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Specifications
Voltage Rating:
10V
Capacitance:
100nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R104K100NT
Model Number:
0603X7R104K100NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, inner electrode, outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS/REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |||||
|---|---|---|---|---|---|---|---|---|
| 1. Application Field | ||||||||
| Coupling, wave filtering, resonant in high voltage circuits | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||||||
| 2. Testing Condition | ||||||||
| Normal condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||
| Relative condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||
| 3. Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||
| Dimension Code | Size (inch/mm) | 0201 (0.02*0.01 / 0.50*0.25), 0402 (0.04*0.02 / 1.00*0.50), 0603 (0.06*0.03 / 1.60*0.80), 0805 (0.08*0.05 / 2.00*1.25), 1206 (0.12*0.06 / 3.20*1.60), 1210 (0.12*0.10 / 3.20*2.50), 1808 (0.18*0.08 / 4.50*2.00), 1812 (0.18*0.12 / 4.50*3.20), 1825 (0.18*0.25 / 4.50*6.30), 2211 (0.22*0.11 / 5.70*2.8), 2225 (0.22*0.25 / 5.70*6.30) | ||||||
| Temperature characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||
| Nominal electrostatic capacity | (pF) | 8R0=8.0, 100=10, 101=100 | ||||||
| Tolerance of electrostatic capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||
| Rated voltage (DC) | (V) | 250=25, 251=250, 252=2500 | ||||||
| Terminal composition | (From the inside out) | Au/Ag-Ni-Sn | ||||||
| Packing | T=Tape/Reel, P=Bag packing (PE) | |||||||
| 4. Construction and Dimension | ||||||||
| Construction | Item | Description | ||||||
| 1 | Ceramic dielectric | |||||||
| 2 | Inner electrode | |||||||
| 3 | Outer electrode | |||||||
| 4 | Nickle layer | |||||||
| 5 | Tin layer | |||||||
| Dimension (mm) | Part number | L | W | T | WB | |||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||
| 5. Specification and testing method | ||||||||
| Temperature | -55~+125 | |||||||
| Visual/ Dimension | 1, No Damage 2, Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||
| Static capacity | Meet standard specification and tolerance | NPO: 1000pF 1MHz10% 1.00.2Vrms; >1000pF 1KHz10% 1.00.2Vrms. X7R/X7T/X7P: 10uF 1KHz10% 1.00.2Vrms; >10uF 120Hz24 0.50.1Vrms. | ||||||
| Dissipation factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 1MHz10%, 1V0.2rms. Cr1000pF, 1KHz10%, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24Hz, 0.5V0.1rms. (See Note 1 for exceptions) | |||||||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | Visual-No damage | |||||
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual | |||||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. DF Refer to NO#4. IR Refer to NO#5. | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | ||||||
| Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural deepth 452 | Visual | |||||
| Terminal bonding strength | No visual damage | Applied Force: 5N Duration: 101S | ||||||
| Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |||||||
| Temperature moisture exposure | Visual No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | Visual | |||||
| High temperature exposure | Visual No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature. | Visual | |||||
| PCB flexural strength | No crack and other defect | SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6. IR Soldering the MLCC on the PCB, Then pressing direction base on the photo. | ||||||
| 6. EMBOSSED PLASTIC TAPING | ||||||||
| Embossed tape reel packing | Code | Tape size (mm) | ||||||
| 0805 | A: 1.550.20, B: 2.350.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.50 Max | |||||||
| 1206 | A: 1.950.20, B: 3.600.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.85 Max | |||||||
| 1210 | A: 2.700.10, B: 3.420.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.55 -0/+0.10, T: 3.2 Max | |||||||
| 1808 | A: 2.200.10, B: 4.950.10, C: 12.000.10, D: 5.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.50 -0/+0.10, T: 3.0 Max | |||||||
| 1812 | A: 3.660.10, B: 4.950.10, C: 12.000.10, D: 5.500.05, E: 1.750.10, F: 8.000.10, G: 2.000.05, H: 4.000.10, J: 1.55 -0/+0.10, T: 4.0 Max | |||||||
| Paper tape reel packing | ||||||||
| Code | Paper size (mm) | |||||||
| 1005 | W1: 0.240.02, L1: 0.450.02, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.30 Below | |||||||
| 0201 | W1: 0.370.10, L1: 0.670.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below | |||||||
| 0402 | W1: 0.650.10, L1: 1.150.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below | |||||||
| 0603 | A: 1.100.10, B: 1.900.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | |||||||
| 0805 | A: 1.450.15, B: 2.300.15, C: 8.00.15, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | |||||||
| 1206 | A: 1.800.20, B: 3.400.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max | |||||||
| Reel Dimensions (unit: mm) | ||||||||
| Type | A | B | C | D | E | F | G | |
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |
| Taping specification | ||||||||
| Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||||
| Packing quantity | ||||||||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||
| 0603 | 4000 | |||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||
| 1206 | 3000 (T>1.35mm), 2000 (T1.60mm) | |||||||
| 1210 | 3000 (T>1.60mm), 2000 | |||||||
| 1808 | 1000 (T1.85mm) | |||||||
| 1812 | 1000 (T>1.85mm), 800 | |||||||
| 1812 | 500 | |||||||
| 7. ROHS/REACH compliance | ||||||||
| RoHS | meet the standard | |||||||
| REACH | meet the standard | |||||||
| 8. Precautions For Use | ||||||||
| Soldering Profile | To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | |||||||
| Manual Soldering | Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. | |||||||
| Optimum Solder Amount for Reflow Soldering | ||||||||
| Recommended Soldering amounts | ||||||||
| 9. Recommended Soldering Method | ||||||||
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | ||||
| 1005 | NPO | / | / | R | ||||
| X7R/X5R/X7S/X6S | / | / | R | |||||
| 0201 | NPO | / | / | R | ||||
| X7R/X5R/X7S/X6S | / | / | R | |||||
| Y5V | / | / | R | |||||
| 0402 | NPO | / | / | R | ||||
| X7R/X5R/X7S/X6S | / | / | R | |||||
| Y5V | / | / | R | |||||
| 0603 | NPO | / | / | R/W | ||||
| X7R/X5R/X7S/X6S | / | C1uf | R | |||||
| C1uf | R/W | |||||||
| Y5V | / | C1uf | R | |||||
| C1uf | R/W | |||||||
| 0805 | NPO | / | / | R/W | ||||
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |||||
| C4.7uf | R/W | |||||||
| Y5V | / | C1uf | R | |||||
| C1uf | R/W | |||||||
| 1206 | NPO | / | / | R/W | ||||
| X7R/X5R/X7S/X6S | / | C10uf | R | |||||
| C10uf | R/W | |||||||
| Y5V | / | C10uf | R | |||||
| C10uf | R/W | |||||||
| 1210 | NPO | / | / | R | ||||
| X7R/X5R/X7S/X6S | / | / | R | |||||
| Y5V | / | / | R | |||||
| 10. The temperature profile for soldering | ||||||||
| While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||||||||
2509251626_AIDE-CAPACITOR-0603X7R104K100NT_C49326605.pdf
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