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Specifications
Voltage Rating:
500V
Capacitance:
100nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R104K501NT
Model Number:
1206X7R104K501NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCC offers a range of temperature characteristics, including C0G, X7R, and X5R, with precise capacitance tolerances and rated voltages.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. (Medium and High voltage MLCC). | |
| Testing Conditions | Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A |
| Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature characteristic (C0G, X7R, X5R) Nominal electrostatic capacity (pF) Tolerance of electrostatic capacity (B, C, D, F, G, J, K, M, Z) Rated voltage (DC) (V) Terminal composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag packing) | |
| Dimension Codes & Sizes | Inch System: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 Metric System (mm): 0603, 1005, 1608, 2012, 3216, 3225, 4520, 4532, 4563, 5750, 5763 | |
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | |
| Dimensions (mm) | 0201 (0603): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 0402 (1005): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 0603 (1608): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10, (W 0.600.10) 0805 (2012): L 2.000.20, W 1.250.20, T 0.800.20, WB 1.000.20, (W 0.500.20) 1206 (3216): L 3.200.30, W 1.600.30, T 1.000.20, WB 1.250.20, (W 0.600.30) 1210 (3225): L 3.200.30, W 2.500.30, T 2.70, WB 0.800.30, (W 1.250.20) 1808 (4520): L 4.500.40, W 2.000.20, T 2.70, WB 0.800.30 1812 (4532): L 4.500.40, W 3.200.30, T 3.50, WB 0.800.30 1825 (4563): L 4.500.40, W 6.300.50, T 3.50, WB 0.800.30 2220 (5750): L 5.700.50, W 5.000.50, T 3.50, WB 1.000.40 2225 (5763): L 5.700.50, W 6.300.50, T 6.20, WB 1.000.40 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A |
| Temperature Range | -55~+125 | Naked eye (Visual inspection), Digital calliper |
| Static Capacity | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) Cr1000pF, 1MHz10%, 1V0.2rms; Cr1000pF, 1KHz10%, 1V0.2rms X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 120Hz24Hz, 0.5V0.1rms. (See Note 1 for exceptions) | |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF); IR*Cr500S (C10nF). Testing: Rated voltage, 605s, Humidity: 75%, Temp: 255, Current: 50mA X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C25nF). | |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area 90%, No Damage | Pre-heating: 80-120, 10-30s; Lead-free solder, flux; Soldering temp: 2455, Time: 20.5s |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating: 100-200, 102s; Soldering temp: 2655, Time: 51s. Cleaning with solvent. Room temp, 242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | |
| Flexural Strength | No damage | Base board: Al2O3 /PCB; PCB dim: Thickness 1.6mm, Length 100mm, Width 40mm; Flexural depth: 1mm; Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate: C/C10% |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% Pre-condition (X7R h): Upper limit temp 1hr, place 241 hrs, start testing. Run 5 cycles. Test after 242hrs normal temp & humidity. | |
| Temperature Moisture Exposure | No visual damage | Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. Test after 242hrs normal temp & humidity. |
| High Temperature Exposure | No visual damage | Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. Test after 48hrs under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on photo. Example dimensions provided for 0805 to 2220 sizes. |
| Packing (Embossed Plastic Taping) | Available for 0805(2012) to 1812(4532) types. Detailed dimensions for tape size, pitch, and reel are provided. | |
| Packing (Paper Tape Reel) | Available for 1005(0402) to 1206(3216) types. Detailed dimensions for paper tape reel and reel dimensions are provided. | |
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | |
| Packing Quantity | Quantities vary by size and packing type (Paper T/R, Plastic T/R). Examples: 0805 Paper T/R (4000 Pcs), 1210 Plastic T/R (2000 Pcs). | |
| Soldering Method Recommendation | R - Reflow Soldering, W - Wave Soldering. Recommendations provided for various sizes and temperature characteristics. | |
| Soldering Temperature Profile | Preheating temperature difference between soldering temperature and surface temperature of chips: T150. | |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can result in burn out, flaming, or glowing. Users should carefully consider the following precautions for safety and application notes. For handling precautions, contact the engineering section or factory.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron, tip selection, and contact temperature.
- Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.
2509251626_AIDE-CAPACITOR-1206X7R104K501NT_C49326765.pdf
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