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Specifications
Voltage Rating:
50V
Capacitance:
4.7nF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G472J500NT
Model Number:
0805C0G472J500NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and networking circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description/Specification | Testing Method/Conditions | |
|---|---|---|---|
| Application Field | |||
| Coupling, wave filtering, resonant in high voltage circuits | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||
| Testing Conditions | |||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For data not matching testing specification | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | |||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | L*W (inch/mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | ||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||
| 7. Packing | T Tape/Reel, P Bag packing(PE) | ||
| Construction and Dimension | |||
| Dimension (mm) | Part number (British system / Metric system) L W T WB | ||
| 0.600.10 / 0.300.05 / 0.300.05 / 0.100.05 | 0201 (0603) | ||
| 1.000.15 / 0.500.15 / 0.500.10 / 0.200.10 | 0402 (1005) | ||
| 1.600.20 / 0.800.15 / 0.800.15 / 0.300.10 | 0603 (1608) | ||
| 2.000.20 / 1.250.20 / 0.800.20 / 1.000.20 | 0805 (2012) | ||
| 3.200.30 / 1.600.30 / 1.000.20 / 1.250.20 | 1206 (3216) | ||
| 3.200.30 / 2.500.30 / 2.70 / 0.800.30 | 1210 (3225) | ||
| 4.500.40 / 2.000.20 / 2.70 / 0.800.30 | 1808 (4520) | ||
| 4.500.40 / 3.200.30 / 3.50 / 0.800.30 | 1812 (4532) | ||
| 4.500.40 / 6.300.50 / 3.50 / 0.800.30 | 1825 (4563) | ||
| 5.700.50 / 5.000.50 / 3.50 / 1.000.40 | 2220 (5750) | ||
| 5.700.50 / 6.300.50 / 6.20 / 1.000.40 | 2225 (5763) | ||
| Specification and Testing Method | |||
| Temperature | -55~+125 | ||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF). | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5 pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). X7R/X7T/X7P: See Note 1. | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF). X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF). | |
| IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C10nF). X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF). | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V,...2.5 x rated voltage; Ur=200V/250V,...2.0 x rated voltage; Ur=450/500/630V,...1.5 x rated voltage; 1KVUr2KV,...1.2 x rated voltage; 2KVUr,...1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | Initial capacitance testing: Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | |
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electrostatic capacity change rate C/C10%. | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on the photo. | |
| Embossed Plastic Taping | |||
| Tape Size (mm) | Code | A B C D E F G H J T | |
| 1.55 0.20 / 2.35 0.20 / 8.00 0.20 / 3.50 0.05 / 1.75 0.10 / 4.00 0.10 / 2.00 0.10 / 4.00 0.10 / 1.50 -0/+0.10 / 1.50 Max | 0805 | ||
| 1.95 0.20 / 3.60 0.20 / 8.00 0.20 / 3.50 0.05 / 1.75 0.10 / 4.00 0.10 / 2.00 0.10 / 4.00 0.1 / 1.50 -0/+0.10 / 1.85 Max | 1206 | ||
| 2.70 0.10 / 3.42 0.10 / 8.00 0.10 / 3.50 0.05 / 1.75 0.10 / 4.00 0.10 / 2.00 0.05 / 4.00 0.10 / 1.55 -0/+0.10 / 3.2 Max | 1210 | ||
| 2.20 0.10 / 4.95 0.10 / 12.00 0.10 / 5.50 0.05 / 1.75 0.10 / 4.00 0.10 / 2.00 0.05 / 4.00 0.10 / 1.50 -0/+0.10 / 3.0 Max | 1808 | ||
| 3.66 0.10 / 4.95 0.10 / 12.00 0.10 / 5.50 0.05 / 1.75 0.10 / 8.00 0.10 / 2.00 0.05 / 4.00 0.10 / 1.55 -0/+0.10 / 4.0 Max | 1812 | ||
| Paper Tape Reel Packing | |||
| Paper Size (mm) | Code | W1 / L1 / D / C / B / P1 / P2 / P0 / d / t | |
| 0.240.02 / 0.450.02 / 8.000.10 / 3.500.05 / 1.750.10 / 2.000.05 / 2.000.05 / 4.000.10 / 1.50 -0/+0.10 / 0.30 Below | 1005 | ||
| 0.370.10 / 0.670.10 / 8.000.10 / 3.500.05 / 1.750.10 / 2.000.05 / 2.000.05 / 4.000.10 / 1.50 -0/+0.10 / 0.80 Below | 0201 | ||
| 0.650.10 / 1.150.10 / 8.000.10 / 3.500.05 / 1.750.10 / 2.000.05 / 2.000.05 / 4.000.10 / 1.50 -0/+0.10 / 0.80 Below | 0402 | ||
| Paper Size (mm) | Code | A / B / C / D / E / F / G / H / J / T | |
| 1.10 0.10 / 1.90 0.10 / 8.00 0.10 / 3.50 0.05 / 1.75 0.10 / 4.00 0.10 / 2.00 0.10 / 4.00 0.10 / 1.50 -0/+0.10 / 1.10 Max | 0603 | ||
| 1.45 0.15 / 2.30 0.15 / 8.0 0.15 / 3.50 0.05 / 1.75 0.10 / 4.00 0.10 / 2.00 0.10 / 4.00 0.10 / 1.50 -0/+0.10 / 1.10 Max | 0805 | ||
| 1.80 0.20 / 3.40 0.20 / 8.00 0.20 / 3.50 0.05 / 1.75 0.10 / 4.00 0.10 / 2.00 0.10 / 4.00 0.10 / 1.50 -0/+0.10 / 1.10 Max | 1206 | ||
| Reel Dimensions (unit: mm) | |||
| 7REEL | 1782.0 / 3.0 / 130.5 / 210.5 / 21 or Bigger / 1010.5 / 12max | A B C D E F G | |
| 13REEL | 3302.0 / 3.0 / 130.5 / 210.5 / 21 or Bigger / 1010.5 / 12max | A B C D E F G | |
| Taping Specification | |||
| Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping, (b) Embossed Taping | |
| Packing Quantity | |||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | |
| 0603 | 4000 | - | |
| 0805 | 4000 | 3000 (T1.35mm), 3000 (T1.35mm) | |
| 1206 | - | 2000 (T1.60mm), 3000 (T1.60mm) | |
| 1210 | - | 2000 | |
| 1808 | - | 1000 (T1.85mm) | |
| 1812 | - | 1000 (T1.85mm) | |
| 1812 | - | 800 / 500 | |
| Precautions For Use | |||
| Soldering Profile | To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | (Refer to the graph in the enclosure page) | |
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact. | ||
| Optimum Solder Amount for Reflow Soldering | |||
| Recommended Soldering amounts | |||
| Recommended Soldering Method | |||
| Size | Temperature Characteristics | Capacitance | Soldering Method |
| 1005 | NPO / X7R/X5R/X7S/X6S | / / | R |
| 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | / / | R |
| 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | / / | R |
| 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | / C1uf / C1uf | R/W / R / R/W |
| 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | / C4.7uf / C1uf | R/W / R / R/W |
| 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | / C10uf / C10uf | R/W / R / R/W |
| 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | / / | R |
| Soldering Method: RReflow Soldering, WWave Soldering | |||
| The temperature profile for soldering | |||
| Keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |||
2509251626_AIDE-CAPACITOR-0805C0G472J500NT_C49326676.pdf
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