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Specifications
Voltage Rating:
200V
Capacitance:
100nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R104K201NT
Model Number:
1206X7R104K201NT
Package:
1206
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer various temperature characteristics, tolerances, and voltage ratings to meet diverse circuit requirements.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Application Field | High voltage circuits: coupling, wave filtering, resonant. Applications include switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, energy saving lamps. (Medium and High voltage MLCC) | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| 3. Part Number Description Example: 1812 X7R 684 M 251 N T | 1. Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| 3. Nominal Electrostatic Capacity | 8R0 (8.0 pF), 100 (10 pF), 101 (100 pF) | ||
| 4. Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | ||
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | ||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||
| 7. Packing | T (Tape/Reel), P (Bag packing) | ||
| 4. Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimension (mm) | 0201 (0603): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 0402 (1005): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 0603 (1608): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10 0805 (2012): L 2.000.20, W 1.250.20, T 0.800.20, WB 0.500.20 1206 (3216): L 3.200.30, W 1.600.30, T 1.000.20, WB 0.600.30 1210 (3225): L 3.200.30, W 2.500.30, T 2.70, WB 0.800.30 1808 (4520): L 4.500.40, W 2.000.20, T 2.70, WB 0.800.30 1812 (4532): L 4.500.40, W 3.200.30, T 3.50, WB 0.800.30 1825 (4563): L 4.500.40, W 6.300.50, T 3.50, WB 0.800.30 2220 (5750): L 5.700.50, W 5.000.50, T 3.50, WB 1.000.40 2225 (5763): L 5.700.50, W 6.300.50, T 6.20, WB 1.000.40 | ||
| 5. Specification and Testing Method | Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | ||
| Static Capacity | NPO: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | ||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. (See Note 1 for exceptions) | ||
| 5. Specification and Testing Method (Cont.) | IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | |
| Hi-pot (DC) | Breakdown Voltage: Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | ||
| 5. Specification and Testing Method (Cont.) | Solderability | Soldering area90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| 5. Specification and Testing Method (Cont.) | Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| 5. Specification and Testing Method (Cont.) | Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | |
| 5. Specification and Testing Method (Cont.) | Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%. | |
| 5. Specification and Testing Method (Cont.) | Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | |
| 5. Specification and Testing Method (Cont.) | Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. Run 5 cycles. Test after placing 242 hours at normal temp & humidity. | |
| 5. Specification and Testing Method (Cont.) | Temperature Moisture Exposure | Visual: No visual damage. Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | |
| 5. Specification and Testing Method (Cont.) | High Temperature Exposure | Visual: No visual damage. Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | |
| 14. PCB Flexural Strength | No crack and other defect. IR. Solder MLCC on PCB, then pressing direction based on photo. SIZE: 0805(2012): A 1.2 B 4 C 1.65; 1206(3216): A 2.2 B 5 C 2; 1210(3225): A 2.2 B 5 C 2.9; 1812(4532): A 3.5 B 7 C 3.7; 2220(5750): A 4.5 B 8 C 5.6. | ||
| 6. Embossed Plastic Taping | Embossed tape reel packing for 0805(2012)~1812(4532) type | 0805: Tapesize 1.550.20, A 2.350.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.10, H 1.50 -0/+0.10, J 1.50 Max. 1206: Tapesize 1.950.20, A 3.600.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.1, H 1.50 -0/+0.10, J 1.85 Max. 1210: Tapesize 2.700.10, A 3.420.10, B 8.000.10, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 3.2 Max. 1808: Tapesize 2.200.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.50 -0/+0.10, J 3.0 Max. 1812: Tapesize 3.660.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 8.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 4.0 Max. | |
| Paper tape reel packing for 1005(0402)~1206(3216) | 1005: Papersize W1 0.240.02, L1 0.450.02, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.30. 0201: Papersize W1 0.370.10, L1 0.670.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80. 0402: Papersize W1 0.650.10, L1 1.150.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80. 0603: Papersize A 1.100.10, B 1.900.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max. 0805: Papersize A 1.450.15, B 2.300.15, C 8.00.15, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max. 1206: Papersize A 1.800.20, B 3.400.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max. | ||
| Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | ||
| 7. Packing Quantity | Paper T/R (Pcs): 0603: 4000, 0805: 4000. Plastic T/R (Pcs): 0805: 3000 (T1.35mm), 3000 (T>1.35mm); 1206: 2000 (T1.60mm), 3000 (T>1.60mm); 1210: 2000; 1808: 1000 (T1.85mm), 1000 (T>1.85mm); 1812: 800; 1812: 500. | ||
| 8. Precautions For Use | MLCCs may fail in short or open circuit modes under severe electrical/mechanical stress beyond ratings. Follow safety precautions and application notes. Refer to soldering profile graph for avoiding cracks due to temperature change. Handle soldering irons carefully during manual soldering. Use optimum solder amount for reflow soldering. | ||
| 9. Recommended Soldering Method | 1005: NPO/X7R/X5R/X7S/X6S: R. 0201: NPO/X7R/X5R/X7S/X6S/Y5V: R. 0402: NPO/X7R/X5R/X7S/X6S/Y5V: R. 0603: NPO: R/W; X7R/X5R/X7S/X6S: C1uf R, C1uf R/W; Y5V: C1uf R, C1uf R/W. 0805: NPO: R/W; X7R/X5R/X7S/X6S: C4.7uf R, C4.7uf R/W; Y5V: C1uf R, C1uf R/W. 1206: NPO: R/W; X7R/X5R/X7S/X6S: C10uf R, C10uf R/W; Y5V: C10uf R, C10uf R/W. 1210: NPO: R; X7R/X5R/X7S/X6S/Y5V: R. (RReflow Soldering, WWave Soldering) | ||
| 10. Soldering Temperature Profile | Preheating temperature difference (soldering temperature and surface temperature of chips): T150. | ||
2509251626_AIDE-CAPACITOR-1206X7R104K201NT_C49326762.pdf
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