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Specifications
Voltage Rating:
100V
Capacitance:
220nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R224K101NT
Model Number:
1206X7R224K101NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Compliance: RoHS/REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||||||
| Testing Conditions | ||||||||||
| Normal Condition | Temperature | 15~35 | (No special requirements) | |||||||
| Humidity | 45~75%RH | |||||||||
| Normal Atmosphere | 86~106kPa | |||||||||
| Relative Condition | Temperature | 252 | Any testing data does not match testing specification | |||||||
| Humidity | 60~70%RH | |||||||||
| Atmosphere | 86~106kPa | |||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| Item | Description | Example Value | Details | |||||||
| 1. Dimension Code | Size | 1812 | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||
| 2. Temperature Characteristic | Dielectric Type | X7R | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||
| 3. Nominal Electrostatic Capacity | Capacity Value | 684 (68000pF) | 8R08.0, 10010, 101100 (pF) | |||||||
| 4. Tolerance of Electrostatic Capacity | Tolerance | M (20%) | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||
| 5. Rated Voltage (DC) | Voltage Rating | 251 (250V) | 25025, 251250, 2522500 (V) | |||||||
| 6. Terminal Composition | Termination Material | Au/Ag-Ni-Sn | (From the inside out) | |||||||
| 7. Packing | Packaging Type | T (Tape/Reel) | T Tape/Reel, P Bag packing(PE) | |||||||
| Construction and Dimension | ||||||||||
| Item | Description | Dimension (mm) | British System | |||||||
| 1. Ceramic dielectric | ||||||||||
| 2. Inner electrode | ||||||||||
| 3. Outer electrode | ||||||||||
| 4. Nickel layer | ||||||||||
| 5. Tin layer | ||||||||||
| Dimension (mm) | L | W | T | |||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | |||||||
| Specification and Testing Method | ||||||||||
| No | Item | Specification/Requirement | Testing Method | |||||||
| 1 | Temperature | -55~+125 | ||||||||
| 2 | Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||||||
| 3 | Static capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000 pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |||||||
| 4 | Dissipation factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF) | |||||||
| 5 | IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA | |||||||
| 6 | Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S | |||||||
| 7 | Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||||||
| 8 | Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | |||||||
| 9 | Flexural strength | No damage. Electro static capacity change rate C/C10% | Base boardAl2O3 /PCB. PCB dimension Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||||||
| 10 | Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||
| 11 | Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading); X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |||||||
| 12 | Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 500+24 hours. Test it after place 242 hours normal temp & humidity. | |||||||
| 13 | High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. | |||||||
| 14 | PCB flexural strength | No crack and other defect. IR | Soldering the MLCC on the PCB, Then pressing direction base on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6 | |||||||
| Embossed Plastic Taping Dimensions (unit: mm) | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (unit: mm) | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Paper size A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | ||||||||||
| Type | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Taping Specification | ||||||||||
| Top tape peeling strength | ||||||||||
| (a) Paper Taping | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||||||
| (b) Embossed Taping | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||||||
| Packing Quantity | ||||||||||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | |||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | 3000 (T>1.35mm) | |||||||||
| 1210 | 2000 (T1.60mm) | |||||||||
| 1808 | 3000 (T>1.60mm) | |||||||||
| 1812 | 2000 | |||||||||
| 1812 | 1000 (T1.85mm) | |||||||||
| 1000 (T>1.85mm) | ||||||||||
| 800 | ||||||||||
| 500 | ||||||||||
| Precautions For Use | ||||||||||
| MLCCs may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Follow "precautions for safety" and "Application Notes." Contact engineering or factory for handling questions. | ||||||||||
| 1. Soldering Profile | To avoid cracks from sudden temperature change, follow the temperature profile graph. | |||||||||
| 2. Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact. | |||||||||
| 3. Optimum Solder Amount for Reflow Soldering | ||||||||||
| 4. Recommended Soldering amounts | ||||||||||
| Recommended Soldering Method | ||||||||||
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | ||||||
| 1005 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| 0201 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| 0402 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| 0603 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| Y5V | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| 0805 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |||||||
| C4.7uf | R/W | |||||||||
| Y5V | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| 1206 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C10uf | R | |||||||
| C10uf | R/W | |||||||||
| Y5V | / | C10uf | R | |||||||
| C10uf | R/W | |||||||||
| 1210 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| Soldering method: RReflow Soldering, WWave Soldering | ||||||||||
| The temperature profile for soldering | ||||||||||
| While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||||||||||
2509251626_AIDE-CAPACITOR-1206X7R224K101NT_C49326773.pdf
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