Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance and meeting stringent industry standards.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||
| Switch power supplier | |||||
| AC-DC power charger, DC-DC power charger | |||||
| Networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |||||
| Testing Condition | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | |||||
| Part Number Breakdown | 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | ||||
| 7. Packing | T Tape/Reel, P Bag packing(PE) | ||||
| Construction | 1. Ceramic dielectric | N/A | |||
| 2. Inner electrode | N/A | ||||
| 3. Outer electrode | N/A | ||||
| 4. Nickle layer | N/A | ||||
| 5. Tin layer | N/A | ||||
| Dimension (mm) | Part number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Range | -55~+125 | ||||
| Specification and Testing Method | Visual/Dimension | 1. No Damage, 2. Dimension meet Spec. Tested by naked eye and digital caliper. | |||
| Static Capacity | Meets standard specification and tolerance. NPO characteristic: 1MHz10% @ 1.00.2Vrms (1000pF), 1KHz10% @ 1.00.2Vrms (>1000pF). X7R/X7T/X7P characteristic: 1KHz10% @ 1.00.2Vrms (10uF), 120Hz24 @ 0.50.1Vrms (>10uF). | ||||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 1MHz10% @ 1V0.2rms. Cr1000pF, 1KHz10% @ 1V0.2rms. X7R/X7T/X7P characteristic: Cr10uF, 1KHz10% @ 1V0.1rms. Cr10uF, 120Hz24 @ 0.5V0.1rms. (See Note 1 for specific DF exceptions). | ||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | ||||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | ||||
| Solderability | Soldering area 90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455. Solder time 20.5s. | ||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||
| Electrostatic Capacity Change Rate | NPO Characteristic | C/C0.5% or 0.5pF (larger reading) | |||
| X7R | C/C15% | ||||
| X7T | -33% C/C22% | ||||
| X7P | C/C10% | ||||
| Environmental Testing | Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%. Flexural depth 452. | |||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||||
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading). X7R/X7P characteristic: C/C0.5%. X7T characteristic: C/C10%. Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | ||||
| Temperature Moisture Exposure | Visual: No visual damage. Test after placing 242 hours at normal temp & humidity. Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S (lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (lower reading). | ||||
| High Temperature Exposure | Visual: No visual damage. Test after placing 48 hours under normal pressure & temperature. Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (lower reading). | ||||
| Packing Details | Embossed Plastic Taping | For 0805(2012) to 1812(4532) types. Includes dimensions for tape size, reel dimensions, and leader/end part structure. Top tape peeling strength: 0.1N < peeling strength < 0.7N. | |||
| Paper Tape Reel Packing | For 1005(0402) to 1206(3216) types. Includes dimensions for paper size, reel dimensions, and leader/end part structure. | ||||
| Packing Quantity | Varies by size and tape type (e.g., 0603 Paper T/R: 4000 pcs, 0805 Plastic T/R: 3000 pcs). | ||||
| Soldering Method | Recommended methods include Reflow Soldering (R) and Wave Soldering (W), depending on size, temperature characteristic, rated voltage, and capacitance. | ||||
| Soldering Profile | Follow recommended temperature profiles to avoid cracks. Preheating temperature difference T150. | ||||
| Precautions for Use | MLCCs may fail under severe conditions. Follow safety precautions and application notes. Avoid sudden temperature changes during soldering. Handle soldering iron carefully during manual soldering. Ensure optimum solder amount for reflow soldering. | ||||
2509251626_AIDE-CAPACITOR-0603X5R106M350NT_C49326366.pdf
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