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Specifications
Voltage Rating:
50V
Capacitance:
10nF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
1206C0G103J500NT
Model Number:
1206C0G103J500NT
Package:
1206
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCCs are available in various sizes and temperature characteristics, with options for different tolerances, rated voltages, and terminal compositions.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Dimension Code | 0201 (Metric: 0603) | L*W (inch): 0.02*0.01, L*W (mm): 0.50*0.25 | |||
| 0402 (Metric: 1005) | L*W (inch): 0.04*0.02, L*W (mm): 1.00*0.50 | ||||
| 0603 (Metric: 1608) | L*W (inch): 0.06*0.03, L*W (mm): 1.60*0.80 | ||||
| 0805 (Metric: 2012) | L*W (inch): 0.08*0.05, L*W (mm): 2.00*1.25 | ||||
| 1206 (Metric: 3216) | L*W (inch): 0.12*0.06, L*W (mm): 3.20*1.60 | ||||
| 1210 (Metric: 3225) | L*W (inch): 0.12*0.10, L*W (mm): 3.20*2.50 | ||||
| 1808 (Metric: 4520) | L*W (inch): 0.18*0.08, L*W (mm): 4.50*2.00 | ||||
| 1812 (Metric: 4532) | L*W (inch): 0.18*0.12, L*W (mm): 4.50*3.20 | ||||
| 1825 (Metric: 4563) | L*W (inch): 0.18*0.25, L*W (mm): 4.50*6.30 | ||||
| 2211 (Metric: 5728) | L*W (inch): 0.22*0.11, L*W (mm): 5.70*2.80 | ||||
| 2225 (Metric: 5763) | L*W (inch): 0.22*0.25, L*W (mm): 5.70*6.30 | ||||
| Temperature Characteristic | C0G | (0 30 PPM/) | |||
| X7R | (15%) | ||||
| X5R | (15%) | ||||
| Nominal Electrostatic Capacity | 8R0 | 8.0 pF | |||
| 100 | 10 pF | ||||
| 101 | 100 pF | ||||
| Tolerance of Electrostatic Capacity | B | 0.1pF | |||
| C | 0.25pF | ||||
| D | 0.5pF | ||||
| F | 1% | ||||
| G | 2% | ||||
| J | 5% | ||||
| K | 10% | ||||
| M | 20% | ||||
| Z | +80%/-20% | ||||
| Rated Voltage (DC) | Example: 251 | 250V | |||
| Testing Condition | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252 | ||||
| Humidity: 60~70%RH | |||||
| Atmosphere: 86~106kPa | |||||
| Used when testing data does not match testing specification. | |||||
| Construction | 1. Ceramic dielectric | - | |||
| 2. Inner electrode | - | ||||
| 3. Outer electrode | - | ||||
| 4. Nickel layer | - | ||||
| 5. Tin layer | - | ||||
| Dimension (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Range | Item | Specification | |||
| Temperature | -55~+125 | ||||
| Solderability | Specification | Soldering area 90% | |||
| Testing Method | Visual inspection, Pre-heating temperature 80-120, time 10-30s, lead-free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||
| Resistance to the heat of soldering | Specification | Visual-No damage, soldering area 90% | |||
| Testing Method | Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||
| Flexural Strength | Specification | No damage. Electrostatic capacity change rate C/C10% | |||
| Testing Method | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. | ||||
| Terminal Bonding Strength | Specification | No visual damage. | |||
| Testing Method | Applied Force: 5N, Duration: 101S. | ||||
| Thermal Shock | Specification | NPO Characteristic: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. | |||
| Testing Method | Pre-condition (X7R characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | ||||
| Temperature Moisture Exposure | Specification | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (lower reading). | |||
| Testing Method | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. | ||||
| High Temperature Exposure | Specification | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (lower reading). | |||
| Testing Method | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature. | ||||
| PCB Flexural Strength | Specification | No crack and other defect. | |||
| Testing Method | MLCC soldered on PCB. Pressing direction based on provided photo. IR measurement. | ||||
| Packing Quantity | Paper T/R (Pcs) | Plastic T/R (Pcs) | |||
| 0805 | 4000 | 3000 (T1.35mm) | |||
| 1206 | 4000 | 3000 (T>1.35mm) | |||
| 1210 | - | 2000 (T1.60mm) | |||
| 1808 | - | 3000 (T>1.60mm) | |||
| 1812 | - | 2000 | |||
| 1812 above | - | 1000 (T1.85mm) | |||
| 1000 (T>1.85mm) | |||||
| 800 | |||||
| 500 |
Precautions For Use
MLCCs may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions, potentially resulting in burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact the engineering section or factory for handling precautions.
- Soldering Profile: Follow the temperature profile to avoid cracks from sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron tip and temperature.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering Method Key: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
During preheating, maintain the temperature difference between soldering temperature and chip surface temperature as T150.
2509251626_AIDE-CAPACITOR-1206C0G103J500NT_C49326726.pdf
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