Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, with options for different tolerances, voltages, and packing methods.
Product Attributes
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (from inside out).
- Certifications: ROHS/REACH compliant.
- Packing Options: Tape/Reel (T), Bag packing (P).
Technical Specifications
| Item | Description / Specification | Details |
|---|---|---|
| Dimension Code | 0201 | L*W (inch): 0.02*0.01 | L*W (mm): 0.50*0.25 |
| 0402 | L*W (inch): 0.04*0.02 | L*W (mm): 1.00*0.50 | |
| 0603 | L*W (inch): 0.06*0.03 | L*W (mm): 1.60*0.80 | |
| 0805 | L*W (inch): 0.08*0.05 | L*W (mm): 2.00*1.25 | |
| 1206 | L*W (inch): 0.12*0.06 | L*W (mm): 3.20*1.60 | |
| 1210 | L*W (inch): 0.12*0.10 | L*W (mm): 3.20*2.50 | |
| 1808 | L*W (inch): 0.18*0.08 | L*W (mm): 4.50*2.00 | |
| 1812 | L*W (inch): 0.18*0.12 | L*W (mm): 4.50*3.20 | |
| 1825 | L*W (inch): 0.18*0.25 | L*W (mm): 4.50*6.30 | |
| 2225 | L*W (inch): 0.22*0.25 | L*W (mm): 5.70*6.30 | |
| Temperature Characteristic | C0G | (0 30 PPM/) |
| X7R | ( 15%) | |
| X5R | ( 15%) | |
| Nominal Electrostatic Capacity | 8R0 | 8.0 pF |
| 101 | 100 pF | |
| Tolerance of Electrostatic Capacity | M | 20% |
| Z | + 80% / - 20% | |
| Rated Voltage (DC) | 251 | 250 V |
| 252 | 2500 V | |
| Operating Temperature Range | -55 ~ +125 | |
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| (Used when testing data does not match specification) | ||
| Dissipation Factor (DF) | NPO Characteristic | DF 0.56, Cr < 5 pF; DF 1.5[(150/Cr)+7]10-4 (5pF Cr < 50pF); DF 0.15%, (50pF Cr) |
| X7R/X7T/X7P Characteristic | See Note 1 | |
| Insulation Resistance (IR) | NPO Characteristic | IR 50000M, C 10nF; IR*Cr 500S, C > 10nF |
| X7R/X7T/X7P Characteristic | IR 10000M, C 25nF; IR*Cr 100S, C > 25nF | |
| Hi-pot (DC) | 2.5 x rated voltage (Ur=100V); 2.0 x rated voltage (Ur=200V/250V); 1.5 x rated voltage (Ur=450/500/630V); 1.2 x rated voltage (1KV Ur 2KV); 1.1 x rated voltage (2KV < Ur) | |
| Solderability | Soldering area 90%; Visual-No damage | |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | |
| Flexural Strength | Electrostatic capacity change rate |C/C| 10% | |
| Terminal Bonding Strength | No visual damage, Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO: |C/C| 2.5% or 0.25pF; X7R/X7P: |C/C| 0.5%; X7T: |C/C| 10% | |
| Temperature Moisture Exposure | NPO: |C/C| 2% or 1pF; X7R/X7T/X7P: |C/C| 10%; DF 2 times initial standard; IR (NPO): IR 2500M or IR*Cr 25S; IR (X7R/X7T/X7P): IR 1000M or IR*Cr 25S | |
| High Temperature Exposure | NPO: |C/C| 2% or 1pF; X7R/X7T/X7P: |C/C| 20%; DF 2 x initial standard; IR (NPO): IR 4000M or IR*Cr 40S; IR (X7R/X7T/X7P): IR 2000M or IR*Cr 50S | |
| PCB Flexural Strength | No crack and other defect | |
| Packing Quantity | See Page 11 |
Note 1: Refer to Page 4 for Dissipation Factor (DF) exceptions for X7R/X5R/X6S/X7S/Y5V characteristics.
Note 2: Soldering methods (RReflow Soldering, WWave Soldering) are specified in the Recommended Soldering Method section.
Note 3: Initial capacitance testing requires pre-heating at 150 for 1 hour, then 48 hours under normal pressure and temperature.
2509251626_AIDE-CAPACITOR-0603X7R224J500NT_C49326628.pdf
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