Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and energy-saving lamp circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Compliance: RoHS/REACH
Technical Specifications
| Item | Description | Details | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC). | ||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | 1. Dimension Code |
| |||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | ||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | ||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | ||||
| Construction | Ceramic dielectric | - | |||
| Inner electrode | - | ||||
| Outer electrode | - | ||||
| Nickle layer | - | ||||
| Tin layer | - | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specifications and Testing Methods | 1. Temperature | -55~+125 | |||
| 2. Visual / Dimension | 1. No Damage, 2. Dimension meet Spec. Testing: Naked eye (Visual inspection), Digital caliper | ||||
| 3. Static Capacity | Meet standard specification and tolerance. Testing frequency and voltage vary by characteristic (NPO, X7R/X7T/X7P) and capacity. | ||||
| 4. Dissipation Factor (DF) | Specification varies by characteristic (NPO, X7R/X7T/X7P) and capacity. Testing frequency and voltage vary. | ||||
| 5. IR Insulation Resistance | Specification varies by characteristic (NPO, X7R/X7T/X7P) and capacity. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | ||||
| 6. Hi-pot (DC) | No dielectric breakdown or damage. Test voltage is a multiple of rated voltage (Ur) depending on Ur value. Voltage Raising time: 110S, Voltage maintaining time: 2S. | ||||
| 7. Solderability | Soldering area 90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||
| 9. Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%. | ||||
| 10. Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||||
| 11. Thermal Shock | Capacity change rate and DF specification vary by characteristic (NPO, X7R/X7P, X7T). Test after 5 cycles of thermal shock. | ||||
| 12. Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate, DF, and IR specifications vary by characteristic (NPO, X7R/X7T/X7P). Test conditions: 402, 90~95%RH, 50024 hours. | ||||
| 13. High Temperature Exposure | Visual: No visual damage. Capacity change rate, DF, and IR specifications vary by characteristic (NPO, X7R/X7T/X7P). Test conditions: 1253, 100048 hours, Voltage based on rated voltage. | ||||
| 14. PCB Flexural Strength | No crack and other defect. IR tested after soldering MLCC on PCB. Dimensions A, B, C provided for different sizes (0805 to 2220). | ||||
| Embossed Plastic Taping | Taping Specification | Dimensions A, B, C, D, E, F, G, H, J, T provided for sizes 0805 to 1812. | |||
| Reel Dimensions | 7' REEL (1782.0mm), 13' REEL (3302.0mm). | ||||
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. | ||||
| Paper Tape Reel Packing | Taping Specification | Dimensions W1, L1, D, C, B, P1, P2, P0, d, t provided for sizes 1005, 0201, 0402, 0603, 0805, 1206. | |||
| Reel Dimensions | 7' REEL (1782.0mm), 13' REEL (3302.0mm). | ||||
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. | ||||
| Packing Quantity | Quantities provided for Paper T/R and Plastic T/R for various sizes (e.g., 0603 Paper T/R: 4000 Pcs). | ||||
| Recommended Soldering Method | Methods (R-Reflow, W-Wave) specified for different sizes, temperature characteristics, rated voltage, and capacitance. | ||||
| Soldering Profile | Recommended soldering profiles for various sizes are available (refer to adjacent graph). Preheating temperature difference T 150. | ||||
2509251626_AIDE-CAPACITOR-1210X7R106K500NT_C49326815.pdf
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