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quality High voltage MLCC capacitor for switch power suppliers and AC DC chargers AIDE CAPACITOR 0603X7R302K500NT performance factory
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quality High voltage MLCC capacitor for switch power suppliers and AC DC chargers AIDE CAPACITOR 0603X7R302K500NT performance factory
>
Specifications
Voltage Rating:
50V
Capacitance:
3nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R302K500NT
Model Number:
0603X7R302K500NT
Package:
0603
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They are suitable for medium and high voltage circuits, offering reliable performance under specified testing conditions.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
  • RoHS Compliance: Meets standard
  • REACH Compliance: Meets standard

Technical Specifications

Item Description/Specification Details
Application Field Coupling, wave filtering, resonant in high voltage circuits
Switch power supplier
AC-DC power charger, DC-DC power charger
Networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps
Testing Condition Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
Rated Voltage (DC) 25025V, 251250V, 2522500V
Terminal Composition Au/Ag-Ni-Sn
Packing T (Tape/Reel), P (Bag packing)
Construction and Dimension Construction 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer
Dimension (mm) Part number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method Temperature -55~+125
Visual/Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
Static Capacity Meet standard specification and tolerance NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF)
Dissipation Factor (DF) NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr). Cr1000pF, 1MHz10%, 1V0.2rms. Cr1000pF, 1KHz10%, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24Hz, 0.5V0.1rms.
IR Insulation Resistance NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA
Hi-pot (DC) No dielectric breakdown or damage Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic capacity change rate NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10%
Flexural strength No damage Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%. Flexural depth 452mm.
Terminal bonding strength No visual damage Applied Force: 5N, Duration: 101S
Thermal shock NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
Temperature moisture exposure Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.
High temperature exposure Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature.
PCB flexural strength No crack and other defect IR Soldering the MLCC on the PCB. Pressing direction based on photo.
Embossed Plastic Taping Tape size A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max
Paper Tape Reel Packing Papersize W1 L1 D C B P1 P2 P0 d t
1005 0.240.02 0.450.02 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.30 Below
0201 0.370.10 0.670.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below
0402 0.650.10 1.150.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
Reel Dimensions Unit: mm A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
Taping Specification Top tape peeling strength 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity Size Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000
0805 4000 3000 (T1.35mm)
1206 3000 (T>1.35mm)
1812 1000 (T1.85mm)
1812 above 500
8 Precautions For Use MLCCs may fail short circuit in an open circuit mode when subjected to severe electrical/mechanical stress beyond ratings. Follow precautions for safety and application notes. Contact engineering for handling questions.
1. Soldering Profile To avoid cracks from sudden temperature change, follow the temperature profile graph.
2. Manual Soldering High risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact.
3. Optimum Solder Amount for Reflow Soldering
4. Recommended Soldering amounts
9 Recommended Soldering Method Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R C1uf R/W
Y5V / C1uf R C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R C4.7uf R/W
Y5V / C1uf R C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R C10uf R/W
Y5V / C10uf R C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
10 The temperature profile for soldering While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-0603X7R302K500NT_C49326638.pdf

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