Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving critical roles in coupling, wave filtering, and resonance within power supplies and communication interfaces. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer a range of temperature characteristics including C0G, X7R, and X5R, with various options for capacitance, tolerance, and rated voltage, ensuring reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |
|---|---|---|---|---|
| 1. Temperature Characteristic | C0G | 0 30 PPM/ | - | |
| X7R / X5R | 15% | - | ||
| 2. Nominal Electrostatic Capacity | 8R0 | 8.0 pF | - | |
| 100 | 10 pF | - | ||
| 101 | 100 pF | - | ||
| 3. Tolerance of Electrostatic Capacity | B | 0.1 pF | - | |
| C | 0.25 pF | - | ||
| D | 0.5 pF | - | ||
| F | 1% | - | ||
| G | 2% | - | ||
| J | 5% | - | ||
| K | 10% | - | ||
| M | 20% | - | ||
| Z | +80% / -20% | - | ||
| NPO Characteristic | 1000pF | 1MHz 10%, 1.0 0.2Vrms | ||
| 4. Rated Voltage (DC) | 250 | 25 V | - | |
| 251 | 250 V | - | ||
| 5. Static Capacity | NPO Characteristic: 1000pF | 1MHz 10%, 1.0 0.2Vrms | - | |
| NPO Characteristic: > 1000 pF | 1KHz 10%, 1.0 0.2Vrms | - | ||
| X7R/X7T/X7P Characteristic: 10uF | 1KHz 10%, 1.0 0.2Vrms | - | ||
| X7R/X7T/X7P Characteristic: > 10uF | 120Hz 24, 0.5 0.1Vrms | - | ||
| 6. Temperature Range | - | -55 ~ +125 | - | |
| 7. Insulation Resistance (IR) | NPO Characteristic: C 10nF | 50000 M | Rated voltage, 605s, Humidity 75%, Temp 255, Current 50mA | |
| NPO Characteristic: C > 10nF | IR*C 500 S | Rated voltage, 605s, Humidity 75%, Temp 255, Current 50mA | ||
| X7R/X7T/X7P Characteristic: C 25nF | 10000 M | Rated voltage, 605s, Humidity 75%, Temp 255, Current 50mA | ||
| X7R/X7T/X7P Characteristic: C > 25nF | IR*C 100 S | Rated voltage, 605s, Humidity 75%, Temp 255, Current 50mA | ||
| 8. Hi-pot (DC) | Ur=100V | 2.5 x rated voltage | Voltage Raising time: 1-10S, Voltage maintaining time: 2S | |
| Ur=200V/250V | 2.0 x rated voltage | Voltage Raising time: 1-10S, Voltage maintaining time: 2S | ||
| Ur=450/500/630V | 1.5 x rated voltage | Voltage Raising time: 1-10S, Voltage maintaining time: 2S | ||
| 1KV Ur 2KV | 1.2 x rated voltage | Voltage Raising time: 1-10S, Voltage maintaining time: 2S | ||
| 2KV < Ur | 1.1 x rated voltage | Voltage Raising time: 1-10S, Voltage maintaining time: 2S | ||
| 9. Solderability | Soldering area 90% | Pre-heating 80-120 (10-30s), Lead free solder, flux. Soldering 2455 (20.5s) | Visual - No damage | |
| 10. Resistance to the heat of soldering | Soldering area 90% | Pre-heating 100-200 (102s), Soldering 2655 (51s). Cleaning with solvent. Room temp, 242 hours. | Visual - No damage | |
| 11. Flexural Strength | - | Electrostatic capacity change rate: 10% | Base board: Al2O3 /PCB (1.6mm thickness). Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. | |
| 12. Terminal Bonding Strength | - | - | Applied Force: 5N, Duration: 101S. No visual damage. | |
| 13. Thermal Shock | NPO Characteristic: C/C 2.5% or 0.25pF (larger reading) | Pre-condition (X7R h characteristic): Upper limit temp 1hr, place 241 hrs. Run 5 cycles. Test after 242 hrs normal temp & humidity. | - | |
| X7R/X7P Characteristic: C/C 0.5% | Pre-condition (X7R h characteristic): Upper limit temp 1hr, place 241 hrs. Run 5 cycles. Test after 242 hrs normal temp & humidity. | - | ||
| X7T Characteristic: C/C 10% | Pre-condition (X7R h characteristic): Upper limit temp 1hr, place 241 hrs. Run 5 cycles. Test after 242 hrs normal temp & humidity. | - | ||
| 14. Temperature Moisture Exposure | NPO characteristic: C/C 2% or 1pF (larger reading) | Temp 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hrs normal temp & humidity. | Visual - No visual damage | |
| X7R/X7T/X7P characteristic: C/C 10% | Temp 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hrs normal temp & humidity. | Visual - No visual damage | ||
| DF | 2 times initial standard | Temp 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hrs normal temp & humidity. | ||
| IR (NPO) | 2500 M or IR*C 25 S (Lower reading) | Temp 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hrs normal temp & humidity. | ||
| IR (X7R/X7T/X7P) | 1000 M or IR*C 25 S (Lower reading) | Temp 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hrs normal temp & humidity. | ||
| 15. High Temperature Exposure | NPO: C/C 2% or 1pF (larger reading) | Temp 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated Voltage), 250V| Visual - No visual damage | | |
| X7R/X7T/X7P: C/C 20% | Temp 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated Voltage), 250V| Visual - No visual damage | | ||
| DF (X7R/X7T/X7P) | 2 X initial standard | Temp 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated Voltage), 250V| - | | |
| IR (NPO) | 4000 M or IR*C 40 S (Lower reading) | Temp 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated Voltage), 250V| - | | |
| IR (X7R/X7T/X7P) | 2000 M or IR*C 50 S (Lower reading) | Temp 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated Voltage), 250V| - | | |
| 16. PCB Flexural Strength | - | - | IR test after soldering MLCC on PCB. Pressing direction based on diagram. |
Dimensions (mm)
| Part Number Dimension Code | L | W | T | WB |
|---|---|---|---|---|
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
Packing Information
Embossed Plastic Taping:
| Code | Tape Size (mm) | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0805 | - | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | - | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | - | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | - | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | - | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
Paper Tape Reel Packing:
| Code | Paper Size (mm) | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | - |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | - |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | - |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | - |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | - |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | - |
Reel Dimensions (unit: mm):
| Type | A | B | C | D | E | F | G |
|---|---|---|---|---|---|---|---|
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
Top tape peeling strength (a) Paper Taping: 0.1N < peeling strength < 0.7N
Packing Quantity:
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
|---|---|---|
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T>1.35mm) |
| 1210 | - | 2000 (T1.60mm) |
| 1808 | - | 3000 (T>1.60mm) |
| 1812 | - | 2000 |
| 1812 | - | 1000 (T1.85mm) |
| - | - | 800 (T>1.85mm) |
| - | - | 500 |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent issues like burn out, flaming, or glowing, adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is carefully handled, and select appropriate tips and temperatures.
- Optimum Solder Amount for Reflow Soldering.
- Recommended Soldering amounts.
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
The temperature profile for soldering: Keep the temperature difference between soldering temperature and surface temperature of chips as T 150 during preheating.
2509251626_AIDE-CAPACITOR-1206C0G101J500NT_C49326724.pdf
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