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quality High Voltage Ceramic Capacitor AIDE CAPACITOR 0805C0G200J500NT for LCD Backlight Unit Power Supplies factory
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quality High Voltage Ceramic Capacitor AIDE CAPACITOR 0805C0G200J500NT for LCD Backlight Unit Power Supplies factory
>
Specifications
Voltage Rating:
50V
Capacitance:
20pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G200J500NT
Model Number:
0805C0G200J500NT
Package:
0805
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage requirements.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
  • Certifications: ROHS/REACH compliance

Technical Specifications

Part Number Description Example: 1812 X7R 684 M 251 N T

Dimension Codes (L*W):

  • 0201: 0.02*0.01 inch (0.50*0.25 mm)
  • 0402: 0.04*0.02 inch (1.00*0.50 mm)
  • 0603: 0.06*0.03 inch (1.60*0.80 mm)
  • 0805: 0.08*0.05 inch (2.00*1.25 mm)
  • 1206: 0.12*0.06 inch (3.20*1.60 mm)
  • 1210: 0.12*0.10 inch (3.20*2.50 mm)
  • 1808: 0.18*0.08 inch (4.50*2.00 mm)
  • 1812: 0.18*0.12 inch (4.50*3.20 mm)
  • 1825: 0.18*0.25 inch (4.50*6.30 mm)
  • 2211: 0.22*0.11 inch (5.70*2.8 mm)
  • 2225: 0.22*0.25 inch (5.70*6.30 mm)

Temperature Characteristics:

  • C0G: 0 30 PPM/
  • X7R: 15%
  • X5R: 15%

Nominal Electrostatic Capacity (pF):

  • 8R0: 8.0
  • 100: 10
  • 101: 100

Tolerance of Electrostatic Capacity:

  • B: 0.1pF
  • C: 0.25pF
  • D: 0.5pF
  • F: 1%
  • G: 2%
  • J: 5%
  • K: 10%
  • M: 20%
  • Z: +80%/-20%

Rated Voltage (DC):

  • 250: 25V
  • 251: 250V
  • 252: 2500V

Terminal Composition: Au/Ag-Ni-Sn (From the inside out)

Packing: T (Tape/Reel), P (Bag packing)

Item Specification/Requirement Testing Method
Temperature -55~+125 -
Visual/Dimension 1. No Damage
2. Dimension meet Spec		 Naked eye (Visual inspection)
Digital calliper
Static Capacity Meet standard specification and tolerance

NPO characteristic:

  • 1000pF: 1MHz 10%, 1.0 0.2Vrms
  • 1000 pF: 1KHz 10%, 1.0 0.2Vrms

X7R/X7T/X7P characteristic:

  • 10uF: 1KHz 10%, 1.0 0.2Vrms
  • 10uF: 120Hz 24, 0.5 0.1Vrms
Dissipation Factor (DF)

NPO Characteristic:

  • DF0.56, Cr5 pF
  • DF1.5[(150/Cr)+7]10-4 (5pFCr50pF)
  • DF0.15%, (50pFCr)

X7R/X7T/X7P characteristic: see Note 1

NPO Characteristic:

  • Cr1000pF, 1MHz 10%, 1V 0.2rms
  • Cr1000pF, 1KHz 10%, 1V 0.2rms

X7R/X7T/X7P characteristic:

  • Cr10uF, 1KHz 10%, 1V 0.1rms
  • Cr10uF, 120Hz 24Hz, 0.5V 0.1rms
IR Insulation Resistance

NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF

X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF

Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) No dielectric breakdown or damage
  • Ur=100V: 2.5 x rated voltage
  • Ur=200V/250V: 2.0 x rated voltage
  • Ur=450/500/630V: 1.5 x rated voltage
  • 1KVUr2KV: 1.2 x rated voltage
  • 2KVUr: 1.1 x rated voltage

Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
Resistance to the heat of soldering No damage, soldering area90% Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic capacity change rate

NPO Characteristic: C/C0.5% or 0.5pF (larger reading)

X7R: C/C15%

X7T: -33% C/C22%

X7P: C/C10%

 -
Flexural strength No damage Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%
Terminal bonding strength No visual damage Applied Force: 5N, Duration: 101S
Thermal shock

NPO Characteristic: C/C2.5% or 0.25pF (larger reading)

X7R/X7P characteristic: C/C0.5%

X7T characteristic: C/C10%

 Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.
Temperature moisture exposure

Visual: No visual damage

Electrostatic capacitance change rate:

  • NPO characteristic: C/C2% or 1pF (larger reading)
  • X7R/X7T/X7P characteristic: C/C10%

DF: 2 times initial standard

IR:

  • NPO characteristic: IR2500M or IR*Cr25S (Lower reading)
  • X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)
 Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity.
High temperature exposure

Visual: No visual damage

Electrostatic capacitance change rate:

  • NPO: C/C2% or 1pF (larger reading)
  • X7R/X7T/X7P: C/C20%

DF: 2 X initial standard

IR:

  • NPO: IR4000M or IR*Cr40S (Lower reading)
  • X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)
 Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature.
PCB flexural strength No crack and other defect IR Soldering the MLCC on the PCB, Then pressing direction base on the photo.

Embossed Plastic Taping

Code Tape size A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max

Paper Tape Reel Packing

Code Paper size W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below -
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below -
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below -
Code Paper size A B C D E F G H J T
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max

Reel Dimensions

Unit: mm A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max

Packing Quantity

Dimension Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000 -
0805 4000 3000 (T1.35mm)
1206 - 3000 (T1.35mm)
1210 - 2000 (T1.60mm)
1808 - 3000 (T1.60mm)
1812 - 2000
1812 - 1000 (T1.85mm)
- - 800 (T1.85mm)
- - 500

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burn out, flaming, or glowing in the worst case. Adhere to the following precautions for safety and application notes. Contact the engineering section or factory for handling precautions.

  1. Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
  2. Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper handling of the soldering iron tip and temperature.
  3. Optimum Solder Amount for Reflow Soldering
  4. Recommended Soldering amounts

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
C1uf R/W
Y5V / C1uf R
C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
C4.7uf R/W
Y5V / C1uf R
C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
C10uf R/W
Y5V / C10uf R
C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering method: RReflow Soldering, WWave Soldering

The temperature profile for soldering

While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.


2509251626_AIDE-CAPACITOR-0805C0G200J500NT_C49326671.pdf

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