Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage circuits. It is suitable for applications such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCC offers various temperature characteristics, including C0G, X7R, and X5R, with precise control over capacitance and tolerance.
Product Attributes
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out).
- Certifications: ROHS/REACH compliant.
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Dimension Code | 0201 | L*W (inch): 0.02*0.01, L*W (mm): 0.50*0.25 |
| 0402 | L*W (inch): 0.04*0.02, L*W (mm): 1.00*0.50 | |
| 0603 | L*W (inch): 0.06*0.03, L*W (mm): 1.60*0.80 | |
| 0805 | L*W (inch): 0.08*0.05, L*W (mm): 2.00*1.25 | |
| 1206 | L*W (inch): 0.12*0.06, L*W (mm): 3.20*1.60 | |
| 1210 | L*W (inch): 0.12*0.10, L*W (mm): 3.20*2.50 | |
| 1808 | L*W (inch): 0.18*0.08, L*W (mm): 4.50*2.00 | |
| 1812 | L*W (inch): 0.18*0.12, L*W (mm): 4.50*3.20 | |
| 1825 | L*W (inch): 0.18*0.25, L*W (mm): 4.50*6.30 | |
| 2225 | L*W (inch): 0.22*0.25, L*W (mm): 5.70*6.30 | |
| Temperature Characteristic | Code | Description |
| C0G | 0 30 PPM/ | |
| X7R | 15% | |
| X5R | 15% | |
| Nominal Electrostatic Capacity | Code | Value (pF) |
| 8R0 | 8.0 | |
| 100 | 10 | |
| 101 | 100 | |
| Tolerance of Electrostatic Capacity | B | 0.1pF |
| C | 0.25pF | |
| D | 0.5pF | |
| F | 1% | |
| G | 2% | |
| J | 5% | |
| K | 10% | |
| M | 20% | |
| Z | +80%/-20% | |
| Rated Voltage (DC) | Code | Voltage (V) |
| 250 | 25 | |
| 251 | 250 | |
| 252 | 2500 | |
| Testing Conditions: | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Dimensions (mm): | ||
| Part Number | L | W |
| 0201 (0603) | 0.600.10 | 0.300.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 |
| 0603 (1608) | 1.600.20 | 0.800.15 |
| 0805 (2012) | 2.000.20 | 1.250.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 |
| 1812 (4532) | 4.500.40 | 3.200.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 |
| 2220 (5750) | 5.700.50 | 5.000.50 |
| 2225 (5763) | 5.700.50 | 6.300.50 |
| Specification and Testing Method: | ||
| Temperature Range | -55~+125 | |
| Static Capacity | Meets standard specification and tolerance. NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF). | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). Testing frequency 1MHz10%, Voltage 1V0.2rms (Cr1000pF); 1KHz10%, Voltage 1V0.2rms (Cr>1000pF). X7R/X7T/X7P: 10uF, 1KHz10%, Voltage 1V0.1rms; >10uF, 120Hz24, Voltage 0.5V0.1rms. (Refer to Note 1 for specific DF exceptions). | |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF). X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF). Testing condition: Rated voltage, 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | |
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | |
| Solderability | Soldering area90%, No Damage. Pre-heating: 80-120, 10-30s. Solder: Lead-free. Temperature: 2455. Time: 20.5s. | |
| Resistance to the heat of soldering | No visual damage, soldering area90%. Pre-heating: 100-200, 102s. Soldering temperature: 2655, 51s. Cleaning with solvent. Room temperature, 242 hours. | |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF. X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. 5 cycles. | |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. Test condition: 402, 90~95%RH, 50024 hours. | |
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. Test condition: 1253, 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). | |
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering. | |
| Packing Quantity | Paper T/R: 0201: 4000, 0402: 4000, 0603: 4000, 0805: 4000, 1206: 4000. Plastic T/R: 0805: 3000, 1206: 3000, 1210: 2000, 1808: 1000, 1812: 800. (Quantities vary based on thickness and size). | |
Note: Precautions for use include following soldering profiles to avoid cracks, careful manual soldering, and optimum solder amount for reflow soldering.
2509251626_AIDE-CAPACITOR-1210X7R104K631NT_C49326811.pdf
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