Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS Compliance: Meets RoHS standard
- REACH Compliance: Meets REACH standard
Technical Specifications
| Item | Description | Specification | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | High voltage circuits | |||||||||||
| Function | Coupling, wave filtering, resonant | |||||||||||
| Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |||||||||||
| Type | Medium and High voltage MLCC | |||||||||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||||
| Part Number Description | Example | 1812 X7R 684 M 251 N T | ||||||||||
| Components | Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance of Electrostatic Capacity, Rated Voltage (DC), Terminal Composition, Packing | |||||||||||
| Dimension Codes | Code | L*W (inch) | L*W (mm) | |||||||||
| 0201 | 0.02*0.01 | 0.50*0.25 | ||||||||||
| 0402 | 0.04*0.02 | 1.00*0.50 | ||||||||||
| 0603 | 0.06*0.03 | 1.60*0.80 | ||||||||||
| 0805 | 0.08*0.05 | 2.00*1.25 | ||||||||||
| 1206 | 0.12*0.06 | 3.20*1.60 | ||||||||||
| 1210 | 0.12*0.10 | 3.20*2.50 | ||||||||||
| 1808 | 0.18*0.08 | 4.50*2.00 | ||||||||||
| 1812 | 0.18*0.12 | 4.50*3.20 | ||||||||||
| 1825 | 0.18*0.25 | 4.50*6.30 | ||||||||||
| 2211 | 0.22*0.11 | 5.70*2.8 | ||||||||||
| 2225 | 0.22*0.25 | 5.70*6.30 | ||||||||||
| Temperature Characteristic | C0G | 0 30 PPM/ | ||||||||||
| X7R | 15% | |||||||||||
| X5R | 15% | |||||||||||
| Nominal Electrostatic Capacity | 8R0 | 8.0 pF | ||||||||||
| 100 | 10 pF | |||||||||||
| 101 | 100 pF | |||||||||||
| Tolerance of Electrostatic Capacity | B | 0.1pF | ||||||||||
| C | 0.25pF | |||||||||||
| D | 0.5pF | |||||||||||
| F | 1% | |||||||||||
| G | 2% | |||||||||||
| J | 5% | |||||||||||
| K | 10% | |||||||||||
| M | 20% | |||||||||||
| Z | +80%/-20% | |||||||||||
| Rated Voltage (DC) | 250 | 25 V | ||||||||||
| 251 | 250 V | |||||||||||
| 252 | 2500 V | |||||||||||
| Construction | 1 | Ceramic dielectric | ||||||||||
| 2 | Inner electrode | |||||||||||
| 3 | Outer electrode | |||||||||||
| Physical Dimensions (mm) | Part Number | L | W | T | WB | |||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||||
| Specification and Testing Method | Item | Specification/Requirement | Testing Method | |||||||||
| Temperature | -55~+125 | N/A | ||||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||||
| Static Capacity | Meet standard specification and tolerance | See detailed specification for NPO and X7R/X7T/X7P characteristics | ||||||||||
| Dissipation Factor (DF) | See detailed specification for NPO and X7R/X7T/X7P characteristics | See detailed specification for NPO and X7R/X7T/X7P characteristics | ||||||||||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||||
| Hi-pot (DC) | No dielectric breakdown or damage. Voltage depends on rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||||
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||||
| Electrostatic capacity change rate | NPO: 0.5% or 0.5pF. X7R: 15%. X7T: -33% to +22%. X7P: 10%. | Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature. | ||||||||||
| Flexural strength | No damage. Electro static capacity change rate: 10%. | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | ||||||||||
| Terminal bonding strength | No visual damage. | Applied Force: 5N, Duration: 101S. | ||||||||||
| Thermal shock | NPO: 2.5% or 0.25pF. X7R/X7P: 0.5%. X7T: 10%. | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after 242 hours normal temp & humidity. | ||||||||||
| Temperature moisture exposure | Visual: No visual damage. Capacitance change rate: NPO: 2% or 1pF. X7R/X7T/X7P: 10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity. | ||||||||||
| High temperature exposure | Visual: No visual damage. Capacitance change rate: NPO: 2% or 1pF. X7R/X7T/X7P: 20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. | ||||||||||
| PCB flexural strength | No crack and other defect. | IR Soldering the MLCC on the PCB, then pressing direction based on photo. | ||||||||||
| Embossed Plastic Taping | Type | Tape Size (mm) | A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | ||
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | ||
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | ||
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | ||
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | ||
| Paper Tape Reel Packing | Code | Paper Size (mm) | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | ||
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | ||
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | ||
| Paper Tape Reel Packing | Code | Paper Size (mm) | A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| Reel Dimensions (unit: mm) | Type | A | B | C | D | E | F | G | ||||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||||
| Taping Specification | Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping | |||||||||
| (b) Embossed Taping | ||||||||||||
| Packing Quantity | Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | |||||||||
| 0603 | 4000 | |||||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||||
| 1206 | 3000 (T>1.35mm) | |||||||||||
| 1210 | 2000 (T1.60mm) | |||||||||||
| 1808 | 3000 (T>1.60mm) | |||||||||||
| 1812 | 2000 | |||||||||||
| 1812 | 1000 (T1.85mm) | |||||||||||
| 800 (T>1.85mm) | ||||||||||||
| 500 | ||||||||||||
| ROHS/REACH Compliance | ROHS | Meet the standard | N/A | |||||||||
| REACH | Meet the standard | N/A | ||||||||||
| Precautions For Use | The MLCC may fail in a short circuit mode when subjected to severe conditions beyond the specified rating and conditions, which may result in burn out, flaming or glowing. Following precautions and application notes should be considered. Contact engineering or factory for questions. | |||||||||||
| Soldering Profile | To avoid cracks due to sudden temperature change, follow the temperature profile graph. | |||||||||||
| Manual Soldering | Manual soldering poses a risk of thermal cracks. Handle soldering iron carefully, paying attention to tip selection and temperature contact. | |||||||||||
| Optimum Solder Amount for Reflow Soldering | Recommended soldering amounts. | |||||||||||
| Recommended Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | |||||||
| 1005 | NPO | / | / | R | ||||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||||
| 0201 | NPO | / | / | R | ||||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||||
| Y5V | / | / | R | |||||||||
| 0402 | NPO | / | / | R | ||||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||||
| Y5V | / | / | R | |||||||||
| 0603 | NPO | / | / | R/W | ||||||||
| X7R/X5R/X7S/X6S | / | C1uf | R | |||||||||
| C1uf | R/W | |||||||||||
| Y5V | / | C1uf | R | |||||||||
| C1uf | R/W | |||||||||||
| 0805 | NPO | / | / | R/W | ||||||||
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |||||||||
| C4.7uf | R/W | |||||||||||
| Y5V | / | C1uf | R | |||||||||
| C1uf | R/W | |||||||||||
| 1206 | NPO | / | / | R/W | ||||||||
| X7R/X5R/X7S/X6S | / | C10uf | R | |||||||||
| C10uf | R/W | |||||||||||
| Y5V | / | C10uf | R | |||||||||
| C10uf | R/W | |||||||||||
| 1210 | NPO | / | / | R | ||||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||||
| Y5V | / | / | R | |||||||||
| The temperature profile for soldering | While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |||||||||||
2509251626_AIDE-CAPACITOR-1206X5R106K250NT_C49326738.pdf
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