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Specifications
Voltage Rating:
35V
Capacitance:
2.2uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
0603X5R225K350NT
Model Number:
0603X5R225K350NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product line features advanced Multi-Layer Ceramic Capacitors (MLCCs) designed for high-voltage applications. They are suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. These MLCCs offer reliable performance under specified testing conditions and are available in various configurations and packaging options.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS/REACH compliant
- Packaging Options: Tape/Reel (T), Bag packing (P)
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | |||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For data not matching testing specification | |
| Initial Capacitance Testing | Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature | (For NO.3, 11, 12, 13) | |
| Part Number Description | Item 1: Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm) to 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| Item 2: Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| Item 3: Nominal Electrostatic Capacity | 8R0 (8.0pF), 100 (10pF), 101 (100pF) | ||
| Item 4: Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | ||
| Item 5: Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | ||
| Item 6: Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||
| Item 7: Packing | T (Tape/Reel), P (Bag packing) | ||
| Construction | Ceramic dielectric | ||
| Inner electrode | |||
| Outer electrode | |||
| Nickle layer | |||
| Tin layer | |||
| Dimensions (mm) | Part Number | L | W |
| 0201 (0603) | 0.600.10 | 0.300.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | |
| (Additional dimensions WB, T provided for some sizes in source) | |||
| Temperature Range | -55~+125 | ||
| Static Capacity | NPO Characteristic | 1000pF: 1MHz10%, 1.00.2Vrms 1000pF: 1KHz10%, 1.00.2Vrms | |
| X7R/X7T/X7P Characteristic | 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | ||
| Dissipation Factor (DF) | NPO Characteristic | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF: 110%MHz, 1V0.2rms Cr1000pF: 110%KHz, 1V0.2rms | |
| X7R/X7T/X7P Characteristic | Cr10uF: 110%KHz, 1V0.1rms Cr10uF: 12024Hz, 0.5V0.1rms | See Note 1 for exceptions | |
| Insulation Resistance (IR) | NPO Characteristic | IR50000M, C10nF IR*Cr500S, C10nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| X7R/X7T/X7P Characteristic | IR10000M, C25nF IR*Cr100S, C25nF | ||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | Visual-No damage |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual |
| Electrostatic Capacity Change Rate | NPO Characteristic | C/C0.5% or 0.5pF (larger reading) | |
| X7R | C/C15% | ||
| X7T | -33% C/C22% | ||
| X7P | C/C10% | ||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | Visual |
| Electro static capacity change rate | C/C10% | Test it under the flexural status. | |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO Characteristic | C/C2.5% or 0.25pF (larger reading) | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. |
| X7R/X7P characteristic | C/C0.5% | ||
| X7T characteristic | C/C10% | ||
| Temperature Moisture Exposure | Visual | No visual damage | Test it after place 242 hours normal temp & humidity. |
| Temperature | 402, Humidity 90~95%RH, time 50024 hours | ||
| Electrostatic capacitance change rate | NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10% | ||
| DF | 2 times initial standard | ||
| IR | NPO characteristic: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | ||
| High Temperature Exposure | Visual | No visual damage | Test it after place 48 hours under normal pressure & temperature. |
| Temperature | 1253, Time 100048 hours | ||
| Voltage | 100VV250V: 2x Rated voltage 250VV1KV: 1.5x rated voltage 1KVV: 1.2x rated voltage | ||
| Electrostatic capacitance change rate | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% | ||
| DF | 2 X initial standard | ||
| IR | NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | ||
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6 | IR |
| Embossed Plastic Taping Dimensions (mm) | Code | Tape size A | B |
| 0805 | 1.55 0.20 | 2.35 0.20 | |
| 1206 | 1.95 0.20 | 3.60 0.20 | |
| 1210 | 2.70 0.10 | 3.42 0.10 | |
| 1808 | 2.20 0.10 | 4.95 0.10 | |
| 1812 | 3.66 0.10 | 4.95 0.10 | |
| (Other dimensions A, B, C, D, E, F, G, H, J, T provided for various sizes in source) | |||
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size W1 | L1 |
| 1005 | 0.24 0.02 | 0.45 0.02 | |
| 0201 | 0.37 0.10 | 0.67 0.10 | |
| 0402 | 0.65 0.10 | 1.15 0.10 | |
| (Other dimensions D, C, B, P1, P2, P0, d, t provided for various sizes in source) | |||
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size A | B |
| 0603 | 1.10 0.10 | 1.90 0.10 | |
| 0805 | 1.45 0.15 | 2.30 0.15 | |
| 1206 | 1.80 0.20 | 3.40 0.20 | |
| (Other dimensions C, D, E, F, G, H, J, T provided for various sizes in source) | |||
| Reel Dimensions (mm) | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (Standard) | (a) Paper Taping, (b) Embossed Taping |
| Packing Quantity | Paper T/R (Pcs) | 0603: 4000, 0805: 4000, 1206: 4000 | (Note: Quantities vary by size and type, refer to source for complete list) |
| Plastic T/R (Pcs) | 0805: 3000, 1206 (T1.35mm): 3000, 1206 (T>1.35mm): 2000, 1210 (T1.60mm): 3000, 1210 (T>1.60mm): 2000, 1808: 1000, 1812 (T1.85mm): 1000, 1812 (T>1.85mm): 800, 1812: 500 | ||
| Soldering Profile | Refer to the graph in the enclosure page. Keep temperature difference between soldering temperature and surface temperature of chips as T150. | ||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering (Specific recommendations based on size, temperature characteristics, rated voltage, and capacitance provided in source document) | ||
2509251626_AIDE-CAPACITOR-0603X5R225K350NT_C49326370.pdf
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