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quality Multi layer ceramic capacitor AIDE CAPACITOR 0603X7R821K500NT RoHS compliant for AC DC and DC DC power chargers factory
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quality Multi layer ceramic capacitor AIDE CAPACITOR 0603X7R821K500NT RoHS compliant for AC DC and DC DC power chargers factory
>
Specifications
Voltage Rating:
50V
Capacitance:
820pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R821K500NT
Model Number:
0603X7R821K500NT
Package:
0603
Key Attributes
Product Description

Product Overview

High-voltage Multi-Layer Ceramic Capacitors (MLCCs) designed for applications in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. These capacitors are suitable for coupling, wave filtering, and resonant functions in medium and high voltage circuits.

Product Attributes

  • Temperature Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Compliance: RoHS/REACH compliant

Technical Specifications

Item Description/Specification Testing Method
Application Field
Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC).
Testing Conditions
Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
3. Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC) 250 25V, 251 250V, 252 2500V
7. Packing T Tape/Reel, P Bag packing (PE)
Construction
Item Description
1 Ceramic dielectric
2 Inner electrode
3 Outer electrode
4 Nickle layer
5 Tin layer
Dimension (mm)
Part Number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method
1. Temperature -55~+125
2. Visual/Dimension 1. No Damage 2. Dimension meet Spec Naked eye (Visual inspection), Digital caliper
3. Static Capacity Meet standard specification and tolerance NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF).
4. Dissipation Factor (DF) NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr). X7R/X7T/X7P: See Note 1. NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF). X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF).
5. IR Insulation Resistance NPO: IR50000M (C10nF); IR*Cr500S (C>10nF). X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C>25nF). Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
6. Hi-pot (DC) No dielectric breakdown or damage Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S
7. Solderability Soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
8. Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9. Flexural Strength No damage. Electro static capacity change rate: C/C10% Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
10. Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
11. Thermal Shock NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
12. Temperature Moisture Exposure Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.
13. High Temperature Exposure Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature.
14. PCB Flexural Strength No crack and other defect Soldering the MLCC on the PCB, then pressing direction base on the photo.
Embossed Plastic Taping Dimensions (mm)
Code Tape size A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max
Paper Tape Reel Packing Dimensions (mm)
Code Paper size W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
Reel Dimensions (unit: mm)
Type A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
Taping Specification
Top tape peeling strength (a) Paper Taping Reel type 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing quantity Size Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000 -
0805 4000 3000 (T1.35mm)
1206 - 3000 (T1.60mm) / 2000 (T>1.60mm)
1210 - 3000 (T1.85mm) / 1000 (T>1.85mm)
1808 - 800
1812 - 500
Precautions For Use
1. Soldering Profile To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph.
2. Manual Soldering Manual soldering can pose a risk of creating thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact.
3. Optimum Solder Amount for Reflow Soldering Recommended Soldering amounts.
4. Recommended Soldering Method RReflow Soldering, WWave Soldering. Specific recommendations vary by size, temperature characteristic, rated voltage, and capacitance.
5. Soldering Temperature Profile While preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.

2509251626_AIDE-CAPACITOR-0603X7R821K500NT_C49326659.pdf

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