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Specifications
Voltage Rating:
25V
Capacitance:
22uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
1210X7R226K250NT
Model Number:
1210X7R226K250NT
Package:
1210
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. They are suitable for medium and high voltage circuits.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A |
| Operating Temperature Range | -55~+125 | N/A |
| Static Capacity (NPO Characteristic) | 1000pF: 1MHz10%, 1.00.2Vrms 1000pF: 1KHz10%, 1.00.2Vrms | N/A |
| Static Capacity (X7R/X7T/X7P Characteristic) | 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | N/A |
| Dissipation Factor (DF) - NPO Characteristic | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) | Cr1000pF, 1MHz10%, 1V0.2rms Cr1000pF, 1KHz10%, 1V0.2rms |
| Dissipation Factor (DF) - X7R/X7T/X7P Characteristic | Refer to Note 1 | Cr10uF, 1KHz10%, 1V0.1rms Cr10uF, 120Hz24Hz, 0.5V0.1rms |
| Insulation Resistance (IR) - NPO Characteristic | IR50000M, C10nF IR*Cr500S, C10nF | Rated voltage, 605s, 75% Humidity, 255, 50mA Current |
| Insulation Resistance (IR) - X7R/X7T/X7P Characteristic | IR10000M, C25nF IR*Cr100S, C25nF | Rated voltage, 605s, 75% Humidity, 255, 50mA Current |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating: 80-120, 10-30s; Lead-free solder, flux; Soldering temp: 2455, Time: 20.5s |
| Resistance to the heat of soldering | No damage, Soldering area 90% | Pre-heating: 100-200, 102s; Soldering temp: 2655, Time: 51s. Cleaning with solvent. Room temp, 242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | N/A |
| Flexural Strength | No damage, Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB, Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | 5 cycles, Test after 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | 402, 90~95%RH, 50024 hours. Test after 242 hours normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | 1253, 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing. |
Packing Information
| Packing Type | Size | Quantity (Pcs) |
|---|---|---|
| Paper T/R | 0603 | 4000 |
| Paper T/R | 0805 | 4000 |
| Plastic T/R | 0805 (T1.35mm) | 3000 |
| Plastic T/R | 1206 (T1.60mm) | 3000 |
| Plastic T/R | 1206 (T1.60mm) | 2000 |
| Plastic T/R | 1210 | 1000 |
| Plastic T/R | 1812 | 800 |
| Plastic T/R | 1812 | 500 |
Precautions for Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent potential issues like burnout, flaming, or glowing, adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is appropriately selected and handled carefully to avoid direct contact with the ceramic body.
- Optimum Solder Amount for Reflow Soldering.
- Recommended Soldering amounts.
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| 1005 | X7R/X5R/X7S/X6S | / | / | R |
| 0201 | NPO | / | / | R |
| 0201 | X7R/X5R/X7S/X6S | / | / | R |
| 0201 | Y5V | / | / | R |
| 0402 | NPO | / | / | R |
| 0402 | X7R/X5R/X7S/X6S | / | / | R |
| 0402 | Y5V | / | / | R |
| 0603 | NPO | / | / | R/W |
| 0603 | X7R/X5R/X7S/X6S | / | C1uf | R |
| 0603 | X7R/X5R/X7S/X6S | / | C1uf | R/W |
| 0603 | Y5V | / | C1uf | R |
| 0603 | Y5V | / | C1uf | R/W |
| 0805 | NPO | / | / | R/W |
| 0805 | X7R/X5R/X7S/X6S | / | C4.7uf | R |
| 0805 | X7R/X5R/X7S/X6S | / | C4.7uf | R/W |
| 0805 | Y5V | / | C1uf | R |
| 0805 | Y5V | / | C1uf | R/W |
| 1206 | NPO | / | / | R/W |
| 1206 | X7R/X5R/X7S/X6S | / | C10uf | R |
| 1206 | X7R/X5R/X7S/X6S | / | C10uf | R/W |
| 1206 | Y5V | / | C10uf | R |
| 1206 | Y5V | / | C10uf | R/W |
| 1210 | NPO | / | / | R |
| 1210 | X7R/X5R/X7S/X6S | / | / | R |
| 1210 | Y5V | / | / | R |
Soldering Method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
During preheating, maintain the temperature difference between soldering temperature and chip surface temperature as T150.
2509251626_AIDE-CAPACITOR-1210X7R226K250NT_C49326823.pdf
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