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Specifications
Voltage Rating:
50V
Capacitance:
330nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R334K500NT
Model Number:
1206X7R334K500NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: ROHS/REACH compliant
Technical Specifications
| Item | Specification/Requirement | Testing Method | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | N/A | |||
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A | |||
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |||
| Part Number Description Example | 1812 X7R 684 M 251 N T | N/A | |||
| Dimension Code | Code | L*W (inch) | L*W (mm) | ||
| 0201 | 0.02*0.01 | 0.50*0.25 | |||
| 0402 | 0.04*0.02 | 1.00*0.50 | |||
| 0603 | 0.06*0.03 | 1.60*0.80 | |||
| 0805 | 0.08*0.05 | 2.00*1.25 | |||
| 1206 | 0.12*0.06 | 3.20*1.60 | |||
| 1210 | 0.12*0.10 | 3.20*2.50 | |||
| 1808 | 0.18*0.08 | 4.50*2.00 | |||
| 1812 | 0.18*0.12 | 4.50*3.20 | |||
| 1825 | 0.18*0.25 | 4.50*6.30 | |||
| 2211 | 0.22*0.11 | 5.70*2.8 | |||
| 2225 | 0.22*0.25 | 5.70*6.30 | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |||
| Nominal Electrostatic Capacity | 8R0=8.0, 100=10, 101=100 (pF) | N/A | |||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | |||
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | N/A | |||
| Packing | T: Tape/Reel, P: Bag packing (PE) | N/A | |||
| Dimensions (mm) | Part number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Range | -55~+125 | N/A | |||
| Insulation Resistance (IR) - NPO Characteristic | IR50000M, C10nF; IR*Cr500S, C10nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||
| Insulation Resistance (IR) - X7R/X7T/X7P Characteristic | IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S | |||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||
| Flexural Strength | No visual damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electrostatic capacity change rate: C/C10%. Flexural depth 452. | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal Shock - NPO Characteristic | C/C2.5% or 0.25pF (larger reading) | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | |||
| Thermal Shock - X7R/X7P Characteristic | C/C0.5% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | |||
| Thermal Shock - X7T characteristic | C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | |||
| Temperature Moisture Exposure - NPO Characteristic | C/C2% or 1pF (larger reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. | |||
| Temperature Moisture Exposure - X7R/X7T/X7P characteristic | C/C10% | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. | |||
| Temperature Moisture Exposure - DF | 2 times initial standard | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. | |||
| Temperature Moisture Exposure - IR (NPO) | IR2500M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. | |||
| Temperature Moisture Exposure - IR (X7R/X7T/X7P) | IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. | |||
| High Temperature Exposure - NPO Characteristic | C/C2% or 1pF (larger reading) | Test after placing 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. | |||
| High Temperature Exposure - X7R/X7T/X7P: | C/C20% | Test after placing 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. | |||
| High Temperature Exposure - DF | 2 X initial standard | Test after placing 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. | |||
| High Temperature Exposure - IR (NPO) | IR4000M or IR*Cr40S (Lower reading) | Test after placing 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. | |||
| High Temperature Exposure - IR (X7R/X7P) | IR2000M or IR*Cr50S (Lower reading) | Test after placing 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. | |||
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB. Pressing direction based on photo. SIZE A B C: 0805(2012): 1.2 4 1.65; 1206(3216): 2.2 5 2; 1210(3225): 2.2 5 2.9; 1812(4532): 3.5 7 3.7; 2220(5750): 4.5 8 5.6. | |||
| Embossed Plastic Taping (0805-1812) | See Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) | N/A | |||
| Paper Tape Reel Packing (1005, 0201, 0402) | See Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) | N/A | |||
| Paper Tape Reel Packing (0603, 0805, 1206) | See Page 9 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) | N/A | |||
| Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | N/A | |||
| Top Tape Peeling Strength (Embossed Taping) | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||
| Packing Quantity (Pcs) | Paper T/R: 4000 (0603, 0805, 1206); Plastic T/R: 3000 (0805, 1206, 1210 T1.35mm), 2000 (1210 T>1.35mm, 1808), 1000 (1812 T1.85mm), 800 (1812 T>1.85mm), 500 (1812). | N/A | |||
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering | See Page 13 for detailed recommendations by size, temperature characteristic, rated voltage, and capacitance. | |||
Precautions for Use
Multi-Layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can lead to burnout, flaming, or glowing. Adhere to the following precautions and application notes.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is carefully selected and handled to avoid direct contact with the ceramic body.
- Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.
- Soldering Temperature Profile: Keep the temperature difference between soldering temperature and surface temperature of chips 150 during preheating.
2509251626_AIDE-CAPACITOR-1206X7R334K500NT_C48579711.pdf
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