Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage applications.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |
| Switch power supplier | ||
| AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | ||
| Testing Condition (Normal) | Temperature | 15~35 |
| Humidity | 45~75%RH | |
| Testing Condition (Relative) | Temperature | 252 |
| Humidity | 60~70%RH | |
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 25025, 251250, 2522500 (V) | |
| Terminal Composition | Au/Ag-Ni-Sn | |
| Packing | T Tape/Reel, P Bag packing(PE) | |
| Construction and Dimension | Construction Item | Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer |
| Dimension (mm) - British System | 0201 (0603): 0.600.10 L, 0.300.05 W, 0.300.05 T, 0.100.05 WB 0402 (1005): 1.000.15 L, 0.500.15 W, 0.500.10 T, 0.200.10 WB 0603 (1608): 1.600.20 L, 0.800.15 W, 0.800.15 T, 0.300.10 WB 0805 (2012): 2.000.20 L, 1.250.20 W, 0.800.20 T, 1.000.20 WB 1206 (3216): 3.200.30 L, 1.600.30 W, 1.000.20 T, 1.250.20 WB 1210 (3225): 3.200.30 L, 2.500.30 W, 2.70 T, 0.800.30 WB 1808 (4520): 4.500.40 L, 2.000.20 W, 2.70 T, 0.800.30 WB 1812 (4532): 4.500.40 L, 3.200.30 W, 3.50 T, 0.800.30 WB 1825 (4563): 4.500.40 L, 6.300.50 W, 3.50 T, 0.800.30 WB 2220 (5750): 5.700.50 L, 5.000.50 W, 3.50 T, 1.000.40 WB 2225 (5763): 5.700.50 L, 6.300.50 W, 6.20 T, 1.000.40 WB | |
| Dimension (mm) - Metric System | 0603: 0.600.10 L, 0.300.05 W, 0.300.05 T, 0.100.05 WB 1005: 1.000.15 L, 0.500.15 W, 0.500.10 T, 0.200.10 WB 1608: 1.600.20 L, 0.800.15 W, 0.800.15 T, 0.300.10 WB 2012: 2.000.20 L, 1.250.20 W, 0.800.20 T, 1.000.20 WB 3216: 3.200.30 L, 1.600.30 W, 1.000.20 T, 1.250.20 WB 3225: 3.200.30 L, 2.500.30 W, 2.70 T, 0.800.30 WB 4520: 4.500.40 L, 2.000.20 W, 2.70 T, 0.800.30 WB 4532: 4.500.40 L, 3.200.30 W, 3.50 T, 0.800.30 WB 4563: 4.500.40 L, 6.300.50 W, 3.50 T, 0.800.30 WB 5750: 5.700.50 L, 5.000.50 W, 3.50 T, 1.000.40 WB 5763: 5.700.50 L, 6.300.50 W, 6.20 T, 1.000.40 WB | |
| Temperature | -55~+125 | |
| Static Capacity | NPO: 1000pF 1MHz10% 1.00.2Vrms; >1000pF 1KHz10% 1.00.2Vrms X7R/X7T/X7P: 10uF 1KHz10% 1.00.2Vrms; >10uF 120Hz24 0.50.1Vrms | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF); IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C25nF) | |
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage | |
| Solderability | Soldering area 90%, Visual-No damage | |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | |
| Flexural Strength | Electro static capacity change rate C/C10% | |
| Terminal Bonding Strength | No visual damage, Applied Force: 5N Duration: 101S | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | |
| Temperature Moisture Exposure | Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | |
| High Temperature Exposure | Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | |
| PCB Flexural Strength | No crack and other defect | |
| Embossed Plastic Taping | Tape size (0805) | A:1.550.20, B:2.350.20, C:8.000.20, D:3.500.05, E:1.750.10, F:4.000.10, G:2.000.10, H:4.000.10, J:1.50 -0/+0.10, T:1.50 Max |
| Tape size (1206) | A:1.950.20, B:3.600.20, C:8.000.20, D:3.500.05, E:1.750.10, F:4.000.10, G:2.000.10, H:4.000.1, J:1.50 -0/+0.10, T:1.85 Max | |
| Tape size (1210) | A:2.700.10, B:3.420.10, C:8.000.10, D:3.500.05, E:1.750.10, F:4.000.10, G:2.000.05, H:4.000.10, J:1.55 -0/+0.10, T:3.2 Max | |
| Tape size (1812) | A:3.660.10, B:4.950.10, C:12.000.10, D:5.500.05, E:1.750.10, F:8.000.10, G:2.000.05, H:4.000.10, J:1.55 -0/+0.10, T:4.0 Max | |
| Paper Tape Reel Packing | Paper size (1005) | W1:0.240.02, L1:0.450.02, D:8.000.10, C:3.500.05, B:1.750.10, P1:2.000.05, P2:2.000.05, P0:4.000.10, d:1.50 -0/+0.10, t:0.30 Below |
| Paper size (0201) | W1:0.370.10, L1:0.670.10, D:8.000.10, C:3.500.05, B:1.750.10, P1:2.000.05, P2:2.000.05, P0:4.000.10, d:1.50 -0/+0.10, t:0.80 Below | |
| Paper size (0402) | W1:0.650.10, L1:1.150.10, D:8.000.10, C:3.500.05, B:1.750.10, P1:2.000.05, P2:2.000.05, P0:4.000.10, d:1.50 -0/+0.10, t:0.80 Below | |
| Packing Quantity | 0603: Paper T/R (Pcs) 4000, Plastic T/R (Pcs) 3000 (T1.35mm) 0805: Paper T/R (Pcs) 4000, Plastic T/R (Pcs) 3000 1206: Paper T/R (Pcs) 3000, Plastic T/R (Pcs) 2000 (T1.60mm) 1210: Paper T/R (Pcs) 2000, Plastic T/R (Pcs) 3000 (T>1.60mm) 1808: Paper T/R (Pcs) 1000, Plastic T/R (Pcs) 2000 1812: Paper T/R (Pcs) 800, Plastic T/R (Pcs) 1000 (T1.85mm) 1812: Plastic T/R (Pcs) 800 (T>1.85mm), 500 | |
| Soldering Method | RReflow Soldering, WWave Soldering | |
Note 1: X7R/X5R/X6S/X7S Y5V Rated vol. DF Exception of D.F. 50V 5% 7% 06030.1F; 08050.47F; 12064.7F; 12.5% 12106.8F 35V 7% --- --- 25V 5% 7% 04020.047F;06030.1F; 08050.33F; 12061F; 1210 4.7F 9% 04020.068F;06030.47F; 12064.7F; 121022F; 16V (C<1.0F) 7% 9% 04020.068F; 06030.68F 12.5% 04020.22F 16V (C1.0F) 9% 12.5% 06032.2F; 08053.3F;120610F; 121022F; 181247F; 10V 12.5% 20% 04020.47F 6.3V 20% --- --- Rated vol. DF Exception of D.F. 100V 2.5% 3% 12060.47F 5% 08050.1F;06030.068F;1206>1F;12102.2F; 10% 08050.22F;12103.3F 50V 2.5% 3% 0201(50V); 06030.047F; 08050.18F;12060.47F 5% 02010.01uF; 12104.7F 10% 04020.012F;0603>0.1F; 08051F;12062.2F; 121010F; 35V 3.5% 10% 06031F;08052.2F;12062.2F;121010F 25V 3.5% 5% 02010.01F;08051F; 121010F 7% 06030.33F; 12064.7F 10% 02010.1F;04020.10F;06030.47F; 08052.2F; 1206 6.8F ; 121022F ; 12.5% 04020.47F 16V 3.5% 5% 02010.01F;04020.033F;06030.15F; 08050.68F;12062.2F;12104.7F 10% 02010.1uF(0201/X7R0.022F); 04020.22uF; 06031206 4.7F; 121022F; 10V 5% 10% 02010.012F;04020.33F(0402/X7R0.22F); 06030.33F; 08052.2F;12062.2F;121022F 15% 02010.1F; 04021F 6.3V 10% 15% 02010.1F;04021F;060310F; 08054.7F; 1206 47F :1210100F; 20% 04022.2F 4V 15% --- ---
Note 2: Initial capacitance testing: Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature.
Note 3: Soldering Profile to avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page).
2509251626_AIDE-CAPACITOR-0603X7R102K501NT_C48579276.pdf
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