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quality Ceramic Capacitor AIDE CAPACITOR 1206X7R226K6R3NT Suitable for Medium High Voltage MLCC Applications factory
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quality Ceramic Capacitor AIDE CAPACITOR 1206X7R226K6R3NT Suitable for Medium High Voltage MLCC Applications factory
>
Specifications
Voltage Rating:
6.3V
Capacitance:
22uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1206X7R226K6R3NT
Model Number:
1206X7R226K6R3NT
Package:
1206
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCC) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They are suitable for medium and high voltage MLCC applications.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Certifications: RoHS compliant, REACH compliant

Technical Specifications

Item Description Specification/Requirement Testing Method
1. Application Field Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC).
Testing Conditions:
  • Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
  • Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
2. Part Number Description Example: 1812 X7R 684 M 251 N T
  • Dimension Code: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
  • Temperature Characteristic: C0G (030 PPM/), X7R (15%), X5R (15%)
  • Nominal Electrostatic Capacity: 8R0=8.0pF, 100=10pF, 101=100pF
  • Tolerance of Electrostatic Capacity: B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
  • Rated Voltage (DC): 250=25V, 251=250V, 252=2500V
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Packing: T=Tape/Reel, P=Bag packing(PE)
3. Construction and Dimension Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
Dimension (mm): Part number | British system | Metric system | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05
0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10
0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10
0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 1.000.20
1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 1.250.20
1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30
1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30
1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30
1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30
2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40
2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40
4. Specification and Testing Method Temperature: -55~+125 Naked eye (Visual inspection), Digital calliper
Visual/Dimension: 1. No Damage
2. Dimension meet Spec		 Naked eye (Visual inspection), Digital calliper
Static Capacity: Meet standard specification and tolerance
  • NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms
  • X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms
Dissipation Factor (DF): Refer to Note 1
  • NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
  • Cr1000pF: 1MHz10%, 1V0.2rms; Cr1000pF: 1KHz10%, 1V0.2rms
  • X7R/X7T/X7P characteristic: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 120Hz24Hz, 0.5V0.1rms
IR Insulation Resistance:
  • NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF
  • X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF
 Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC): No dielectric breakdown or damage
  • Ur=100V, 2.5 x rated voltage
  • Ur=200V/250V, 2.0 x rated voltage
  • Ur=450/500/630V, 1.5 x rated voltage
  • 1KVUr2KV, 1.2 x rated voltage
  • 2KVUr, 1.1 x rated voltage
  • Voltage Raising time: 110S, Voltage maintaining time: 2S
5. Solderability Soldering area90% Visual-No damage Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
6. Resistance to the heat of soldering Visual-No damage, soldering area90% Visual Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time: 242 hours.
7. Electrostatic capacity change rate
  • NPO Characteristic: C/C0.5% or 0.5pF (larger reading)
  • X7R: C/C15%
  • X7T: -33% C/C22%
  • X7P: C/C10%
DF Refer to NO#4
IR Refer to NO#5
8. Flexural Strength No damage Visual Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%. Flexural depth 452.
9. Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
10. Thermal Shock
  • NPO Characteristic: C/C2.5% or 0.25pF (larger reading)
  • X7R/X7P characteristic: C/C0.5%
  • X7T characteristic: C/C10%
 Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
11. Temperature Moisture Exposure
  • Visual: No visual damage
  • Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%
  • DF: 2 times initial standard
  • IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)
 Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.
12. High Temperature Exposure
  • Visual: No visual damage
  • Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%
  • DF: 2 X initial standard
  • IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)
 Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max. Test after place 48 hours under normal pressure & temperature.
13. PCB Flexural Strength No crack and other defect IR Soldering the MLCC on the PCB. Pressing direction based on photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6.
14. Embossed Plastic Taping
  • 0805: Tape size A 1.550.20, B 2.350.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.50 Max
  • 1206: Tape size A 1.950.20, B 3.600.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.85 Max
  • 1210: Tape size A 2.700.10, B 3.420.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.05, H 4.000.10, J 1.55 -0/+0.10, T 3.2 Max
  • 1808: Tape size A 2.200.10, B 4.950.10, C 12.000.10, D 5.500.05, E 1.750.10, F 4.000.10, G 2.000.05, H 4.000.10, J 1.50 -0/+0.10, T 3.0 Max
  • 1812: Tape size A 3.660.10, B 4.950.10, C 12.000.10, D 5.500.05, E 1.750.10, F 8.000.10, G 2.000.05, H 4.000.10, J 1.55 -0/+0.10, T 4.0 Max
15. Paper Tape Reel Packing
  • 1005: Papersize W1 0.240.02, L1 0.450.02, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.30
  • 0201: Papersize W1 0.370.10, L1 0.670.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80
  • 0402: Papersize W1 0.650.10, L1 1.150.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80
  • 0603: Papersize A 1.100.10, B 1.900.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max
  • 0805: Papersize A 1.450.15, B 2.300.15, C 8.00.15, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max
  • 1206: Papersize A 1.800.20, B 3.400.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max
16. Reel Dimensions
  • 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
  • 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
17. Taping Specification
  • Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
18. Packing Quantity
  • 0603 Paper T/R: 4000 Pcs
  • 0805 Paper T/R: 4000 Pcs
  • 0805 Plastic T/R (T1.35mm): 3000 Pcs
  • 1206 Plastic T/R (T1.60mm): 3000 Pcs
  • 1210 Plastic T/R (T1.85mm): 2000 Pcs
  • 1812 Plastic T/R (T>1.85mm): 1000 Pcs
  • 1812 above Plastic T/R: 800 Pcs
19. Soldering Method
  • 1005: NPO / / R, X7R/X5R/X7S/X6S / / R
  • 0201: NPO / / R, X7R/X5R/X7S/X6S / / R, Y5V / / R
  • 0402: NPO / / R, X7R/X5R/X7S/X6S / / R, Y5V / / R
  • 0603: NPO / / R/W, X7R/X5R/X7S/X6S / C1uf R C1uf R/W, Y5V / C1uf R C1uf R/W
  • 0805: NPO / / R/W, X7R/X5R/X7S/X6S / C4.7uf R C4.7uf R/W, Y5V / C1uf R C1uf R/W
  • 1206: NPO / / R/W, X7R/X5R/X7S/X6S / C10uf R C10uf R/W, Y5V / C10uf R C10uf R/W
  • 1210: NPO / / R, X7R/X5R/X7S/X6S / / R, Y5V / / R
  • Soldering method: RReflow Soldering, WWave Soldering
20. Soldering Profile
  • To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page).
  • While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions, potentially leading to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact the engineering section or factory for handling precautions.

  • Soldering Profile: Follow recommended temperature profiles to prevent thermal cracks. Maintain a temperature difference of T150 between soldering temperature and chip surface temperature during preheating.
  • Manual Soldering: Exercise caution to avoid thermal cracks. Ensure careful handling of the soldering iron, selecting appropriate tips and controlling tip contact temperature.
  • Optimum Solder Amount for Reflow Soldering: Refer to recommended soldering amounts.

2509251626_AIDE-CAPACITOR-1206X7R226K6R3NT_C49326780.pdf

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