Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications including coupling, wave filtering, and resonant functions. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Application Field | High voltage circuits | ||||
| Coupling | |||||
| Wave filtering | |||||
| Resonant | |||||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Initial Capacitance Testing Pre-heating | 150 for 1 hour, then 48 hours under normal pressure & temperature | ||||
| Part Number Description | 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | ||||
| 6. Terminal Composition | Au/Ag-Ni-Sn | ||||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Characteristic | Item | Specification/Requirement | Testing Method | ||
| Temperature Range | -55~+125 | N/A | |||
| Static Capacity | Item | Specification/Requirement | Testing Method | ||
| Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | N/A | |||
| Dissipation Factor (DF) | Item | Specification/Requirement | Testing Method | ||
| NPO Characteristic | DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) | Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms | |||
| Insulation Resistance (IR) | Item | Specification/Requirement | Testing Method | ||
| NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s | |||
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | |||
| Temperature Moisture Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. | |||
| High Temperature Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test after placing 48 hours under normal pressure & temperature. | |||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. | |||
| Embossed Plastic Taping | Dimensions for 0805 to 1812 types | See Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) | |||
| Paper Tape Reel Packing | Dimensions for 1005, 0201, 0402, 0603, 0805, 1206 types | See Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t / A, B, C, D, E, F, G, H, J, T) | |||
| Reel Dimensions | 7' REEL, 13' REEL | See Page 10 for detailed dimensions (A, B, C, D, E, F, G) | |||
| Top Tape Peeling Strength | Paper Taping: 0.1N < peeling strength < 0.7N. Embossed Taping: Standard. | N/A | |||
| Packing Quantity | See Page 11 for details | N/A | |||
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering | See Page 13 for size-specific recommendations | |||
2509251626_AIDE-CAPACITOR-0603X7R272K500NT_C49326635.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible