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quality High voltage MLCC capacitor AIDE CAPACITOR 1206X5R106K250NT used in LCD backlight units and energy saving lamp power supplies factory
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quality High voltage MLCC capacitor AIDE CAPACITOR 1206X5R106K250NT used in LCD backlight units and energy saving lamp power supplies factory
>
Specifications
Voltage Rating:
25V
Capacitance:
10uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
1206X5R106K250NT
Model Number:
1206X5R106K250NT
Package:
1206
Key Attributes
Product Description

Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance in demanding electrical environments.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • RoHS Compliance: Meets RoHS standard
  • REACH Compliance: Meets REACH standard

Technical Specifications

Item Description Specification
Application Field High voltage circuits
Function Coupling, wave filtering, resonant
Applications Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps
Type Medium and High voltage MLCC
Testing Conditions Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Example 1812 X7R 684 M 251 N T
Components Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance of Electrostatic Capacity, Rated Voltage (DC), Terminal Composition, Packing
Dimension Codes Code L*W (inch) L*W (mm)
0201 0.02*0.01 0.50*0.25
0402 0.04*0.02 1.00*0.50
0603 0.06*0.03 1.60*0.80
0805 0.08*0.05 2.00*1.25
1206 0.12*0.06 3.20*1.60
1210 0.12*0.10 3.20*2.50
1808 0.18*0.08 4.50*2.00
1812 0.18*0.12 4.50*3.20
1825 0.18*0.25 4.50*6.30
2211 0.22*0.11 5.70*2.8
2225 0.22*0.25 5.70*6.30
Temperature Characteristic C0G 0 30 PPM/
X7R 15%
X5R 15%
Nominal Electrostatic Capacity 8R0 8.0 pF
100 10 pF
101 100 pF
Tolerance of Electrostatic Capacity B 0.1pF
C 0.25pF
D 0.5pF
F 1%
G 2%
J 5%
K 10%
M 20%
Z +80%/-20%
Rated Voltage (DC) 250 25 V
251 250 V
252 2500 V
Construction 1 Ceramic dielectric
2 Inner electrode
3 Outer electrode
Physical Dimensions (mm) Part Number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method Item Specification/Requirement Testing Method
Temperature -55~+125 N/A
Visual/Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
Static Capacity Meet standard specification and tolerance See detailed specification for NPO and X7R/X7T/X7P characteristics
Dissipation Factor (DF) See detailed specification for NPO and X7R/X7T/X7P characteristics See detailed specification for NPO and X7R/X7T/X7P characteristics
IR Insulation Resistance NPO: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) No dielectric breakdown or damage. Voltage depends on rated voltage (Ur). Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area 90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
Resistance to the heat of soldering No visual damage, soldering area 90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic capacity change rate NPO: 0.5% or 0.5pF. X7R: 15%. X7T: -33% to +22%. X7P: 10%. Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature.
Flexural strength No damage. Electro static capacity change rate: 10%. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
Terminal bonding strength No visual damage. Applied Force: 5N, Duration: 101S.
Thermal shock NPO: 2.5% or 0.25pF. X7R/X7P: 0.5%. X7T: 10%. Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after 242 hours normal temp & humidity.
Temperature moisture exposure Visual: No visual damage. Capacitance change rate: NPO: 2% or 1pF. X7R/X7T/X7P: 10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity.
High temperature exposure Visual: No visual damage. Capacitance change rate: NPO: 2% or 1pF. X7R/X7T/X7P: 20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature.
PCB flexural strength No crack and other defect. IR Soldering the MLCC on the PCB, then pressing direction based on photo.
Embossed Plastic Taping Type Tape Size (mm) A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max
Paper Tape Reel Packing Code Paper Size (mm) W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
Paper Tape Reel Packing Code Paper Size (mm) A B C D E F G H J T
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
Reel Dimensions (unit: mm) Type A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
Taping Specification Top tape peeling strength Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. (a) Paper Taping
(b) Embossed Taping
Packing Quantity Dimension Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000
0805 4000 3000 (T1.35mm)
1206 3000 (T>1.35mm)
1210 2000 (T1.60mm)
1808 3000 (T>1.60mm)
1812 2000
1812 1000 (T1.85mm)
800 (T>1.85mm)
500
ROHS/REACH Compliance ROHS Meet the standard N/A
REACH Meet the standard N/A
Precautions For Use The MLCC may fail in a short circuit mode when subjected to severe conditions beyond the specified rating and conditions, which may result in burn out, flaming or glowing. Following precautions and application notes should be considered. Contact engineering or factory for questions.
Soldering Profile To avoid cracks due to sudden temperature change, follow the temperature profile graph.
Manual Soldering Manual soldering poses a risk of thermal cracks. Handle soldering iron carefully, paying attention to tip selection and temperature contact.
Optimum Solder Amount for Reflow Soldering Recommended soldering amounts.
Recommended Soldering Method Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
C1uf R/W
Y5V / C1uf R
C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
C4.7uf R/W
Y5V / C1uf R
C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
C10uf R/W
Y5V / C10uf R
C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
The temperature profile for soldering While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-1206X5R106K250NT_C49326738.pdf

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