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Specifications
Voltage Rating:
50V
Capacitance:
22nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R223K500NT
Model Number:
0603X7R223K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Category | Specification | Details | |||
|---|---|---|---|---|---|
| Application Field | Coupling | High voltage circuits | |||
| Wave filtering | High voltage circuits | ||||
| Resonant | High voltage circuits | ||||
| Switch power supplier | Medium and High voltage MLCC | ||||
| AC-DC power charger | Medium and High voltage MLCC | ||||
| DC-DC power charger | Medium and High voltage MLCC | ||||
| Networking/Communication interface | Medium and High voltage MLCC | ||||
| LCD backlight unit power supplier | Medium and High voltage MLCC | ||||
| Amperite of energy saving lamps | Medium and High voltage MLCC | ||||
| General Use | Medium and High voltage MLCC | ||||
| General Use | High voltage circuits | ||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Soldering Pre-heating | 80-120, 10-30s (for solderability); 100-200, 102s (for resistance to heat of soldering) | ||||
| Soldering Temperature | 2455 (for solderability); 2655 (for resistance to heat of soldering) | ||||
| Soldering Time | 20.5s (for solderability); 51s (for resistance to heat of soldering) | ||||
| Part Number Description | Item | Description | |||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| 3. Nominal Electrostatic Capacity | e.g., 8R0=8.0pF, 100=10pF, 101=100pF | ||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| 5. Rated Voltage (DC) | e.g., 250=25V, 251=250V, 252=2500V | ||||
| 6. Terminal Composition | Au/Ag-Ni-Sn | ||||
| 7. Packing | T (Tape/Reel), P (Bag packing) | ||||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | ||||
| Operating Temperature Range | -55~+125 | ||||
| Static Capacity Tolerance | NPO: 1000pF (1MHz10%, 1.00.2Vrms); >1000pF (1KHz10%, 1.00.2Vrms) X7R/X7T/X7P: 10uF (1KHz10%, 1.00.2Vrms); >10uF (120Hz24, 0.50.1Vrms) | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| Insulation Resistance (IR) | NPO: IR50000M or IR*Cr500S (C10nF); IR*Cr500S (C>10nF) X7R/X7T/X7P: IR10000M or IR*Cr100S (C25nF); IR*Cr100S (C>25nF) | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S | |||
| Solderability | Soldering area 90% | Visual-No damage | |||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Cleaning with solvent. Room temperature, time: 242 hours. | |||
| Flexural Strength | Electro static capacity change rate: C/C10% | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | 5 cycles, test after 242 hours at normal temp & humidity. | |||
| Temperature Moisture Exposure | Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours at normal temp & humidity. | |||
| High Temperature Exposure | Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature: 1253, Time: 100048 hours. Voltage dependent on rated voltage. Test after 48 hours at normal pressure & temperature. | |||
| PCB Flexural Strength | No crack and other defect | IR measurement after soldering MLCC on PCB. | |||
| Packing Quantities (Pcs) | Paper T/R | Plastic T/R | |||
| 0603 | 4000 | - | |||
| 0805 | 4000 | 3000 (T1.35mm) | |||
| 1206 | - | 3000 (T1.60mm), 2000 (T>1.60mm) | |||
| 1210 | - | 1000 (T1.85mm), 800 (T>1.85mm) | |||
| 1812 | - | 500 |
2509251626_AIDE-CAPACITOR-0603X7R223K500NT_C48579295.pdf
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