Product Overview
High-performance Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding applications in high voltage circuits. These capacitors are ideal for coupling, wave filtering, and resonant functions within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer reliable performance across a range of operating conditions and are available in various sizes and specifications to meet diverse industrial needs.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (Medium and High voltage MLCC) | ||
| Applications: Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. | |||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For data not matching testing specification | |
| Initial Capacitance Testing | Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature | ||
| Part Number Description | Example: 1812 X7R 684 M 251 N T | ||
| Dimension Code | (Inch/mm) | 0201 (0.02*0.01 / 0.50*0.25), 0402 (0.04*0.02 / 1.00*0.50), 0603 (0.06*0.03 / 1.60*0.80), 0805 (0.08*0.05 / 2.00*1.25), 1206 (0.12*0.06 / 3.20*1.60), 1210 (0.12*0.10 / 3.20*2.50), 1808 (0.18*0.08 / 4.50*2.00), 1812 (0.18*0.12 / 4.50*3.20), 1825 (0.18*0.25 / 4.50*6.30), 2211 (0.22*0.11 / 5.70*2.8), 2225 (0.22*0.25 / 5.70*6.30) | |
| Temperature Characteristic | Code | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | Format | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | Code | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | Code | 25025V, 251250V, 2522500V | |
| Packing | Code | T (Tape/Reel), P (Bag packing) | |
| Construction | Item | Description | |
| 1 | Ceramic dielectric | ||
| 2 | Inner electrode | ||
| 3 | Outer electrode | ||
| 4 | Nickle layer | ||
| 5 | Tin layer | ||
| Dimension (mm) | Part Number | L W T WB | British System / Metric System |
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | ||
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | ||
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 | ||
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 | ||
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 | ||
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | ||
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | ||
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | ||
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | ||
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | ||
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | ||
| Temperature | -55~+125 | ||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| Static Capacity | Meet standard specification and tolerance |
| |
| Dissipation Factor (DF) |
| See Note 1 | |
| IR Insulation Resistance |
| Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time :242 hours. | |
| Electrostatic Capacity Change Rate |
| ||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Tested under flexural status. | |
| Electro Static Capacity Change Rate (Flexural) | |C/C| 10% | Flexural depth: 452 | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock |
| Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | |
| Temperature Moisture Exposure |
| Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. | |
| High Temperature Exposure |
| Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage); 250VV1KV (1.5x rated voltage); 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature. | |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on photos. Sizes: 0805(2012) to 2220(5750) with specific A, B, C dimensions. | |
| Embossed Plastic Taping Dimensions (mm) | Code | Tape size A B C D E F G H J T | |
| 0805 | 1.550.20 2.350.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.50 Max | ||
| 1206 | 1.950.20 3.600.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.1 1.50 -0/+0.10 1.85 Max | ||
| 1210 | 2.700.10 3.420.10 8.000.10 3.500.05 1.750.10 4.000.10 2.000.05 4.000.10 1.55 -0/+0.10 3.2 Max | ||
| 1808 | 2.200.10 4.950.10 12.000.10 5.500.05 1.750.10 4.000.10 2.000.05 4.000.10 1.50 -0/+0.10 3.0 Max | ||
| 1812 | 3.660.10 4.950.10 12.000.10 5.500.05 1.750.10 8.000.10 2.000.05 4.000.10 1.55 -0/+0.10 4.0 Max | ||
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size W1 L1 D C B P1 P2 P0 d t | |
| 1005 | 0.240.02 0.450.02 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.30 Below | ||
| 0201 | 0.370.10 0.670.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below | ||
| 0402 | 0.650.10 1.150.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below | ||
| 0603 | 1.100.10 1.900.10 8.000.10 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | ||
| 0805 | 1.450.15 2.300.15 8.00.15 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | ||
| 1206 | 1.800.20 3.400.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | ||
| Reel Dimensions (mm) | Unit: mm | A B C D E F G | 7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max; 13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max |
| Top Tape Peeling Strength | Standard | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) |
| 0603 | 4000 | ||
| 0805 | 4000 | 3000 (T1.35mm) | |
| 1206 | 3000 (T>1.35mm) | ||
| 1210 | 2000 (T1.60mm) | ||
| 1808 | 3000 (T>1.60mm) | ||
| 1812 | 2000 (T1.85mm) | ||
| 1812 & above | 1000 (T>1.85mm) | ||
| 1005, 0201, 0402 | (Specific quantity not listed, refer to T/R packing) | (Specific quantity not listed, refer to T/R packing) | |
| Soldering Method | Size | Capacitance | Method |
| 1005 | NPO | / | R |
| X7R/X5R/X7S/X6S | / | R | |
| 0201 | NPO | / | R |
| X7R/X5R/X7S/X6S | / | R | |
| Y5V | / | R | |
| 0402 | NPO | / | R |
| X7R/X5R/X7S/X6S | / | R | |
| Y5V | / | R | |
| 0603 | NPO | / | R/W |
| X7R/X5R/X7S/X6S | C1uf | R | |
| C1uf | R/W | ||
| Y5V | C1uf | R | |
| C1uf | R/W | ||
| 0805 | NPO | / | R/W |
| X7R/X5R/X7S/X6S | C4.7uf | R | |
| C4.7uf | R/W | ||
| Y5V | C1uf | R | |
| C1uf | R/W | ||
| 1206 | NPO | / | R/W |
| X7R/X5R/X7S/X6S | C10uf | R | |
| C10uf | R/W | ||
| Y5V | C10uf | R | |
| C10uf | R/W | ||
| 1210 | NPO | / | R |
| X7R/X5R/X7S/X6S | / | R | |
| Y5V | / | R | |
| Soldering Profile | Refer to adjacent graph (enclosure page) | ||
| Soldering Temperature Difference | T150 | Keep temperature difference between soldering temperature and surface temperature of chips. | |
2509251626_AIDE-CAPACITOR-1812X7R222K302NT_C48579738.pdf
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