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Specifications
Voltage Rating:
50V
Capacitance:
20nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R203K500NT
Model Number:
0603X7R203K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
High-reliability Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding high-voltage applications. These capacitors are ideal for coupling, wave filtering, and resonant functions in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They offer robust performance and reliability in medium and high voltage circuits.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Compliance: RoHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. (Medium and High voltage MLCC) | ||
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For data not matching testing specification |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | See Page 1 for L*W (inch/mm) details |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T=Tape/Reel, P=Bag packing (PE) | |
| Construction and Dimension | ||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | |
| Dimension (mm) | See Page 2 for detailed L, W, T, WB for each code (e.g., 0201, 0402, etc.) | British system, Metric system |
| Specification and Testing Method | ||
| Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper |
| Static Capacity | Meet standard specification and tolerance | See Page 3 for NPO and X7R/X7T/X7P characteristic details (Frequency, Voltage) |
| Dissipation Factor (DF) | See Page 3 for NPO and X7R/X7T/X7P characteristic details | |
| IR Insulation Resistance | NPO: 50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: 10000M, C25nF; IR*Cr100S, C>25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V,...2.5x rated voltage; Ur=200V/250V,...2.0x rated voltage; Ur=450/500/630V,...1.5x rated voltage; 1KVUr2KV,...1.2x rated voltage; 2KVUr,...1.1x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. Visual-No damage |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF; X7R: 15%; X7T: -33% to 22%; X7P: 10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. |
| Flexural Strength | Electro static capacity change rate: 10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: 10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | NPO: 2% or 1pF; X7R/X7T/X7P: 10%. DF 2 times initial standard. IR: NPO 2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. |
| High Temperature Exposure | NPO: 2% or 1pF; X7R/X7T/X7P: 20%. DF 2 X initial standard. IR: NPO 4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. See Page 7 for SIZE A, B, C for different MLCC sizes. |
| Embossed Plastic Taping | ||
| Embossed Tape Reel Packing | See Page 8 for Tapesize dimensions (A, B, C, D, E, F, G, H, J, T) for 0805 to 1812 types. | |
| Paper Tape Reel Packing | ||
| Paper Tape Reel Packing | See Page 9 for Papersize dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for 1005, 0201, 0402 types and (A, B, C, D, E, F, G, H, J, T) for 0603, 0805, 1206 types. | |
| Taping Specification | ||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | Paper Taping Reel type: A, B, C, D, E, F, G dimensions on Page 10. Embossed Taping Standard: No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| Packing Quantity | ||
| Paper T/R (Pcs) | See Page 11 for quantities for different sizes (e.g., 0603: 4000, 0805: 4000) | |
| Plastic T/R (Pcs) | See Page 11 for quantities for different sizes (e.g., 0805: 3000, 1210 T1.60mm: 3000) | |
| Precautions For Use | ||
| Soldering Profile | Follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | To avoid crack problem by sudden temperature change. |
| Manual Soldering | Handle carefully; pay attention to soldering iron tip selection and temperature contact. | Risk of thermal cracks. |
| Optimum Solder Amount for Reflow Soldering | See Page 13 | |
| Recommended Soldering Method | See Page 13 for details based on Size, Temperature Characteristics, Rated Voltage, Capacitance. RReflow Soldering, WWave Soldering. | |
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips 150. | See Page 14 |
2509251626_AIDE-CAPACITOR-0603X7R203K500NT_C49326623.pdf
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