<
>
Specifications
Voltage Rating:
50V
Capacitance:
680pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R681K500NT
Model Number:
0805X7R681K500NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These capacitors offer reliable performance in demanding medium and high voltage environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) | - |
| Testing Condition (Normal) | Temperature: 15~35 Humidity: 45~75%RH Atmosphere: 86~106kPa | - |
| Testing Condition (Relative) | Temperature: 252 Humidity: 60~70%RH Atmosphere: 86~106kPa | - |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | - |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | - |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | - |
| Packing | T (Tape/Reel), P (Bag packing) | - |
| Temperature Range | -55~+125 | - |
| Static Capacity (NPO) | 1000pF: 1MHz10%, 1.00.2Vrms 1000pF: 1KHz10%, 1.00.2Vrms | - |
| Static Capacity (X7R/X7T/X7P) | 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | - |
| Insulation Resistance (NPO) | IR50000M (C10nF) IR*Cr500S (C10nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Insulation Resistance (X7R/X7T/X7P) | IR10000M (C25nF) IR*Cr100S (C25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area90%, No Damage | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux; Soldering temperature 2455, Solder time 20.5s |
| Resistance to the heat of soldering | No Damage, Soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate (NPO) | C/C0.5% or 0.5pF (larger reading) | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. |
| Electrostatic Capacity Change Rate (X7R) | C/C15% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. |
| Electrostatic Capacity Change Rate (X7T) | -33% C/C22% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. |
| Electrostatic Capacity Change Rate (X7P) | C/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. |
| Flexural Strength | No Damage; Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB; PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm; Flexural depth: 1mm; Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock (NPO) | C/C2.5% or 0.25pF (larger reading) | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. |
| Thermal Shock (X7R/X7P) | C/C0.5% | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. |
| Thermal Shock (X7T) | C/C10% | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. |
| Temperature Moisture Exposure (NPO) | C/C2% or 1pF (larger reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. |
| Temperature Moisture Exposure (X7R/X7T/X7P) | C/C10% | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. |
| High Temperature Exposure (NPO) | C/C2% or 1pF (larger reading) | Temperature 1253, Time 100048 hours. Test it after place 48 hours under normal pressure & temperature. |
| High Temperature Exposure (X7R/X7T/X7P) | C/C20% | Temperature 1253, Time 100048 hours. Test it after place 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction base on the photo. |
| Embossed Plastic Taping Dimensions (0805) | Tape size: 1.55 0.20 mm (A), 2.35 0.20 mm (B), 8.00 0.20 mm (C), 3.50 0.05 mm (D), 1.75 0.10 mm (E), 4.00 0.10 mm (F), 2.00 0.10 mm (G), 4.00 0.10 mm (H), 1.50 -0/+0.10 mm (J), 1.50 Max mm (T) | - |
| Embossed Plastic Taping Dimensions (1206) | Tape size: 1.95 0.20 mm (A), 3.60 0.20 mm (B), 8.00 0.20 mm (C), 3.50 0.05 mm (D), 1.75 0.10 mm (E), 4.00 0.10 mm (F), 2.00 0.10 mm (G), 4.00 0.1 mm (H), 1.50 -0/+0.10 mm (J), 1.85 Max mm (T) | - |
| Embossed Plastic Taping Dimensions (1210) | Tape size: 2.70 0.10 mm (A), 3.42 0.10 mm (B), 8.00 0.10 mm (C), 3.50 0.05 mm (D), 1.75 0.10 mm (E), 4.00 0.10 mm (F), 2.00 0.05 mm (G), 4.00 0.10 mm (H), 1.55 -0/+0.10 mm (J), 3.2 Max mm (T) | - |
| Embossed Plastic Taping Dimensions (1808) | Tape size: 2.20 0.10 mm (A), 4.95 0.10 mm (B), 12.00 0.10 mm (C), 5.50 0.05 mm (D), 1.75 0.10 mm (E), 4.00 0.10 mm (F), 2.00 0.05 mm (G), 4.00 0.10 mm (H), 1.50 -0/+0.10 mm (J), 3.0 Max mm (T) | - |
| Embossed Plastic Taping Dimensions (1812) | Tape size: 3.66 0.10 mm (A), 4.95 0.10 mm (B), 12.00 0.10 mm (C), 5.50 0.05 mm (D), 1.75 0.10 mm (E), 8.00 0.10 mm (F), 2.00 0.05 mm (G), 4.00 0.10 mm (H), 1.55 -0/+0.10 mm (J), 4.0 Max mm (T) | - |
| Paper Tape Reel Packing (1005) | Paper size: 0.240.02 mm (W1), 0.450.02 mm (L1), 8.000.10 mm (D), 3.500.05 mm (C), 1.750.10 mm (B), 2.000.05 mm (P1), 2.000.05 mm (P2), 4.000.10 mm (P0), 1.50 -0/+0.10 mm (d), 0.30 Below mm (t) | - |
| Paper Tape Reel Packing (0201) | Paper size: 0.370.10 mm (W1), 0.670.10 mm (L1), 8.000.10 mm (D), 3.500.05 mm (C), 1.750.10 mm (B), 2.000.05 mm (P1), 2.000.05 mm (P2), 4.000.10 mm (P0), 1.50 -0/+0.10 mm (d), 0.80 Below mm (t) | - |
| Paper Tape Reel Packing (0402) | Paper size: 0.650.10 mm (W1), 1.150.10 mm (L1), 8.000.10 mm (D), 3.500.05 mm (C), 1.750.10 mm (B), 2.000.05 mm (P1), 2.000.05 mm (P2), 4.000.10 mm (P0), 1.50 -0/+0.10 mm (d), 0.80 Below mm (t) | - |
| Paper Tape Reel Packing (0603) | Paper size: 1.10 0.10 mm (A), 1.90 0.10 mm (B), 8.00 0.10 mm (C), 3.50 0.05 mm (D), 1.75 0.10 mm (E), 4.00 0.10 mm (F), 2.00 0.10 mm (G), 4.00 0.10 mm (H), 1.50 -0/+0.10 mm (J), 1.10 Max mm (T) | - |
| Paper Tape Reel Packing (0805) | Paper size: 1.45 0.15 mm (A), 2.30 0.15 mm (B), 8.0 0.15 mm (C), 3.50 0.05 mm (D), 1.75 0.10 mm (E), 4.00 0.10 mm (F), 2.00 0.10 mm (G), 4.00 0.10 mm (H), 1.50 -0/+0.10 mm (J), 1.10 Max mm (T) | - |
| Paper Tape Reel Packing (1206) | Paper size: 1.80 0.20 mm (A), 3.40 0.20 mm (B), 8.00 0.20 mm (C), 3.50 0.05 mm (D), 1.75 0.10 mm (E), 4.00 0.10 mm (F), 2.00 0.10 mm (G), 4.00 0.10 mm (H), 1.50 -0/+0.10 mm (J), 1.10 Max mm (T) | - |
| Reel Dimensions (7REEL) | 1782.0 mm (A), 3.0 mm (B), 130.5 mm (C), 210.5 mm (D), 21 or Bigger (E), 1010.5 mm (F), 12 max mm (G) | - |
| Reel Dimensions (13REEL) | 3302.0 mm (A), 3.0 mm (B), 130.5 mm (C), 210.5 mm (D), 21 or Bigger (E), 1010.5 mm (F), 12 max mm (G) | - |
| Top Tape Peeling Strength (Embossed Taping) | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| Packing Quantity (Paper T/R) | 0603: 4000 pcs, 0805: 4000 pcs | - |
| Packing Quantity (Plastic T/R) | 0805: 3000 pcs (T1.35mm), 3000 pcs (T1.35mm) 1206: 2000 pcs (T1.60mm), 3000 pcs (T1.60mm) 1210: 2000 pcs 1808: 1000 pcs (T1.85mm), 1000 pcs (T1.85mm) 1812: 800 pcs 1812: 500 pcs | - |
Dimensions (mm)
| Part Number | Dimension (mm) L | Dimension (mm) W | Dimension (mm) T | Dimension (mm) WB |
|---|---|---|---|---|
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Following precautions for safety and application notes are recommended. Contact engineering for handling questions.
- Soldering Profile: Avoid cracks due to sudden temperature changes by following the recommended temperature profile.
- Manual Soldering: Handle soldering irons carefully to prevent thermal cracks and damage to the capacitor.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| / | C1uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| / | C4.7uf | R/W | ||
| Y5V | / | C1uf | R | |
| / | C1uf | R/W | ||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| / | C10uf | R/W | ||
| Y5V | / | C10uf | R | |
| / | C10uf | R/W | ||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
Preheating temperature difference between soldering temperature and surface temperature of chips: T150.
2509251626_AIDE-CAPACITOR-0805X7R681K500NT_C49326722.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
