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Specifications
Voltage Rating:
16V
Capacitance:
22uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
0805X5R226M160NT
Model Number:
0805X5R226M160NT
Package:
0805
Key Attributes
Product Description
Product Overview
High-voltage Multi-Layer Ceramic Capacitors (MLCCs) designed for coupling, wave filtering, and resonant applications in high-voltage circuits. These capacitors are suitable for a wide range of power supply and electronic applications, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer reliable performance in medium and high voltage environments.
Product Attributes
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Details |
|---|---|---|
| Application Field | High voltage circuits | |
| Function | Coupling, wave filtering, resonant | |
| Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |
| Type | Medium and High voltage MLCC | |
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Part Number Description | Example | 1812 X7R 684 M 251 N T |
| Components | Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing | |
| Dimension Codes (L*W) | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| Temperature Characteristic | C0G | 0 30 PPM/ |
| X7R | 15% | |
| X5R | 15% | |
| Nominal Electrostatic Capacity | Example | 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF |
| Unit | pF | |
| Tolerance of Electrostatic Capacity | Codes | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% |
| Unit | % or pF | |
| Rated Voltage (DC) | Examples | 250 = 25V, 251 = 250V, 252 = 2500V |
| Unit | V | |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| Packing | T: Tape/Reel, P: Bag packing (PE) | |
| Construction & Dimension | Construction Items | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer |
| Dimensions (mm) - British System (Part Number) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532), 1825 (4563), 2220 (5750), 2225 (5763) | |
| Dimensions (mm) - Metric System (L x W x T) | 0603: 0.600.10 x 0.300.05 x 0.300.05; 1005: 1.000.15 x 0.500.15 x 0.500.10; 1608: 1.600.20 x 0.800.15 x 0.800.15; 2012: 2.000.20 x 1.250.20 x 0.800.20; 3216: 3.200.30 x 1.600.30 x 1.000.20; 3225: 3.200.30 x 2.500.30 x 0.800.30; 4520: 4.500.40 x 2.000.20 x 0.800.30; 4532: 4.500.40 x 3.200.30 x 0.800.30; 4563: 4.500.40 x 6.300.50 x 0.800.30; 5750: 5.700.50 x 5.000.50 x 1.000.40; 5763: 5.700.50 x 6.300.50 x 1.000.40 | |
| WB (mm) | 0.100.05 (0603), 0.200.10 (1005), 0.300.10 (1608), 0.500.20 (2012), 0.600.30 (3216), 0.800.30 (3225), 0.800.30 (4520), 0.800.30 (4532), 0.800.30 (4563), 1.000.40 (5750), 1.000.40 (5763) | |
| T (Max mm) | 0.30 (0603), 0.50 (1005), 0.80 (1608), 1.25 (2012), 1.60 (3216), 2.70 (3225), 2.70 (4520), 3.50 (4532), 3.50 (4563), 3.50 (5750), 6.20 (5763) | |
| Temperature Characteristic | C0G, X7R, X5R, X7T, X7P, X6S, Y5V | |
| Temperature Range | -55~+125 | |
| Dissipation Factor (DF) | Varies by characteristic and capacitance (See Note 1 for details) | |
| Insulation Resistance (IR) | Varies by characteristic and capacitance (See Specification section for details) | |
| Hi-pot (DC) | 2.5 x rated voltage (Ur=100V), 2.0 x rated voltage (Ur=200V/250V), 1.5 x rated voltage (Ur=450/500/630V), 1.2 x rated voltage (1KVUr2KV), 1.1 x rated voltage (2KVUr) | |
| Solderability | Soldering area 90%, No damage. Pre-heating: 80-120 (10-30s), Soldering: 2455 (20.5s) | |
| Resistance to the heat of soldering | No damage, soldering area 90%. Pre-heating: 100-200 (102s), Soldering: 2655 (51s) | |
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF; X7R: 15%; X7T: -33% to 22%; X7P: 10% | |
| Flexural Strength | No damage. Electrostatic capacity change rate: 10%. Flexural depth: 452 mm | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N (101S) | |
| Thermal Shock | NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: 10% | |
| Temperature Moisture Exposure | NPO: 2% or 1pF; X7R/X7T/X7P: 10%. DF 2x initial standard. IR varies by characteristic. | |
| High Temperature Exposure | NPO: 2% or 1pF; X7R/X7T/X7P: 20%. DF 2x initial standard. IR varies by characteristic. | |
| PCB Flexural Strength | No crack and other defects. IR tested after soldering. | |
| Embossed Plastic Taping Dimensions (mm) | 0805: A=1.550.20, B=2.350.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.50 Max. (Details for 1206, 1210, 1808, 1812 available) | |
| Paper Tape Reel Packing Dimensions (mm) | 1005: W1=0.240.02, L1=0.450.02, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.30 Below. (Details for 0201, 0402, 0603, 0805, 1206 available) | |
| Reel Dimensions (mm) | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | |
| Packing Quantity (Pcs) | 0603: 4000 (Paper T/R); 0805: 4000 (Paper T/R), 3000 (Plastic T/R); 1206: 4000 (Paper T/R), 3000 (Plastic T/R, T1.60mm), 2000 (Plastic T/R, T>1.60mm); 1210: 2000 (Plastic T/R, T1.85mm), 1000 (Plastic T/R, T>1.85mm); 1812: 800 (Plastic T/R); 1812: 500 (Plastic T/R) | |
| Recommended Soldering Method | RReflow Soldering, WWave Soldering (Details by Size, Characteristic, Voltage, Capacitance) | |
| Soldering Temperature Profile | Preheating: T150 (temperature difference between soldering temp and surface temp of chips) | |
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes such as burn out, flaming, or glowing, adhere to the following precautions:
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron tip and temperature.
- Optimum Solder Amount: Use the recommended solder amount for reflow soldering.
2509251626_AIDE-CAPACITOR-0805X5R226M160NT_C49326686.pdf
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