NPO: 2.5% or 0.25pF X7R/X7P: 0.5% X7T: 10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | ||
| - | Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: 2% or 1pF; X7R/X7T/X7P: 10%. DF: 2 times initial standard. IR: NPO: 2500M or IR*Cr25S; X7R/X7T/X7P: 1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | ||
| - | High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: 2% or 1pF; X7R/X7T/X7P: 20%. DF: 2 X initial standard. IR: NPO: 4000M or IR*Cr40S; X7R/X7T/X7P: 2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | ||
| - | PCB Flexural Strength | No crack and other defect. | IR Soldering the MLCC on the PCB. Pressing direction based on provided diagrams. | ||
| 6. Embossed Plastic Taping | Details for 0805 to 1812 types including tape size, dimensions (A, B, C, D, E, F, G, H, J, T). | ||||
| 7. Paper Tape Reel Packing | Details for 1005, 0201, 0402, 0603, 0805, 1206 types including paper size, dimensions (W1, L1, D, C, B, P1, P2, P0, d, t). | ||||
| 8. Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | ||||
| 9. Packing Quantity | See details in source (e.g., Paper T/R (Pcs), Plastic T/R (Pcs) for various sizes). | ||||
| 10. Precautions for Use | MLCCs may fail short circuit under severe conditions. Follow soldering profiles, handle with care during manual soldering, and use optimum solder amounts for reflow soldering. | ||||
| 11. Recommended Soldering Method | Details provided for various sizes and temperature characteristics (NPO, X7R, X5R, etc.) indicating Reflow Soldering (R) or Wave Soldering (W). | ||||
2509251626_AIDE-CAPACITOR-0603X7R153J500NT_C49326616.pdf
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