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Specifications
Voltage Rating:
50V
Capacitance:
56pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G560J500NT
Model Number:
0603C0G560J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in a range of sizes and dielectric characteristics, offering reliable performance under specified conditions.
Product Attributes
- Dielectric Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Condition: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| 2. Part Number Description | Example: 1812 X7R 684 M 251 N T | ||
| Item | Description | ||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | (See detailed dimensions in section 4) | |
| 2. Temperature characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| 3. Nominal electrostatic capacity | 8R08.0, 10010, 101100 (pF) | ||
| 4. Tolerance of electrostatic capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||
| 5. Rated voltage (DC) | 25025, 251250, 2522500 (V) | ||
| 6. Terminal composition | Au/Ag-Ni-Sn | ||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | ||
| 3. Construction and Dimension | Construction: | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer | |
| Dimension (mm): | (See detailed table in original document for specific dimensions L, W, T, WB for each code like 0201, 0402, etc.) | ||
| 4. Specification and testing method | Temperature | -55~+125 | |
| Visual/ Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static capacity | Meet standard specification and tolerance | (See detailed specifications for NPO and X7R/X7T/X7P characteristics in original document) | |
| Dissipation factor (DF) | (See detailed specifications for NPO and X7R/X7T/X7P characteristics in original document) | (See detailed testing methods in original document) | |
| IR Insulation Resistance | (See detailed specifications for NPO and X7R/X7T/X7P characteristics in original document) | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | (See voltage ratings and test conditions in original document) | |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic capacity change rate | (See specifications for NPO, X7R, X7T, X7P in original document) | Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. | |
| Flexural strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. (See detailed test setup and conditions in original document) | |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal shock | (See specifications for NPO, X7R/X7P, X7T in original document) | Run 5 cycles. Test after place 242 hours normal temp & humidity. | |
| Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: (See specifications for NPO, X7R/X7T/X7P). DF: 2 times initial standard. IR: (See specifications for NPO, X7R/X7T/X7P). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |
| High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: (See specifications for NPO, X7R/X7T/X7P). DF: 2 X initial standard. IR: (See specifications for NPO, X7R/X7T/X7P). | Temperature 1253, Time 100048 hours. (See voltage conditions in original document). Test after place 48 hours under normal pressure & temperature. | |
| PCB flexural strength | No crack and other defect. IR | (See detailed diagram and dimensions A, B, C for different sizes in original document) | |
| 5. Embossed Plastic Taping | (See detailed dimensions for tape size A, B, C, D, E, F, G, H, J, T for codes 0805 to 1812 in original document) | ||
| 6. Paper Tape Reel Packing | (See detailed dimensions for Paper size W1, L1, D, C, B, P1, P2, P0, d, t for codes 1005, 0201, 0402, 0603, 0805, 1206 in original document) | ||
| 7. Reel Dimensions | (See dimensions for Reel size A, B, C, D, E, F, G for 7' REEL and 13' REEL in original document) | ||
| 8. Taping specification | Top tape peeling strength | 0.1N < peeling strength < 0.7N | (a) Paper Taping, (b) Embossed Taping. No paper dirty remains on the scotch when peeling. |
| 9. Packing quantity | (See table for Paper T/R (Pcs) and Plastic T/R (Pcs) for different sizes in original document) | ||
| 10. Precautions For Use | MLCC may fail in short circuit mode under severe conditions. Follow "precautions for safety" and "Application Notes". Refer to soldering profile graph. Avoid sudden temperature changes. Handle manual soldering carefully. Use optimum solder amount for reflow soldering. | ||
| 11. Recommended Soldering Method | (See table for different sizes, temperature characteristics, rated voltage, capacitance and soldering methods RReflow Soldering, WWave Soldering in original document) | ||
| 12. The temperature profile for soldering | Keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||
2509251626_AIDE-CAPACITOR-0603C0G560J500NT_C49326334.pdf
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