Online Service

Online Service

Contact Person
+86 136 6733 2386
quality Ceramic Multi Layer Capacitor AIDE CAPACITOR 1206C0G101J500NT Suitable for High Voltage Applications factory
<
quality Ceramic Multi Layer Capacitor AIDE CAPACITOR 1206C0G101J500NT Suitable for High Voltage Applications factory
>
Specifications
Voltage Rating:
50V
Capacitance:
100pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
1206C0G101J500NT
Model Number:
1206C0G101J500NT
Package:
1206
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving critical roles in coupling, wave filtering, and resonance within power supplies and communication interfaces. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer a range of temperature characteristics including C0G, X7R, and X5R, with various options for capacitance, tolerance, and rated voltage, ensuring reliable performance in demanding electrical environments.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Certifications: RoHS compliant, REACH compliant

Technical Specifications

Item Description Specification/Requirement Testing Method
1. Temperature Characteristic C0G 0 30 PPM/ -
X7R / X5R 15% -
2. Nominal Electrostatic Capacity 8R0 8.0 pF -
100 10 pF -
101 100 pF -
3. Tolerance of Electrostatic Capacity B 0.1 pF -
C 0.25 pF -
D 0.5 pF -
F 1% -
G 2% -
J 5% -
K 10% -
M 20% -
Z +80% / -20% -
NPO Characteristic 1000pF 1MHz 10%, 1.0 0.2Vrms
4. Rated Voltage (DC) 250 25 V -
251 250 V -
5. Static Capacity NPO Characteristic: 1000pF 1MHz 10%, 1.0 0.2Vrms -
NPO Characteristic: > 1000 pF 1KHz 10%, 1.0 0.2Vrms -
X7R/X7T/X7P Characteristic: 10uF 1KHz 10%, 1.0 0.2Vrms -
X7R/X7T/X7P Characteristic: > 10uF 120Hz 24, 0.5 0.1Vrms -
6. Temperature Range - -55 ~ +125 -
7. Insulation Resistance (IR) NPO Characteristic: C 10nF 50000 M Rated voltage, 605s, Humidity 75%, Temp 255, Current 50mA
NPO Characteristic: C > 10nF IR*C 500 S Rated voltage, 605s, Humidity 75%, Temp 255, Current 50mA
X7R/X7T/X7P Characteristic: C 25nF 10000 M Rated voltage, 605s, Humidity 75%, Temp 255, Current 50mA
X7R/X7T/X7P Characteristic: C > 25nF IR*C 100 S Rated voltage, 605s, Humidity 75%, Temp 255, Current 50mA
8. Hi-pot (DC) Ur=100V 2.5 x rated voltage Voltage Raising time: 1-10S, Voltage maintaining time: 2S
Ur=200V/250V 2.0 x rated voltage Voltage Raising time: 1-10S, Voltage maintaining time: 2S
Ur=450/500/630V 1.5 x rated voltage Voltage Raising time: 1-10S, Voltage maintaining time: 2S
1KV Ur 2KV 1.2 x rated voltage Voltage Raising time: 1-10S, Voltage maintaining time: 2S
2KV < Ur 1.1 x rated voltage Voltage Raising time: 1-10S, Voltage maintaining time: 2S
9. Solderability Soldering area 90% Pre-heating 80-120 (10-30s), Lead free solder, flux. Soldering 2455 (20.5s) Visual - No damage
10. Resistance to the heat of soldering Soldering area 90% Pre-heating 100-200 (102s), Soldering 2655 (51s). Cleaning with solvent. Room temp, 242 hours. Visual - No damage
11. Flexural Strength - Electrostatic capacity change rate: 10% Base board: Al2O3 /PCB (1.6mm thickness). Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status.
12. Terminal Bonding Strength - - Applied Force: 5N, Duration: 101S. No visual damage.
13. Thermal Shock NPO Characteristic: C/C 2.5% or 0.25pF (larger reading) Pre-condition (X7R h characteristic): Upper limit temp 1hr, place 241 hrs. Run 5 cycles. Test after 242 hrs normal temp & humidity. -
X7R/X7P Characteristic: C/C 0.5% Pre-condition (X7R h characteristic): Upper limit temp 1hr, place 241 hrs. Run 5 cycles. Test after 242 hrs normal temp & humidity. -
X7T Characteristic: C/C 10% Pre-condition (X7R h characteristic): Upper limit temp 1hr, place 241 hrs. Run 5 cycles. Test after 242 hrs normal temp & humidity. -
14. Temperature Moisture Exposure NPO characteristic: C/C 2% or 1pF (larger reading) Temp 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hrs normal temp & humidity. Visual - No visual damage
X7R/X7T/X7P characteristic: C/C 10% Temp 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hrs normal temp & humidity. Visual - No visual damage
DF 2 times initial standard Temp 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hrs normal temp & humidity.
IR (NPO) 2500 M or IR*C 25 S (Lower reading) Temp 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hrs normal temp & humidity.
IR (X7R/X7T/X7P) 1000 M or IR*C 25 S (Lower reading) Temp 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hrs normal temp & humidity.
15. High Temperature Exposure NPO: C/C 2% or 1pF (larger reading) Temp 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated Voltage), 250V Visual - No visual damage
X7R/X7T/X7P: C/C 20% Temp 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated Voltage), 250V Visual - No visual damage
DF (X7R/X7T/X7P) 2 X initial standard Temp 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated Voltage), 250V -
IR (NPO) 4000 M or IR*C 40 S (Lower reading) Temp 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated Voltage), 250V -
IR (X7R/X7T/X7P) 2000 M or IR*C 50 S (Lower reading) Temp 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated Voltage), 250V -
16. PCB Flexural Strength - - IR test after soldering MLCC on PCB. Pressing direction based on diagram.

Dimensions (mm)

Part Number Dimension Code L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40

Packing Information

Embossed Plastic Taping:

Code Tape Size (mm) A B C D E F G H J T
0805 - 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 - 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 - 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 - 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 - 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max

Paper Tape Reel Packing:

Code Paper Size (mm) W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below -
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below -
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below -
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max -
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max -
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max -

Reel Dimensions (unit: mm):

Type A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max

Top tape peeling strength (a) Paper Taping: 0.1N < peeling strength < 0.7N

Packing Quantity:

Dimension Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000 -
0805 4000 3000 (T1.35mm)
1206 - 3000 (T>1.35mm)
1210 - 2000 (T1.60mm)
1808 - 3000 (T>1.60mm)
1812 - 2000
1812 - 1000 (T1.85mm)
- - 800 (T>1.85mm)
- - 500

Precautions For Use

Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent issues like burn out, flaming, or glowing, adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.

  1. Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
  2. Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is carefully handled, and select appropriate tips and temperatures.
  3. Optimum Solder Amount for Reflow Soldering.
  4. Recommended Soldering amounts.

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
C1uf R/W
Y5V / C1uf R
C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
C4.7uf R/W
Y5V / C1uf R
C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
C10uf R/W
Y5V / C10uf R
C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering method: RReflow Soldering, WWave Soldering

The temperature profile for soldering: Keep the temperature difference between soldering temperature and surface temperature of chips as T 150 during preheating.


2509251626_AIDE-CAPACITOR-1206C0G101J500NT_C49326724.pdf

Request A Quote

Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible

You Can Upload Up To 5 Files And Each File Sized 10M Max