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Specifications
Voltage Rating:
6.3V
Capacitance:
2.2uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R225K6R3NT
Model Number:
0603X7R225K6R3NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These components are RoHS/REACH compliant.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps (Medium and High voltage MLCC). | ||
| Testing Condition: Normal (Temp: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa) | |||
| Part Number Description | Example: 1812 X7R 684 M 251 N T | ||
| Item | Description | Example | |
| 1 | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |
| 2 | Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3 | Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| 4 | Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5 | Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | |
| 6 | Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7 | Packing | T Tape/Reel, P Bag packing (PE) | |
| Construction | 1. Ceramic dielectric | ||
| 2. Inner electrode | |||
| 3. Outer electrode | |||
| 4. Nickle layer | |||
| 5. Tin layer | |||
| Dimension (mm) | Part number | L | W |
| 0201 (0603) | 0.600.10 | 0.300.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | |
| Specifications and Testing Methods | Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000 pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). X7R/X7T/X7P: See Note 1. | NPO: 110%MHz, 1V0.2rms (Cr1000pF); 110%KHz, 1V0.2rms (Cr1000pF). X7R/X7T/X7P: 110%KHz, 1V0.1rms (Cr10uF); 12024Hz, 0.5V0.1rms (Cr10uF). | |
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, ... 2.5 x rated voltage; Ur=200V/250V, ... 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, ... 1.2 x rated voltage; 2KVUr, ... 1.1 x rated voltage. | Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic capacity change rate | NPO: |C/C| 0.5% or 0.5pF; X7R: |C/C| 15%; X7T: -33% C/C22%; X7P: |C/C| 10% | ||
| Flexural strength | No damage. Electro static capacity change rate |C/C| 10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal shock | NPO: |C/C| 2.5% or 0.25pF; X7R/X7P: |C/C| 0.5%; X7T: |C/C| 10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |
| Temperature moisture exposure | Visual: No visual damage. Capacity change rate: NPO: |C/C| 2% or 1pF; X7R/X7T/X7P: |C/C| 10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | |
| High temperature exposure | Visual: No visual damage. Capacity change rate: NPO: |C/C| 2% or 1pF; X7R/X7T/X7P: |C/C| 20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature. | |
| PCB flexural strength | No crack and other defect. IR | Soldering the MLCC on the PCB, then pressing direction based on the photo. | |
| Embossed Plastic Taping | Tape size (0805) | A: 1.550.20, B: 2.350.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.50 Max | |
| Tape size (1206) | A: 1.950.20, B: 3.600.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.85 Max | ||
| Tape size (1210) | A: 2.700.10, B: 3.420.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.55 -0/+0.10, T: 3.2 Max | ||
| Tape size (1808) | A: 2.200.10, B: 4.950.10, C: 12.000.10, D: 5.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.50 -0/+0.10, T: 3.0 Max | ||
| Tape size (1812) | A: 3.660.10, B: 4.950.10, C: 12.000.10, D: 5.500.05, E: 1.750.10, F: 8.000.10, G: 2.000.05, H: 4.000.10, J: 1.55 -0/+0.10, T: 4.0 Max | ||
| Paper Tape Reel Packing | Paper size (1005) | W1: 0.240.02, L1: 0.450.02, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.30 Below | |
| Paper size (0201) | W1: 0.370.10, L1: 0.670.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below | ||
| Paper size (0402) | W1: 0.650.10, L1: 1.150.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below | ||
| Paper size (0603) | A: 1.100.10, B: 1.900.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | ||
| Paper size (0805) | A: 1.450.15, B: 2.300.15, C: 8.00.15, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | ||
| Paper size (1206) | A: 1.800.20, B: 3.400.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | ||
| Reel Dimensions | 7' REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| 13' REEL | 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | ||
| Top tape peeling strength | Paper Taping | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| Packing Quantity | 0603 | Paper T/R (Pcs): 4000 | |
| 0805 | Plastic T/R (Pcs): 3000 | ||
| 1206 | Plastic T/R (Pcs): T1.35mm: 3000, T1.35mm: 2000 | ||
| 1210 | Plastic T/R (Pcs): T1.60mm: 3000, T1.60mm: 2000 | ||
| 1808 | Plastic T/R (Pcs): 1000 | ||
| 1812 | Plastic T/R (Pcs): T1.85mm: 1000, T1.85mm: 800 | ||
| 1812 | Plastic T/R (Pcs): 500 | ||
Precautions for Use
MLCCs may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions, potentially resulting in burn out, flaming, or glowing. Adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the provided temperature profile graph to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is carefully handled, and pay attention to tip selection and contact temperature.
- Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.
- Recommended Soldering Method: See table below.
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf: R, C1uf: R/W | R/W | |
| Y5V | / | C1uf: R, C1uf: R/W | R/W | |
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf: R, C4.7uf: R/W | R/W | |
| Y5V | / | C1uf: R, C1uf: R/W | R/W | |
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf: R, C10uf: R/W | R/W | |
| Y5V | / | C10uf: R, C10uf: R/W | R/W | |
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile: During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.
2509251626_AIDE-CAPACITOR-0603X7R225K6R3NT_C49326633.pdf
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