<
>
Specifications
Voltage Rating:
10V
Capacitance:
47uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
1206X5R476M100NT
Model Number:
1206X5R476M100NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electrical systems, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in a range of sizes and with different temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition).
- Certifications: ROHS compliant, REACH compliant.
- Packing Options: Tape/Reel (T), Bag packing (P).
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions: - Normal: Temperature 15~35, Humidity 45~75%RH, Atmosphere 86~106kPa - Relative: Temperature 252, Humidity 60~70%RH, Atmosphere 86~106kPa | |||
| Part Number Description | 1. Dimension Code | 0201 (0.02"x0.01" / 0.50x0.25mm) to 2225 (0.22"x0.25" / 5.70x6.30mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| 3. Nominal Electrostatic Capacity | e.g., 8R0=8.0pF, 100=10pF, 101=100pF | ||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||
| 5. Rated Voltage (DC) | e.g., 250=25V, 251=250V, 252=2500V | ||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||
| 7. Packing | T (Tape/Reel), P (Bag packing) | ||
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimension (mm) | Various sizes available from 0.60x0.30mm (0201) up to 5.70x6.30mm (2225) with specified tolerances. | ||
| Specification and Testing Method | Temperature Range | -55~+125 | - |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static Capacity | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | Frequency and Voltage dependent (details in document) | |
| Dissipation Factor (DF) | See Note 1 for X7R/X5R/X6S/X7S/Y5V characteristics. NPO characteristic specifications provided. | Frequency and Voltage dependent (details in document) | |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage is a multiple of rated voltage (e.g., 2.5 x rated voltage for Ur=100V). | Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area 90%, No Damage. | Pre-heating 80-120 (10-30s), Lead free solder, flux. Soldering temp 2455 (20.5s). | |
| Resistance to the heat of soldering | No visual damage, soldering area 90%. | Pre-heating 100-200 (102s), Soldering temp 2655 (51s). Cleaning with solvent. Room temp, 242 hours. | |
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF. X7R: 15%. X7T: -33% to 22%. X7P: 10%. | Pre-heating 150 (1 hour), then 48 hours under normal conditions. | |
| Flexural Strength | No damage. Capacity change rate 10%. | Base board Al2O3/PCB (1.6mm thick). Flexural depth 1mm, Bend speed 0.5mm/sec. | |
| Terminal Bonding Strength | No visual damage. | Applied Force: 5N, Duration: 101S. | |
| Thermal Shock | NPO: 2.5% or 0.25pF. X7R/X7P: 0.5%. X7T: 10%. | 5 cycles of thermal shock after pre-conditioning. Test after 242 hours at normal temp & humidity. | |
| Temperature Moisture Exposure | Visual: No damage. Capacity change rate: NPO 2% or 1pF. X7R/X7T/X7P 10%. DF 2 times initial standard. IR: NPO 2500M or IR*Cr25S. X7R/X7T/X7P 1000M or IR*Cr25S. | 402, 90~95%RH for 50024 hours. Test after 242 hours at normal temp & humidity. | |
| High Temperature Exposure | Visual: No damage. Capacity change rate: NPO 2% or 1pF. X7R/X7T/X7P 20%. DF 2 X initial standard. IR: NPO 4000M or IR*Cr40S. X7R/X7T/X7P 2000M or IR*Cr50S. | 1253 for 100048 hours. Voltage dependent (e.g., 2x Rated voltage for 100VV250V). Test after 48 hours under normal conditions. | |
| PCB Flexural Strength | No crack and other defect. | MLCC soldered on PCB, pressed according to specified dimensions (A, B, C). | |
| Embossed Plastic Taping | Dimensions provided for tape sizes: 0805 (1.55mm width) to 1812 (3.66mm width). Reel dimensions specified. Top tape peeling strength: 0.1N < strength < 0.7N. | - | |
| Paper Tape Reel Packing | Dimensions provided for various paper tape sizes (e.g., 1005, 0201, 0402, 0603, 0805, 1206). Reel dimensions specified. | - | |
| Packing Quantity | Paper T/R (Pcs): 4000 (0603, 0805), 2000 (1206). Plastic T/R (Pcs): 3000 (0805, 1210), 2000 (1812), 1000 (1812+). | - | |
| Precautions For Use | MLCCs may fail short circuit or open circuit under severe conditions. Follow safety precautions and application notes. Contact engineering for handling questions. | ||
| Soldering Profile: Follow graph (adjacent page) to avoid cracks. Manual soldering requires careful handling. Optimum solder amount and recommended methods (Reflow/Wave) are detailed. Temperature profile for soldering specified (T150 temperature difference). | |||
2509251626_AIDE-CAPACITOR-1206X5R476M100NT_C49326752.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
