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Specifications
Voltage Rating:
250V
Capacitance:
33nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R333K251NT
Model Number:
0805X7R333K251NT
Package:
0805
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer various temperature characteristics (C0G, X7R, X5R) and a wide range of capacitance, tolerance, and voltage ratings. They are available in multiple standard sizes and are compliant with RoHS and REACH standards. Proper handling and soldering procedures are crucial to ensure reliability and prevent failures.
Product Attributes
- Certifications: RoHS compliant, REACH compliant
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature characteristic (C0G, X7R, X5R) Nominal electrostatic capacity (pF) Tolerance of electrostatic capacity (B, C, D, F, G, J, K, M, Z) Rated voltage (DC) (V) Terminal composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag packing) | ||
| Dimensions | Code | L*W (inch) | L*W (mm) |
| 0201 | 0.02*0.01 | 0.50*0.25 | |
| 0402 | 0.04*0.02 | 1.00*0.50 | |
| 0603 | 0.06*0.03 | 1.60*0.80 | |
| 0805 | 0.08*0.05 | 2.00*1.25 | |
| 1206 | 0.12*0.06 | 3.20*1.60 | |
| 1210 | 0.12*0.10 | 3.20*2.50 | |
| 1808 | 0.18*0.08 | 4.50*2.00 | |
| 1812 | 0.18*0.12 | 4.50*3.20 | |
| 1825 | 0.18*0.25 | 4.50*6.30 | |
| 2211 | 0.22*0.11 | 5.70*2.8 | |
| 2225 | 0.22*0.25 | 5.70*6.30 | |
| Part number Dimension (mm) | British system | Metric system | |
| 0201 (0603) | L: 0.600.10, W: 0.300.05, T: 0.300.05, WB: 0.100.05 | ||
| 0402 (1005) | L: 1.000.15, W: 0.500.15, T: 0.500.10, WB: 0.200.10 | ||
| 0603 (1608) | L: 1.600.20, W: 0.800.15, T: 0.800.15, WB: 0.300.10 | (0.600.10) | |
| 0805 (2012) | L: 2.000.20, W: 1.250.20, T: 0.800.20, WB: 0.500.20 | (1.000.20) | |
| 1206 (3216) | L: 3.200.30, W: 1.600.30, T: 1.000.20, WB: 0.600.30 | (1.250.20) | |
| 1210 (3225) | L: 3.200.30, W: 2.500.30 (2.70), T: 0.800.30 | (1.250.20) | |
| 1808 (4520) | L: 4.500.40, W: 2.000.20 (2.70), T: 0.800.30 | (1.250.20) | |
| 1812 (4532) | L: 4.500.40, W: 3.200.30 (3.50), T: 0.800.30 | (1.250.20) | |
| 1825 (4563) | L: 4.500.40, W: 6.300.50 (3.50), T: 0.800.30 | (1.250.20) | |
| 2220 (5750) | L: 5.700.50, W: 5.000.50 (3.50), T: 1.000.40 | ||
| 2225 (5763) | L: 5.700.50, W: 6.300.50 (6.20), T: 1.000.40 | ||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| Temperature Range | -55~+125 | ||
| Static Capacity | NPO characteristic | 1000pF: 1MHz10%, 1.00.2Vrms >1000pF: 1KHz10%, 1.00.2Vrms | |
| X7R/X7T/X7P characteristic | 10uF: 1KHz10%, 1.00.2Vrms >10uF: 120Hz24, 0.50.1Vrms | ||
| Dissipation Factor (DF) | NPO Characteristic | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF, 1MHz10%, 1V0.2rms Cr1000pF, 1KHz10%, 1V0.2rms | |
| X7R/X7T/X7P characteristic | Cr10uF, 1KHz10%, 1V0.1rms Cr10uF, 120Hz24Hz, 0.5V0.1rms | See Note 1 | |
| Insulation Resistance (IR) | NPO Characteristic | IR50000M, C10nF IR*Cr500S, C10nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| X7R/X7T/X7P Characteristic | IR10000M, C25nF IR*Cr100S, C25nF | ||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | ||
| Solderability | Soldering area 90%. Visual-No damage. Pre-heating temperature: 80-120, time: 10-30s, lead-free solder, flux. Soldering temperature: 2455, Solder time: 20.5s. | ||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating temperature: 100-200, time: 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||
| Electrostatic Capacity Change Rate | NPO Characteristic | C/C 0.5% or 0.5pF (larger reading) | Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. |
| X7R | C/C 15% | ||
| X7T | -33% C/C 22% | ||
| X7P | C/C 10% | ||
| Flexural Strength | No damage. Base board: Al2O3 /PCB PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate: C/C 10% | ||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S | ||
| Thermal Shock | NPO Characteristic | C/C 2.5% or 0.25pF (larger reading) | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. |
| X7R/X7P characteristic | C/C 0.5% | ||
| X7T characteristic | C/C 10% | ||
| Temperature Moisture Exposure | Visual | No visual damage | Test after placing 242 hours at normal temp & humidity. Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. |
| Electrostatic Capacitance Change Rate | NPO characteristic: C/C 2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C 10% | ||
| DF | 2 times initial standard | ||
| IR | NPO characteristic: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | ||
| High Temperature Exposure | Visual | No visual damage | Test after placing 48 hours under normal pressure & temperature. Temperature: 1253, Time: 100048 hours. Charging and discharging current: 50mA Max. |
| Voltage | 100VV250V: 2x Rated voltage 250VV1KV: 1.5x rated voltage 1KVV: 1.2x rated voltage | ||
| Electrostatic Capacitance Change Rate | NPO: C/C 2% or 1pF (larger reading) X7R/X7T/X7P: C/C 20% | ||
| DF | 2 X initial standard | ||
| IR | NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | ||
| PCB Flexural Strength | No crack and other defect. IR Soldering the MLCC on the PCB, then pressing direction based on the photo. SIZE | A | B | C 0805(2012) | 1.2 | 4 | 1.65 1206(3216) | 2.2 | 5 | 2 1210(3225) | 2.2 | 5 | 2.9 1812(4532) | 3.5 | 7 | 3.7 2220(5750) | 4.5 | 8 | 5.6 | ||
| Embossed Plastic Taping | Tapesize | A | B | C | D | E | F | G | H | J | T 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | ||
| Paper Tape Reel Packing | Code | Papersize W1 | L1 | D | C | B | P1 | P2 | P0 | d | t 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below Code | Papersize A | B | C | D | E | F | G | H | J | T 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| Reel Dimensions | Unit: mm Type | A | B | C | D | E | F | G 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) 0603 | 4000 | 0805 | 4000 | 3000 (T1.35mm) 1206 | | 3000 (T1.60mm) / 2000 (T>1.60mm) 1210 | | 1000 (T1.85mm) / 800 (T>1.85mm) 1808 | | 500 1812 | | 500 | ||
| Soldering Profile | To avoid crack problems due to sudden temperature changes, follow the recommended temperature profile. | ||
| Manual Soldering | Handle soldering iron carefully, pay attention to tip selection and temperature to avoid thermal cracks. | ||
| Recommended Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method 1005 | NPO / X7R/X5R/X7S/X6S | / / | / / | R / R 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R / R / R 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R / R / R 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / R / C1uf R/W / C1uf R C1uf R/W | R / R/W / R/W 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / R C4.7uf R/W / C1uf R C1uf R/W | R/W / R/W 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / R C10uf R/W / C10uf R C10uf R/W | R/W / R/W 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R / R / R Soldering method: RReflow Soldering, WWave Soldering | ||
| Soldering Temperature Profile | Preheating: Keep temperature difference between soldering temperature and surface temperature of chips 150. | ||
2509251626_AIDE-CAPACITOR-0805X7R333K251NT_C49326717.pdf
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