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Specifications
Voltage Rating:
50V
Capacitance:
2.2uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
1206X5R225K500NT
Model Number:
1206X5R225K500NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Details | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. (Medium and High voltage MLCC) | ||||||||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||||
| Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | ||||||||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||||||||
| Packing | T Tape/Reel, P Bag packing (PE) | ||||||||||
| Construction | Item | Description | |||||||||
| 1 | Ceramic dielectric | ||||||||||
| 2 | Inner electrode | ||||||||||
| 3 | Outer electrode | ||||||||||
| 4 | Nickle layer | ||||||||||
| 5 | Tin layer | ||||||||||
| Dimension (mm) | Part number | L Tol | W Tol | T Tol | WB Tol | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||||
| Temperature Range | -55~+125 | Testing Method | N/A | ||||||||
| Dissipation Factor (DF) | Refer to Specification Table (Note 1) | Testing Method | Refer to Specification Table | ||||||||
| Insulation Resistance (IR) | NPO: 50000M (C10nF), IR*Cr500S (C>10nF) X7R/X7T/X7P: 10000M (C25nF), IR*Cr100S (C>25nF) | Testing Method | Rated voltage, 605s, Humidity:75%, Temp:255, Current:50mA | ||||||||
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Testing Method | Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||
| Solderability | Soldering area 90%, No Damage | Testing Method | Pre-heating: 80-120 (10-30s), Solder: 2455 (20.5s) | ||||||||
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Testing Method | Pre-heating: 100-200 (102s), Soldering: 2655 (51s), Cleaning, Room temp. (242 hours) | ||||||||
| Flexural Strength | No damage, Electrostatic capacity change rate 10% | Testing Method | Base board Al2O3/PCB (1.6mm thick), Flexural depth: 1mm, Bend speed: 0.5mm/sec | ||||||||
| Terminal Bonding Strength | No visual damage | Testing Method | Applied Force: 5N, Duration: 101S | ||||||||
| Thermal Shock | NPO: |C/C|2.5% or 0.25pF X7R/X7P: |C/C|0.5% X7T: -33% C/C22% | Testing Method | 5 cycles, Test after 242 hours at normal temp & humidity | ||||||||
| Temperature Moisture Exposure | Visual: No damage Capacitance change rate: NPO: |C/C|2% or 1pF, X7R/X7T/X7P: |C/C|10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S, X7R/X7T/X7P: IR1000M or IR*Cr25S | Testing Method | 402, 90~95%RH, 50024 hours | ||||||||
| High Temperature Exposure | Visual: No damage Capacitance change rate: NPO: |C/C|2% or 1pF, X7R/X7T/X7P: |C/C|20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S, X7R/X7T/X7P: IR2000M or IR*Cr50S | Testing Method | 1253, 100048 hours, Voltage: 100VV250V (2x Rated), 250VV1KV (1.5x Rated), 1KVV (1.2x Rated) | ||||||||
| PCB Flexural Strength | No crack and other defect | Testing Method | IR measurement after soldering MLCC on PCB | ||||||||
| Embossed Plastic Taping Dimensions (mm) | Code | A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.550.20 | 2.350.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.950.20 | 3.600.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.700.10 | 3.420.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1808 | 2.200.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 3.0 Max | |
| 1812 | 3.660.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 8.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 4.0 Max | |
| Paper Tape Reel Packing Dimensions (mm) | Code | Papersize W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0603 | 1.100.10 | 1.900.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.450.15 | 2.300.15 | 8.00.15 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.800.20 | 3.400.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (mm) | Unit | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||||
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | ||||||||||
| Packing Quantity (Pcs) | Size | Paper T/R | Plastic T/R | ||||||||
| 0603 | 4000 | - | |||||||||
| 0805 | 4000 | 3000 (T1.35mm) | |||||||||
| 1206 | - | 3000 (T1.60mm) / 2000 (T>1.60mm) | |||||||||
| 1210 | - | 1000 (T1.85mm) / 800 (T>1.85mm) | |||||||||
| 1812 | - | 500 | |||||||||
Precautions for Use
To prevent failures, especially under severe electrical or mechanical stress, adhere to the specified ratings and conditions. MLCCs may fail in short or open circuit modes, potentially leading to burnout, flaming, or glowing. Always consider the "Precautions for Safety" and "Application Notes." Consult the engineering section or factory for handling precautions.
- Soldering Profile: Follow the provided temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
During preheating, maintain the temperature difference between soldering temperature and chip surface temperature as T150.
2509251626_AIDE-CAPACITOR-1206X5R225K500NT_C49326746.pdf
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