Product Overview
This product is a high-voltage Multi-Layer Ceramic Capacitor (MLCC) designed for applications requiring wave filtering, coupling, and resonance in high-voltage circuits. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCC is available in various sizes and temperature characteristics, offering reliable performance across a range of demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Application Field | High voltage circuits | |
| Function | Coupling, wave filtering, resonant | |
| Typical Applications | Switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power supplies, energy-saving lamps | |
| Type | Medium and High voltage MLCC | |
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Dimensions (mm) | Part Number | L W T WB |
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | |
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | |
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 | |
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 | |
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 | |
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | |
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | |
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | |
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | |
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | |
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | |
| Specifications and Testing Methods | Temperature Range | -55~+125 |
| Static Capacity | Meets standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | |
| Dissipation Factor (DF) | Specified limits for NPO and X7R/X7T/X7P characteristics | |
| Insulation Resistance (IR) | Specified limits for NPO and X7R/X7T/X7P characteristics | |
| Hi-pot (DC) | 2.5 x rated voltage (Ur=100V), 2.0 x rated voltage (Ur=200V/250V), 1.5 x rated voltage (Ur=450/500/630V), 1.2 x rated voltage (1KVUr2KV), 1.1 x rated voltage (2KVUr) | |
| Solderability | Soldering area 90%, Visual-No damage | |
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | |
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF, X7R: 15%, X7T: -33% to 22%, X7P: 10% | |
| Flexural Strength | No damage, Electrostatic capacity change rate 10% | |
| Terminal Bonding Strength | No visual damage, Applied Force: 5N, Duration: 101S | |
| Thermal Shock | Capacity change rate within specified limits for NPO, X7R/X7P, X7T characteristics | |
| Temperature Moisture Exposure | Capacity change rate within specified limits for NPO, X7R/X7T/X7P characteristics; DF and IR within specified limits | |
| High Temperature Exposure | Capacity change rate within specified limits for NPO, X7R/X7T/X7P characteristics; DF and IR within specified limits | |
| PCB Flexural Strength | No crack and other defects | |
| Packing | Tape/Reel (T), Bag packing (P) | |
| Embossed Plastic Taping Dimensions | Standard dimensions for 0805 to 1812 types | |
| Paper Tape Reel Packing Dimensions | Standard dimensions for 1005, 0201, 0402, 0603, 0805, 1206 types | |
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0) | |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | |
| Packing Quantity | Varies by size and packing type (e.g., 4000 pcs for 0603 Paper T/R) | |
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) | |
| Soldering Temperature Profile | Refer to adjacent graph; T150 temperature difference between soldering temperature and surface temperature of chips during preheating. | |
2509251626_AIDE-CAPACITOR-0603X7R392K500NT_C49326643.pdf
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